Patents by Inventor Chung-Sui Liu

Chung-Sui Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interface structure for copper-copper peeling integrity
    Patent number: 8592300
    Abstract: An integrated circuit device is disclosed. An exemplary integrated circuit device includes a first copper layer, a second copper layer, and an interface between the first and second copper layers. The interface includes a flat zone interface region and an intergrowth interface region, wherein the flat zone interface region is less than or equal to 50% of the interface.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: November 26, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Lin, Chung-Sui Liu, Chen-Hua Yu