Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: An inductor module comprising: a first inductor, comprising a first inductor area; and a second inductor, comprising a second inductor area. A first overlapped area of the first inductor area and a second overlapped area of the second inductor area are overlapped. The second overlapped area comprises at least one first magnetic direction area and at least one second magnetic direction area. A ratio between a size of the first magnetic direction area and a size of the second magnetic direction area is a predetermined ratio such that a coupling effect between the first inductor and the second inductor is lower or equals to a predetermined value.

Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is disclosed, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals, arranged for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; a current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and a voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to at least the second bit.

Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is provided, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; at least one current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and at least one voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to the second bit.

Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is provided, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; at least one current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and at least one voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to the second bit.

Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is disclosed, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals, arranged for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; a current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and a voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to at least the second bit.

Abstract: A new method of forming a stacked tantalum nitride barrier layer to prevent copper diffusion is described. Semiconductor device structures are provided in and on a semiconductor substrate. The semiconductor device structures are covered with an insulating layer. A via is opened through the insulating layer to one of the underlying semiconductor device structures. A stacked mode tantalum nitride barrier layer is conformally deposited within the via. A layer of copper is deposited overlying the stacked mode tantalum nitride barrier layer to complete copper metallization in the fabrication of an integrated circuit device. The stacked mode tantalum nitride barrier layer has misaligned grain boundaries. This prevents diffusion of copper into the dielectric layer.