Patents by Inventor Chung Wang
Chung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7994032Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a substrate having a front surface and a back surface; a plurality of sensor elements formed on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and an aluminum doped feature formed in the substrate and disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.Type: GrantFiled: July 28, 2010Date of Patent: August 9, 2011Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shang-Yi Chiang, Chung Wang, Shou-Gwo Wuu, Dun-Nian Yaung
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Patent number: 7930051Abstract: A method and system for allowing a vehicle dealer and manufacturer to match dealer orders and manufacturing plant shipments easily and equitably are disclosed. The method significantly decreases processing time, saving valuable time, money, and manpower resources. An automated linear expression calculation for determining and balancing vehicle allocation allows for equitable balancing of manufacturing plant orders and efficient optimization. The linear expression calculation may be performed in an iterative series of steps. The linear expression calculation handles a plurality of attribute features, thereby accommodating a plurality of dealer requests and vehicle options. The linear expression calculation creates a matrix representing the plurality of attribute features, and with each iteration the values within the matrix are refined and optimized, with the resulting matrix representing an optimized and balanced allocation of manufacturing plant production orders among a plurality of manufacturing plants.Type: GrantFiled: April 23, 2008Date of Patent: April 19, 2011Assignee: Honda Motor Co., Ltd.Inventors: David B. Adair, James V. Burrell, Charles Chao, Mohan K. Gupta, Melissa Hirota, Patrick Jaillet, Lalit Jain, John Kealoha, III, Ryan K. Kita, Quang N. Mai, Dirk Niemeyer, Nirod Samal, Chung Wang, Flora F. Wang, Andrea L. Whobrey
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Publication number: 20100289102Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a substrate having a front surface and a back surface; a plurality of sensor elements formed on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and an aluminum doped feature formed in the substrate and disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.Type: ApplicationFiled: July 28, 2010Publication date: November 18, 2010Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shang-Yi CHIANG, Chung WANG, Shou-Gwo WUU, Dun-Nian YAUNG
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Patent number: 7791170Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a substrate having a front surface and a back surface; a plurality of sensor elements formed on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and an aluminum doped feature formed in the substrate and disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.Type: GrantFiled: July 10, 2006Date of Patent: September 7, 2010Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shang-Yi Chiang, Chung Wang, Shou-Gwo Wuu, Dun-Nian Yaung
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Publication number: 20080319820Abstract: A method and system for allowing a vehicle dealer and manufacturer to match dealer orders and manufacturing plant shipments easily and equitably are disclosed. The method significantly decreases processing time, saving valuable time, money, and manpower resources. An automated linear expression calculation for determining and balancing vehicle allocation allows for equitable balancing of manufacturing plant orders and efficient optimization. The linear expression calculation may be performed in an iterative series of steps. The linear expression calculation handles a plurality of attribute features, thereby accommodating a plurality of dealer requests and vehicle options. The linear expression calculation creates a matrix representing the plurality of attribute features, and with each iteration the values within the matrix are refined and optimized, with the resulting matrix representing an optimized and balanced allocation of manufacturing plant production orders among a plurality of manufacturing plants.Type: ApplicationFiled: April 23, 2008Publication date: December 25, 2008Applicant: HONDA MOTOR CO., LTD.Inventors: David B. Adair, James V. Burrell, Charles Chao, Mohan K. Gupta, Melissa Hirota, Patrick Jaillet, Lalit Jain, John Kealoha, III, Ryan K. Kita, Quang N. Mai, Dirk Niemeyer, Nirod N. Samal, Chung Wang, Flora F. Wang, Andrea L. Whobrey
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Patent number: 7376477Abstract: A method and system for allowing a vehicle dealer and manufacturer to match dealer orders and manufacturing plant shipments easily and equitably are disclosed. The method significantly decreases processing time, saving valuable time, money, and manpower resources. An automated linear expression calculation for determining and balancing vehicle allocation allows for equitable balancing of manufacturing plant orders and efficient optimization. The linear expression calculation may be performed in an iterative series of steps. The linear expression calculation handles a plurality of attribute features, thereby accommodating a plurality of dealer requests and vehicle options. The linear expression calculation creates a matrix representing the plurality of attribute features, and with each iteration the values within the matrix are refined and optimized, with the resulting matrix representing an optimized and balanced allocation of manufacturing plant production orders among a plurality of manufacturing plants.Type: GrantFiled: December 20, 2001Date of Patent: May 20, 2008Assignee: Honda Motor Co., Ltd.Inventors: Dave B. Adair, James V. Burrell, Charles Chao, Mohan K. Gupta, Melissa Hirota, Patrick Jaillet, Lalit Jain, John Kealoha, III, Ryan K. Kita, Quang N. Mai, Dirk Niemeyer, Nirod N. Samal, Chung Wang, Flora F. Wang, Andrea L. Whobrey
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Publication number: 20080014673Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a substrate having a front surface and a back surface; a plurality of sensor elements formed on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and an aluminum doped feature formed in the substrate and disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.Type: ApplicationFiled: July 10, 2006Publication date: January 17, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shang-Yi CHIANG, Chung WANG, Shou-Gwo WUU, Dun-Nian YAUNG
