Abstract: A heat dissipating device includes a fluid container made of a heat conductive material and having a heat-dissipating wall opposite to a heat-absorbing wall, and a surrounding wall cooperating with the heat-absorbing and heat-dissipating walls so as to confine a sealed vapor chamber. A heat exchanger member is disposed in the vapor chamber, is in heat-conductive contact with the heat-absorbing wall, and contains an amount of working fluid capable of changing into fluid vapor that fills the vapor chamber upon absorbing heat from the heat-absorbing wall. The fluid vapor is capable of changing into fluid condensate when cooled due to contact with the heat-dissipating wall. A heat-conductive cover plate is mounted spacedly on the heat-dissipating wall of the fluid container, and cooperates with the heat-dissipating wall so as to confine a heat-dissipating passage therebetween such that heat absorbed by the heat-dissipating wall is dissipated via the heat-dissipating passage.

Abstract: In a heat dissipating device, a heat-conducting unit is disposed in a housing and has a first heat-conducting member mounted on a circuit board inside the housing and contacting and in thermal communication with an electronic component mounted on the circuit board, and a second heat-conducting member that has a first end portion connected to the first heat-conducting member, and a second end portion opposite to the first end portion and extending outwardly of the housing through a through hole in the housing. A heat-dissipating fin module is mounted externally of the housing, and has a base plate connected to and in thermal communication with the second end portion of the second heat-conducting member, and a plurality of fin posts mounted fixedly and spacedly on and in thermal communication with the base plate.