Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.

Abstract: A method for forming a semiconductor device structure includes forming nanostructures in a first region and a second region over a substrate. The method also includes forming a gate dielectric layer surrounding the nanostructures. The method also includes forming dummy structures between the nanostructures. The method also includes forming a dielectric layer over the nanostructures. The method also includes forming a dielectric structure between the nanostructures in the first region and nanostructures in the second region. The method also includes removing the dummy structures in the first region. The method also includes depositing a first work function layer over the nanostructures. The method also includes removing the first work function layer and the dummy structures in the second region. The method also includes depositing a second work function layer over the nanostructures.

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

Abstract: A structure includes first nanostructures vertically spaced one from another over a substrate in a core region of the semiconductor structure, a first interfacial layer wrapping around each of the first nanostructures, a first high-k dielectric layer over the first interfacial layer and wrapping around each of the first nanostructures, second nanostructures vertically spaced one from another over the substrate in an I/O region of the semiconductor structure, a second interfacial layer wrapping around each of the second nanostructures, a second high-k dielectric layer over the second interfacial layer and wrapping around each of the second nanostructures. The first nanostructures have a first vertical pitch, the second nanostructures have a second vertical pitch substantially equal to the first vertical pitch, the first nanostructures have a first vertical spacing, the second nanostructures have a second vertical spacing greater than the first vertical spacing by about 4 ? to about 20 ?.

Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.

Abstract: An optical structure film and a light source module are provided. The optical structure film includes multiple optical unit microstructures. Each of the optical unit microstructures has four side surfaces and an inwardly concave beam splitting surface. The beam splitting surface is respectively connected to the side surfaces, and the beam splitting surface has four endpoints when viewed from a front viewing angle. Connection lines of the four endpoints form a rectangle. The beam splitting surface includes at least one beam splitting curved surface. A junction of the at least one beam splitting curved surface and one of the four side surfaces is a first line segment. A projection of a midpoint of an edge of the rectangle on the beam splitting surface overlaps with a relative extreme point of the first line segment.

Abstract: A placement method for integrated circuit design is provided. Each net is considered as a soft module. The net will receive a larger penalty if it covers more routing congested regions. Therefore, it is easier to move the nets away from routing congested regions. In addition, to relieve local congestion, a novel inflation method is proposed to expand the area of a cluster according to its internal connectivity intensity and routing congestion occupied by the cluster. Accordingly, it can get better routability and wirelength.

Abstract: A backlight module including a circuit substrate, a plurality of light-emitting devices, a first cholesteric liquid-crystal layer, and a second cholesteric liquid-crystal layer is provided. The light-emitting devices are disposed on the circuit substrate and electrically connected to the circuit substrate. The first cholesteric liquid-crystal layer is disposed on the light-emitting devices and overlapped with a light-emitting surface of each of the light-emitting devices. The second cholesteric liquid-crystal layer is disposed on the first cholesteric liquid-crystal layer and overlapped with the first cholesteric liquid-crystal layer. The first cholesteric liquid-crystal layer and the second cholesteric liquid-crystal layer respectively have a first chiral direction and a second chiral direction. A display apparatus adopting the backlight module is also provided.

Abstract: A light source module includes a substrate, a light-emitting element, an optical adhesive layer and a reflective structure. The light-emitting element is disposed on the substrate. The optical adhesive layer is disposed on the substrate and covers the light-emitting element. The reflective structure is disposed in the optical adhesive layer and located above the light-emitting element. A display device using the aforementioned light source module is also provided. The light source module provided by the invention has the function of protecting the light-emitting element and improves the problem of the large thickness of the direct-type backlight module in prior art.

Abstract: An optical structure film and a light source module are provided. The optical structure film includes multiple optical unit microstructures. Each of the optical unit microstructures has four side surfaces and an inwardly concave beam splitting surface. The beam splitting surface is respectively connected to the side surfaces, and the beam splitting surface has four endpoints when viewed from a front viewing angle. Connection lines of the four endpoints form a rectangle. The beam splitting surface includes at least one beam splitting curved surface. A junction of the at least one beam splitting curved surface and one of the four side surfaces is a first line segment. A projection of a midpoint of an edge of the rectangle on the beam splitting surface overlaps with a relative extreme point of the first line segment.

Abstract: A light source module includes at least one light-emitting element, a first optical layer, a penetrating light selection layer, a second optical layer, a light splitting layer, and a wavelength conversion layer. The light-emitting element is configured to provide a beam with a wavelength falling within a first wavelength band. An exit angle at which the beam exits the first optical layer is greater than an incident angle at which the beam is incident to the first optical layer. The penetrating light selection layer may allow light with a wavelength falls within a second wavelength band to pass through and has corresponding transmittance for light with a wavelength falling within the first wavelength band and is incident at different incident angles. An exit angle at which the beam exits the second optical layer is less than an incident angle at which the beam is incident to the second optical layer.