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Publication number: 20070238283Abstract: An under bump metallurgy (UBM) structure formed over a bond pad and for use in conjunction with a solder ball, provides an upper copper layer over a subjacent composite film that includes a nickel film over a further copper film over a titanium film. One or more reflow operations are used to form a molten solder ball and conditions are selected to ensure that all of the copper from the upper copper layer is dissolved within the molten solder. For SnAg leadfree solder, this leads to the formation of SnAgCu-like leadfree solder. The resulting interface between the solder ball and the nickel layer includes regularly spaced Cu6Sn5 nodules as intermetallics but is free of Ni3Sn4 which can spall into the molten solder causing reliability problems.Type: ApplicationFiled: April 5, 2006Publication date: October 11, 2007Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Chiang Chen, Chender Huang, Pei-Haw Tsao, Chung Wang, Wen Huang
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Patent number: 7179487Abstract: A stimuli-responsive, hybrid hydrogel wherein the bulk of the polymer is made up of relatively inexpensive water soluble polymer strands crosslinked by protein domains. The responsiveness of the gel is controlled or modulated by the protein component. The physical and biological properties of the hydrogel are determined by specifically designed or engineered protein domains. The crosslinking of the protein domains to the water soluble polymers is by means of non-covalent bonding such as chelation or coordination bonding, biotin-avidin bonding, protein—protein interaction and protein-ligand interaction, or by means of covalent bonding. Methods of making and using the polymer-protein hydrogels are disclosed in this application.Type: GrantFiled: June 18, 1999Date of Patent: February 20, 2007Assignee: University of Utah Research FoundationInventors: Jindrich Kopecek, Russell Stewart, Karin Caldwell, Chung Wang, Chih-Hu Ho
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Publication number: 20060220244Abstract: A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantially lead-free or high-lead-containing; the bump has a first interface with the first conductive pad, the first interface having a first linear dimension; the bump has a second interface with the second conductive pad, the second interface having a second linear dimension; and wherein the ratio of the first linear dimension and the second linear dimension is between about 0.7 and about 1.7.Type: ApplicationFiled: March 17, 2005Publication date: October 5, 2006Inventors: Szu Lu, Hsin-Hui Lee, Chung Wang, Mirng-Ji Lii
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Publication number: 20060063365Abstract: A method of manufacturing a semiconductor device and structure thereof. The method includes providing a workpiece, the workpiece having at least one conductive pad partially exposed through an opening in a passivation layer, the passivation layer having a top surface and the opening in the passivation layer having sidewalls. A barrier layer is formed over the at least one conductive pad, wherein the barrier layer lines the sidewalls of the opening in the passivation layer and is disposed over a top portion of the passivation layer proximate the opening. A conductive cap is formed over the barrier layer within the opening in the passivation layer, and the conductive cap is recessed to a height below the top surface of the passivation layer. The conductive cap may be used for testing with a probe or may be used for wire-bonding.Type: ApplicationFiled: September 23, 2004Publication date: March 23, 2006Inventors: Chung Wang, Chien-Hsiun Lee
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Publication number: 20060034029Abstract: This invention discloses a current detector formed on a multiple-layered structure with a resistor supported thereon. The multiple-layered structure further includes a heat dissipation layer for dissipating heat generated from the resistor. In a preferred embodiment, the current detector further includes conductive blocks formed by a microelectronic casting process for functioning as part of electrodes for the current detector. In another preferred embodiment, the current detector further includes wrapping around electrodes each with a side conductive surface wrapping around a side surface of the multiple-layered structure.Type: ApplicationFiled: August 15, 2005Publication date: February 16, 2006Inventor: Chung Wang
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Publication number: 20030028276Abstract: A method and system for allowing a vehicle dealer and manufacturer to match dealer orders and manufacturing plant shipments easily and equitably are disclosed. The method significantly decreases processing time, saving valuable time, money, and manpower resources. An automated linear expression calculation for determining and balancing vehicle allocation allows for equitable balancing of manufacturing plant orders and efficient optimization. The linear expression calculation may be performed in an iterative series of steps. The linear expression calculation handles a plurality of attribute features, thereby accommodating a plurality of dealer requests and vehicle options. The linear expression calculation creates a matrix representing the plurality of attribute features, and with each iteration the values within the matrix are refined and optimized, with the resulting matrix representing an optimized and balanced allocation of manufacturing plant production orders among a plurality of manufacturing plants.Type: ApplicationFiled: December 20, 2001Publication date: February 6, 2003Inventors: David B. Adair, James V. Burrell, Charles Chao, Mohan K. Gupta, Melissa Hirota, Patrick Jaillet, Lalit Jain, John Kealoha, Ryan K. Kita, Quang N. Mai, Dirk Niemeyer, Nirod N. Samal, Chung Wang, Flora F. Wang, Andrea L. Whobrey
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Patent number: 5869571Abstract: An emulsion of a copolymer of carbon monoxide with an olefinically unsaturated compound dispersed in an aqueous diluent; a curable resin composition in the form of an oil-in-water emulsion comprising a copolymer of carbon monoxide with an olefinically unsaturated compound and a curing agent; and a polymer which is produced by grafting a polymer comprising poly(ethene oxide) moiety in its molecular structure onto a copolymer of carbon monoxide with an olefinically compound.Type: GrantFiled: April 21, 1998Date of Patent: February 9, 1999Assignee: Shell Oil CompanyInventors: Evert van der Heide, Gerrit Vietje, Chung Wang
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Patent number: 5859125Abstract: An emulsion of a copolymer of carbon monoxide with an olefinically unsaturated compound dispersed in an aqueous diluent; a curable resin composition in the form of an oil-in-water emulsion comprising a copolymer of carbon monoxide with an olefinically unsaturated compound and a curing agent; and a process for producing a laminated wood composite comprising applying said curable resin composition onto wood parts of the composite, bringing the wood parts of the composite together such that curable resin composition is positioned between adjacent wood parts, and curing the curable resin such that after curing cured resin adheres adjacent wood parts to one another.Type: GrantFiled: July 9, 1997Date of Patent: January 12, 1999Assignee: Shell Oil CompanyInventors: Evert van der Heide, Gerrit Vietje, Chung Wang