Patents by Inventor Chung Shih Wu

Chung Shih Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of rigid and flexible composite printed circuit board
    Patent number: 8551812
    Abstract: In a manufacturing method of a printed circuit board, a rigid substrate having a rigid-board metal layer is provided, an open slot is formed on the rigid substrate, and a flexible substrate is installed in the open slot, and the flexible substrate and the rigid substrate are securely bonded, and an increased-layer circuit layer is formed after electric circuits are manufactured on the rigid-board and flexible-board metal layers, and stacked on the rigid substrate and on an adjacent block where the flexible substrate is coupled to the rigid substrate, and an electric circuit is manufactured, and the increased-layer circuit layer is provided for electrically connecting and conducting the rigid and flexible substrates to overcome the issue of alignment errors.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: October 8, 2013
    Assignee: Unitech Printed Circuit Board Corp.
    Inventors: Ming Yi Yeh, Jia Lin Liu, Chung Shih Wu
  • MANUFACTURING METHOD OF RIGID AND FLEXIBLE COMPOSITE PRINTED CIRCUIT BOARD
    Publication number: 20120187078
    Abstract: In a manufacturing method of a printed circuit board, a rigid substrate having a rigid-board metal layer is provided, an open slot is formed on the rigid substrate, and a flexible substrate is installed in the open slot, and the flexible substrate and the rigid substrate are securely bonded, and an increased-layer circuit layer is formed after electric circuits are manufactured on the rigid-board and flexible-board metal layers, and stacked on the rigid substrate and on an adjacent block where the flexible substrate is coupled to the rigid substrate, and an electric circuit is manufactured, and the increased-layer circuit layer is provided for electrically connecting and conducting the rigid and flexible substrates to overcome the issue of alignment errors.
    Type: Application
    Filed: January 18, 2012
    Publication date: July 26, 2012
    Inventors: Ming Yi YEH, Jia Lin Liu, Chung Shih Wu