Abstract: A curved full-array LED light panel, a curved backlight module including the curved full-array LED light panel, and a curved LCD including the backlight module are disclosed. The curved full-array LED light panel includes a flexible reflective sheet and a plurality of LED light bars wherein a plurality of LEDs are disposed. The plurality of LED light bars are attached to a sheet-rear side of the flexible reflective sheet alone a direction parallel to the height direction of the full-array LED light panel, and the plurality of LEDs disposed on the LED light bars are exposed from a plurality of openings of the flexible reflective sheet toward an LCD panel. Along a direction parallel to the width direction of the full-array LED light panel, the flexible reflective sheet is deformed to form a curved reflective surface. Each of the LED light bars further comprises a bar-shaped PCB, and a plurality of LED dimming-zone circuits are disposed on the bar-shaped PCB.

Abstract: A vacuum system for film lamination, including a vacuum chamber module, a film-pressing module, a substrate susceptor module and a hot-plate heating module, is disclosed, wherein the film-pressing module includes a film-pressing platen, and the substrate susceptor module includes a substrate susceptor supported by a spring-loaded mechanism. During a film-lamination process, the film-pressing platen is actuated to move downwards to attach a laminating film onto a substrate, and the substrate susceptor is actuated to move downwards and finally rest on the hot-plate heating module. Therefore an adhesive glue disposed between the laminating film and the substrate can be thermally cured. After completing the film-lamination process, the film-pressing platen is actuated upwards so that the substrate susceptor also is actuated to move upwards to its initial position by a restoring force exerted by the spring-loaded mechanism.

Abstract: A vacuum system for film lamination, including a vacuum chamber module, a film-pressing module, a substrate susceptor module and a hot-plate heating module, is disclosed, wherein the film-pressing module includes a film-pressing platen, and the substrate susceptor module includes a substrate susceptor supported by a spring-loaded mechanism. During a film-lamination process, the film-pressing platen is actuated to move downwards to attach a laminating film onto a substrate, and the substrate susceptor is actuated to move downwards and finally rest on the hot-plate heating module. Therefore an adhesive glue disposed between the laminating film and the substrate can be thermally cured. After completing the film-lamination process, the film-pressing platen is actuated upwards so that the substrate susceptor also is actuated to move upwards to its initial position by a restoring force exerted by the spring-loaded mechanism.

Abstract: A motion platform having decoupled two axes adopts four modularized pneumatic bellows configured in an orthogonal arrangement. The pneumatic bellows can be independently controlled to cause the motion platform to be operated in one rotational degree of freedom with a frontward-and-backward swinging or a leftward-and-rightward swinging; or the pneumatic bellows can be synchronously controlled to cause the motion platform operated in two rotational degrees of freedom without being interfered with each other. Thus, the motion platform of the present disclosure is characterized with advantages of simplified mechanism, fewer components, convenient maintenance and reduced cost.

Abstract: A motion platform having decoupled two axes adopts four modularized pneumatic bellows configured in an orthogonal arrangement. The pneumatic bellows can be independently controlled to cause the motion platform to be operated in one rotational degree of freedom with a frontward-and-backward swinging or a leftward-and-rightward swinging; or the pneumatic bellows can be synchronously controlled to cause the motion platform operated in two rotational degrees of freedom without being interfered with each other. Thus, the motion platform of the present disclosure is characterized with advantages of simplified mechanism, fewer components, convenient maintenance and reduced cost.