Patents by Inventor Chung-Sung JANG

Chung-Sung JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chuck and semiconductor process using the same
    Patent number: 9111850
    Abstract: A semiconductor process is described in this application. The process includes the following steps: providing a semiconductor substrate; measuring a warpage level of the semiconductor substrate; and holding the semiconductor substrate by providing at least one vacuum suction according to the warpage level, so that the semiconductor substrate is subjected to a plurality of varied suction intensities. The semiconductor substrate is held on a chuck having a plurality of holes grouped into a plurality of groups, and the sizes of the holes within different groups are different, wherein the sizes of the holes increase from a center toward an edge of the chuck, and the holes are arranged in a spiral.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: August 18, 2015
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Chung-Sung Jang, Ming-Tse Lin, Yung-Chang Lin
  • CHUCK AND SEMICONDUCTOR PROCESS USING THE SAME
    Publication number: 20150200144
    Abstract: A semiconductor process is described in this application. The process includes the following steps: providing a semiconductor substrate; measuring a warpage level of the semiconductor substrate; and holding the semiconductor substrate by providing at least one vacuum suction according to the warpage level, so that the semiconductor substrate is subjected to a plurality of varied suction intensities. The semiconductor substrate is held on a chuck having a plurality of holes grouped into a plurality of groups, and the sizes of the holes within different groups are different, wherein the sizes of the holes increase from a center toward an edge of the chuck, and the holes are arranged in a spiral.
    Type: Application
    Filed: March 27, 2015
    Publication date: July 16, 2015
    Inventors: CHUNG-SUNG JANG, MING-TSE LIN, YUNG-CHANG LIN
  • Chuck and semiconductor process using the same
    Patent number: 9022392
    Abstract: An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: May 5, 2015
    Assignee: United Microelectronics Corporation
    Inventors: Chung-Sung Jang, Ming-Tse Lin, Yung-Chang Lin
  • CHUCK AND SEMICONDUCTOR PROCESS USING THE SAME
    Publication number: 20140065553
    Abstract: An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 6, 2014
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventors: Chung-Sung JANG, Ming-Tse LIN, Yung-Chang LIN