Patents by Inventor Chung-Wei FU

Chung-Wei FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENERGY-SAVING ASSEMBLY FOR INDIRECT HEATING SYSTEMS
    Publication number: 20250172290
    Abstract: An energy-saving assembly for indirect heating systems includes a plurality of porous elements. Each porous element has a porous carrier which has multiple holes that go through the carrier. The porous carriers are arranged parallel to the axis of a radiant tube of the indirect heating system at a distance or adjacent and disposed of inside the radiant tube. The outer periphery of each porous element is at least partly adjacent to the inner wall of the radiant tube.
    Type: Application
    Filed: December 14, 2023
    Publication date: May 29, 2025
    Inventors: Yi-Hsing Lin, Chung-Wei Fu, Yu-Lun Lai, Cheng-Hsien Shen
  • Soundproof member
    Patent number: 11580947
    Abstract: A soundproof member is provided. The soundproof member includes a structural element, and a first composite film which is disposed on the bottom surface of the structural element. The structural member includes at least one through hole and the through hole passes through the structural element. The first composite film includes a polymer material and an inorganic nanoscale material, wherein the inorganic nanoscale material is a one-dimensional inorganic nanoscale material or a two-dimensional inorganic nanoscale material.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: February 14, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lun Lai, Chih-Han Hsu, Chung-Wei Fu, Ren-Ting Huang
  • SOUNDPROOF MEMBER
    Publication number: 20210174779
    Abstract: A soundproof member is provided. The soundproof member includes a structural element, and a first composite film which is disposed on the bottom surface of the structural element. The structural member includes at least one through hole and the through hole passes through the structural element. The first composite film includes a polymer material and an inorganic nanoscale material, wherein the inorganic nanoscale material is a one-dimensional inorganic nanoscale material or a two-dimensional inorganic nanoscale material.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 10, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Lun LAI, Chih-Han HSU, Chung-Wei FU, Ren-Ting HUANG