Abstract: A method of generating masks for printing a pattern including a plurality of features having varying critical dimensions. The method includes the steps of: (1) obtaining data representing the pattern; (2) defining a plurality of distinct zones based on the critical dimensions of the plurality of features; (3) categorizing each of the features into one of the plurality of distinct zones; and (4) modifying the mask pattern for each feature categorized into a predefined distinct zone of the plurality of distinct zones.

Abstract: A method of generating masks for printing a pattern including a plurality of features having varying critical dimensions. The method includes the steps of: (1) obtaining data representing the pattern; (2) defining a plurality of distinct zones based on the critical dimensions of the plurality of features; (3) categorizing each of the features into one of the plurality of distinct zones; and (4) modifying the mask pattern for each feature categorized into a predefined distinct zone of the plurality of distinct zones.

Abstract: A method of generating masks for printing a pattern including a plurality of features having varying critical dimensions. The method includes the steps of: (1) obtaining data representing the pattern; (2) defining a plurality of distinct zones based on the critical dimensions of the plurality of features; (3) categorizing each of the features into one of the plurality of distinct zones; and (4) modifying the mask pattern for each feature categorized into a predefined distinct zone of the plurality of distinct zones.

Abstract: A method of generating masks for printing a pattern including a plurality of features having varying critical dimensions. The method includes the steps of: (1) obtaining data representing the pattern; (2) defining a plurality of distinct zones based on the critical dimensions of the plurality of features; (3) categorizing each of the features into one of the plurality of distinct zones; and (4) modifying the mask pattern for each feature categorized into a predefined distinct zone of the plurality of distinct zones.

Abstract: The present invention discloses a method of optical correction for improving the pattern shrinkage caused by scattering of the light during photolithography processes, wherein the patterns on photomasks are corrected by providing aid patterns. Therefore, serifs or hammerheads are not necessary, and the costs can be decreased. According to the present invention, a chrome aid block is provided between the edges of the patterns. It is noted that the size of the chrome aid block is between ⅓ to ½ the wavelength of light used during exposure. Therefore, the pattern shrinkage caused by scattering of the light during exposure can be reduced, and there is no additional block formed on the photoresist layer. In addition, the standing wave effect can be prevented; thus, the pattern transfer is more accurate.

Abstract: This invention discloses an overlay measuring mark and a method of measuring an overlay error of semiconductor used by the overlay measuring mark. This overlay measuring mark comprises a first mark formed on a first layer on a semiconductor substrate and including four bar sets, which form a first square pattern, each of said bar sets at least comprising two parallel bars relatively formed by a first slim pattern; and a second mark formed on a second layer on said first layer and including four bar formed a second square pattern, wherein said four bar relatively are formed by a second slim pattern and said second square is located in and smaller than said first square in a top view.