Patents by Inventor Chung T. Kwong

Chung T. Kwong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hyperconductive filled polymers
    Patent number: 4695404
    Abstract: This invention is directed to a polymeric composition comprising a polymeric binder and silver particles and having a volume electrical resistivity of 0.0001 ohm-cm or less.
    Type: Grant
    Filed: April 7, 1986
    Date of Patent: September 22, 1987
    Assignee: Amerasia International Technology, Inc.
    Inventor: Chung T. Kwong