Patents by Inventor Chung Wai Ku

Chung Wai Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for transporting substrates for bonding
    Patent number: 8336757
    Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: December 25, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Man Chung Ng, Wing Fai Lam, Chung Wai Ku
  • APPARATUS FOR TRANSPORTING SUBSTRATES FOR BONDING
    Publication number: 20120168489
    Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.
    Type: Application
    Filed: January 4, 2011
    Publication date: July 5, 2012
    Inventors: Man Chung NG, Wing Fai LAM, Chung Wai KU