Patents by Inventor Chung-Sheng Hsiung
Chung-Sheng Hsiung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8129762Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.Type: GrantFiled: December 31, 2008Date of Patent: March 6, 2012Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
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Publication number: 20090104547Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.Type: ApplicationFiled: December 31, 2008Publication date: April 23, 2009Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
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Patent number: 7507598Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.Type: GrantFiled: June 20, 2005Date of Patent: March 24, 2009Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
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Patent number: 7126099Abstract: An image sensor improving the uniformity of effective incident light. In one example, the size of microlenses disposed in different regions of the image sensor is changed to balance the brightness in different regions, in which the size of each microlens is a function of the distance between the microlens to the chip center In another example, the distance between the center of the microlens and the center of the corresponding sensing area is changed to balance the brightness in different regions and the corresponding color filters are shifted such that the microlens is overlying a corresponding color filter unit without overlying adjacent regions thereof, in which the distance between the center of the microlens and the center of the corresponding sensing area is a function of the distance between the corresponding sensing area to the chip center.Type: GrantFiled: August 26, 2003Date of Patent: October 24, 2006Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hung-Jen Hsu, Chiu-Kung Chang, Chung-Sheng Hsiung, Fu-Tien Wong
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Publication number: 20060019424Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.Type: ApplicationFiled: June 20, 2005Publication date: January 26, 2006Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
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Publication number: 20050045803Abstract: An image sensor improving the uniformity of effective incident light. In one example, the size of microlenses disposed in different regions of the image sensor is changed to balance the brightness in different regions, in which the size of each microlens is a function of the distance between the microlens to the chip center In another example, the distance between the center of the microlens and the center of the corresponding sensing area is changed to balance the brightness in different regions and the corresponding color filters are shifted such that the microlens is overlying a corresponding color filter unit without overlying adjacent regions thereof, in which the distance between the center of the microlens and the center of the corresponding sensing area is a function of the distance between the corresponding sensing area to the chip center.Type: ApplicationFiled: August 26, 2003Publication date: March 3, 2005Inventors: Hung-Jen Hsu, Chiu-Kung Chang, Chung-Sheng Hsiung, Fu-Tien Wong
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Patent number: 6849533Abstract: A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.Type: GrantFiled: January 29, 2003Date of Patent: February 1, 2005Assignee: Taiwan Semiconductor Manufacturing Co., LTDInventors: Chih-Kung Chang, Yu-Kung Hsiao, Sheng-Liang Pan, Fu-Tien Wong, Chin-Chen Kuo, Chung-Sheng Hsiung, Hung-Jen Hsu, Yi-Ming Dai, Po-Wen Lin, Te-Fu Tseng
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Publication number: 20040147105Abstract: A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.Type: ApplicationFiled: January 29, 2003Publication date: July 29, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Kung Chang, Yu-Kung Hsiao, Sheng-Liang Pan, Fu-Tien Wong, Chin-Chen Kuo, Chung-Sheng Hsiung, Hung-Jen Hsu, Yi-Ming Dai, Po-Wen Lin, Te-Fu Tseng
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Patent number: 6660641Abstract: Within a method for forming a planarizing layer within a microelectronic fabrication, there is employed formed upon a partially photoexposed planarizing layer formed of a partially photoexposed negative photoresist material a sacrificial layer. Within the method, when sequentially: (1) stripping from the partially photoexposed planarizing layer the sacrificial layer; and (2) developing the partially photoexposed planarizing layer to form a developed planarizing layer, the developed planarizing layer is formed with enhanced planarity and diminished thickness.Type: GrantFiled: July 5, 2002Date of Patent: December 9, 2003Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chin Chen Kuo, Sheng Liang Pan, Yu-Kung Hsiao, Chih-Kung Chang, Fu-Tien Wong, Chung Sheng Hsiung
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Patent number: 6590239Abstract: Within a method for forming a color filter image array optoelectronic microelectronic fabrication, and the color filter image array optoelectronic microelectronic fabrication formed employing the method, there is provided a substrate having formed therein a series of photo active regions. There is also formed over the substrate at least one color filter layer having formed therein a color filter region having a concave upper surface. There is also formed upon the at least one color filter layer and planarizing the at least one color filter region having the concave upper surface, a planarizing layer. The planarizing layer provides for enhanced resolution of the color filter image array optoelectronic microelectronic fabrication.Type: GrantFiled: July 30, 2001Date of Patent: July 8, 2003Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Sheng Hsiung, Kuo-Liang Lu, Yu-Kung Hsiao, Chih-Kung Chang, Fu-Tien Wong, Sung-Yung Yang, Chin-Chen Kuo
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Publication number: 20030020083Abstract: Within a method for forming a color filter image array optoelectronic microelectronic fabrication, and the color filter image array optoelectronic microelectronic fabrication formed employing the method, there is provided a substrate having formed therein a series of photo active regions. There is also formed over the substrate at least one color filter layer having formed therein a color filter region having a concave upper surface. There is also formed upon the at least one color filter layer and planarizing the at least one color filter region having the concave upper surface, a planarizing layer. The planarizing layer provides for enhanced resolution of the color filter image array optoelectronic microelectronic fabrication.Type: ApplicationFiled: July 30, 2001Publication date: January 30, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Sheng Hsiung, Kuo-Liang Lu, Yu-Kung Hsiao, Chih-Kung Chang, Fu-Tien Wong, Sung-Yung Yang, Chin-Chen Kuo
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Publication number: 20020063214Abstract: Within both a method for fabricating an optoelectronic microelectronic fabrication and the optoelectronic microelectronic fabrication fabricated in accord with the method for fabricating the optoelectronic microelectronic fabrication there is first provided a substrate having formed therein a minimum of one photoactive region which is sensitive to infrared radiation. There is also formed over the substrate and in registration with the minimum of one optically active region a minimum of one microlens layer. Similarly, there is also formed interposed between the substrate and the minimum of one microlens layer an infrared filter layer, wherein the infrared filter is not formed contacting the substrate. The method provides that the optoelectronic microelectronic fabrication is fabricated with enhanced optical sensitivity.Type: ApplicationFiled: November 29, 2000Publication date: May 30, 2002Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.Inventors: Yu-Kung Hsiao, Chih-Kung Chang, Fu-Tien Weng, Chung-Sheng Hsiung, Bii-Jung Chang, Kuo-Liang Lu