Patents by Inventor Chung-Shi Lin

Chung-Shi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170148558
    Abstract: An inductor module comprising: a first inductor, comprising a first inductor area; and a second inductor, comprising a second inductor area. A first overlapped area of the first inductor area and a second overlapped area of the second inductor area are overlapped. The second overlapped area comprises at least one first magnetic direction area and at least one second magnetic direction area. A ratio between a size of the first magnetic direction area and a size of the second magnetic direction area is a predetermined ratio such that a coupling effect between the first inductor and the second inductor is lower or equals to a predetermined value.
    Type: Application
    Filed: April 22, 2016
    Publication date: May 25, 2017
    Inventors: Huan-Sheng Chen, Yen-Ju Lu, Chung-Shi Lin, Chien-Hua Wu, Yan-Bin Luo
  • Patent number: 9590610
    Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is disclosed, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals, arranged for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; a current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and a voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to at least the second bit.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: March 7, 2017
    Assignee: MEDIATEK INC.
    Inventors: Yan-Bin Luo, Chien-Hua Wu, Chung-Shi Lin, Chih-Hsien Lin
  • Patent number: 9590595
    Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is provided, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; at least one current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and at least one voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to the second bit.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: March 7, 2017
    Assignee: MEDIATEK INC.
    Inventors: Yan-Bin Luo, Chien-Hua Wu, Chung-Shi Lin, Chih-Hsien Lin
  • Publication number: 20160204768
    Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is provided, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; at least one current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and at least one voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to the second bit.
    Type: Application
    Filed: August 12, 2015
    Publication date: July 14, 2016
    Inventors: Yan-Bin Luo, Chien-Hua Wu, Chung-Shi Lin, Chih-Hsien Lin
  • Publication number: 20160191037
    Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is disclosed, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals, arranged for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; a current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and a voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to at least the second bit.
    Type: Application
    Filed: August 11, 2015
    Publication date: June 30, 2016
    Inventors: Yan-Bin Luo, Chien-Hua Wu, Chung-Shi Lin, Chih-Hsien Lin
  • Patent number: 6140231
    Abstract: A new method of forming a stacked tantalum nitride barrier layer to prevent copper diffusion is described. Semiconductor device structures are provided in and on a semiconductor substrate. The semiconductor device structures are covered with an insulating layer. A via is opened through the insulating layer to one of the underlying semiconductor device structures. A stacked mode tantalum nitride barrier layer is conformally deposited within the via. A layer of copper is deposited overlying the stacked mode tantalum nitride barrier layer to complete copper metallization in the fabrication of an integrated circuit device. The stacked mode tantalum nitride barrier layer has misaligned grain boundaries. This prevents diffusion of copper into the dielectric layer.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: October 31, 2000
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chung-Shi Lin, Shau-Lin Shu, Chen-Hua Yu