Abstract: A backlight module including a circuit substrate, a plurality of light-emitting devices, a first cholesteric liquid-crystal layer, and a second cholesteric liquid-crystal layer is provided. The light-emitting devices are disposed on the circuit substrate and electrically connected to the circuit substrate. The first cholesteric liquid-crystal layer is disposed on the light-emitting devices and overlapped with a light-emitting surface of each of the light-emitting devices. The second cholesteric liquid-crystal layer is disposed on the first cholesteric liquid-crystal layer and overlapped with the first cholesteric liquid-crystal layer. The first cholesteric liquid-crystal layer and the second cholesteric liquid-crystal layer respectively have a first chiral direction and a second chiral direction. A display apparatus adopting the backlight module is also provided.

Abstract: A placement method for integrated circuit design is provided. Each net is considered as a soft module. The net will receive a larger penalty if it covers more routing congested regions. Therefore, it is easier to move the nets away from routing congested regions. In addition, to relieve local congestion, a novel inflation method is proposed to expand the area of a cluster according to its internal connectivity intensity and routing congestion occupied by the cluster. Accordingly, it can get better routability and wirelength.

Abstract: The present application discloses a testing system for integrated circuit device, and signal source and power supplying apparatus. The signal source provides a plurality of supply voltages and a programmable voltage to a plurality of semiconductor chip groups. The signal source includes a power supplying apparatus and a switch set. The power supplying apparatus is configured to generate an additional voltage, a plurality of base voltages, and the programmable voltage. The switch set is disposed between the power supplying apparatus and the plurality of semiconductor chip groups and converts the additional voltage and the plurality of base voltages into the plurality of supply voltages.

Abstract: A sensorless motor rotor angle correction method includes: outputting a direct-axis pulse voltage to generate a direct-axis current and a quadrature-axis current; determining whether an angle difference is zero; outputting a positive direct-axis excitation voltage when the angle difference is zero, and recording an excitation time required to reach a predetermined positive current value; outputting a negative direct-axis excitation voltage, so that the direct-axis current returns to an initial current value; outputting a negative direct-axis excitation voltage for the excitation time to obtain a maximum negative current value; outputting a positive excitation voltage, so that the direct-axis current returns to the initial current value; correcting an orientation of a synchronous rotation coordinate axis if the maximum negative current value is greater than the predetermined positive current value.

Abstract: A light source module includes at least one light-emitting element, a first optical layer, a penetrating light selection layer, a second optical layer, a light splitting layer, and a wavelength conversion layer. The light-emitting element is configured to provide a beam with a wavelength falling within a first wavelength band. An exit angle at which the beam exits the first optical layer is greater than an incident angle at which the beam is incident to the first optical layer. The penetrating light selection layer may allow light with a wavelength falls within a second wavelength band to pass through and has corresponding transmittance for light with a wavelength falling within the first wavelength band and is incident at different incident angles. An exit angle at which the beam exits the second optical layer is less than an incident angle at which the beam is incident to the second optical layer.

Abstract: A method of monitoring a chemical mechanical polishing (CMP) apparatus including an arm configured to swing a polishing component includes performing a CMP process; learning at least two positions of the polishing component during a normal swing motion of the polish component by an optical acceptor and a processing unit to determine a plurality of expected positions of the polish component; analyzing at least one real position of the polishing component at predetermined time points during the CMP process by the optical acceptor and the processing unit; inspecting whether an abnormal event occurs based on the analyzed real position of the polishing component and the expected positions by the processing unit during the CMP process; and determining whether to send an alarm and stop the CMP process based on the inspecting result.

Abstract: A light source module includes a substrate, a light-emitting element, an optical adhesive layer and a reflective structure. The light-emitting element is disposed on the substrate. The optical adhesive layer is disposed on the substrate and covers the light-emitting element. The reflective structure is disposed in the optical adhesive layer and located above the light-emitting element. A display device using the aforementioned light source module is also provided. The light source module provided by the invention has the function of protecting the light-emitting element and improves the problem of the large thickness of the direct-type backlight module in prior art.

Abstract: A gate driving circuit applied to motor inverter includes first power switch circuit, first and second bootstrap fast charging circuits, and first, second and third capacitors. The first power switch circuit includes first and second power switches. The first bootstrap fast charging circuit is electrically connected to the first power switch. The second bootstrap fast charging circuit is electrically connected to the second power switch. The first capacitor is electrically connected to the first power switch. The second capacitor is electrically connected to the first bootstrap fast charging circuit and first insulated switch. The third capacitor is electrically connected to the second bootstrap fast charging circuit and second insulated switch. When the first power switch is disabled and the second power switch is enabled, an independent power supply enables the second bootstrap fast charging circuit to charge the third capacitor to enable the second insulated switch.

Abstract: A gate driving circuit applied to motor inverter includes first power switch circuit, first and second bootstrap fast charging circuits, and first, second and third capacitors. The first power switch circuit includes first and second power switches. The first bootstrap fast charging circuit is electrically connected to the first power switch. The second bootstrap fast charging circuit is electrically connected to the second power switch. The first capacitor is electrically connected to the first power switch. The second capacitor is electrically connected to the first bootstrap fast charging circuit and first insulated switch. The third capacitor is electrically connected to the second bootstrap fast charging circuit and second insulated switch. When the first power switch is disabled and the second power switch is enabled, an independent power supply enables the second bootstrap fast charging circuit to charge the third capacitor to enable the second insulated switch.