Patents by Inventor Chung-Tsai Hung

Chung-Tsai Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and manufacturing method thereof
    Patent number: 11990510
    Abstract: A semiconductor device, includes a channel region, and a source/drain region adjacent to the channel region. The source/drain region includes a first epitaxial layer, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer, and the first epitaxial layer is made of SiAs.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Yi Peng, Ting Tsai, Chung-Wei Hung, Jung-Ting Chen, Ying-Hua Lai, Song-Bor Lee, Bor-Zen Tien
  • Heat pipe type circular radiator with sector cooling fins
    Patent number: 7011147
    Abstract: A heat pipe type circular radiator includes a plurality of sector cooling fins and a heat pipe. Each of the sector cooling fins has a main fin member with a through hole and has a big sector folded side and a small sector folded side at two lateral sides of the main fin member, respectively. The heat pipe passes through the sector cooling fins via the through hole respectively. Because the folded sides are designed has a shape of sector, the heat pipe with the cooling fins can be bent circularly and attached with a cooling base to form the circular radiator.
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: March 14, 2006
    Inventor: Chung-Tsai Hung