Patents by Inventor Chung-Wei Hsueh

Chung-Wei Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor device and device manufactured using the same
    Patent number: 9230912
    Abstract: A method for manufacturing a semiconductor device and a device manufactured using the same are provided. According to the embodiment, substrate with a dielectric layer formed thereon is provided. Plural trenches are defined in the dielectric layer, and the trenches are isolated by the dielectric layer. A first barrier layer is formed in the trenches as barrier liners of the trenches, followed by filling the trenches with a conductor. Then, the conductor in the trenches is partially removed to form a plurality of recesses, wherein remained conductor has a flat surface. Next, a second barrier layer is formed in the recesses as barrier caps of the trenches.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: January 5, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Kuo Hsu, Li-Chieh Hsu, Hsiang-Hao Chen, Chung-Wei Hsueh
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND DEVICE MANUFACTURED USING THE SAME
    Publication number: 20150333000
    Abstract: A method for manufacturing a semiconductor device and a device manufactured using the same are provided. According to the embodiment, substrate with a dielectric layer formed thereon is provided. Plural trenches are defined in the dielectric layer, and the trenches are isolated by the dielectric layer. A first barrier layer is formed in the trenches as barrier liners of the trenches, followed by filling the trenches with a conductor. Then, the conductor in the trenches is partially removed to form a plurality of recesses, wherein remained conductor has a flat surface. Next, a second barrier layer is formed in the recesses as barrier caps of the trenches.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 19, 2015
    Inventors: Hsin-Kuo Hsu, Li-Chieh Hsu, Hsiang-Hao Chen, Chung-Wei Hsueh