Patents by Inventor Chung-Wei Lin

Chung-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11128227
    Abstract: A secondary controller applied to a secondary side of a power converter includes a control signal generation circuit. The control signal generation circuit is coupled to an output terminal of the secondary side of the power converter for detecting an output voltage of the secondary side and enabling a pulse signal to a signal source of the secondary side of the power converter, wherein the signal source enables a turning-on signal according to the pulse signal. The turning-on signal is coupled to a primary-side auxiliary winding of the power converter through a secondary-side auxiliary winding of the power converter to make the primary-side auxiliary winding generate a voltage, and a primary controller of a primary side of the power converter makes the primary side of the power converter be turned on according to the voltage.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: September 21, 2021
    Assignee: Leadtrend Technology Corp.
    Inventors: Hung-Ching Lee, Chung-Wei Lin, Tsung-Chien Wu, Bo-Yi Wu
  • Publication number: 20210287966
    Abstract: A semiconductor package includes a substrate. The semiconductor package further includes a plurality of metal pillars on a top surface of the substrate. The semiconductor package further includes a semiconductor component on the substrate, wherein the semiconductor component includes one or more dies, and the semiconductor component has a top surface. The semiconductor package further includes a mold compound encapsulating the plurality of metal pillars and the semiconductor component, wherein the mold compound has a top surface above the top surface of the semiconductor component. The semiconductor package further includes an interposer coupled to the plurality of metal pillars.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 16, 2021
    Inventors: Hui-Min HUANG, Chen-Shien CHEN, Chung-Shi LIU, Chih-Wei LIN, Ming-Da CHENG, Shou-Cheng HU
  • Publication number: 20210286214
    Abstract: A backlight module including a light guide plate, a light source, an optical film, a diffusion sheet, a first prism sheet and a second prism sheet is provided. The light guide plate has a light incident surface and a light emitting surface connected to each other. The light source is disposed on a side of the light incident surface. The optical film is overlapped with the light emitting surface and has a plurality of optical microstructures facing the light emitting surface. The diffusion sheet is disposed between the light guide plate and the optical film. The first prism sheet and the second prism sheet are overlapped with the optical film and are positioned on a side of the optical film being far away from the light guide plate. A display apparatus adopting the backlight module is also provided.
    Type: Application
    Filed: June 2, 2021
    Publication date: September 16, 2021
    Applicant: Coretronic Corporation
    Inventors: Ping-Yeng Chen, Chung-Yang Fang, Jen-Wei Yu, Yang-Ching Lin, Yu-Fan Chen
  • Patent number: 11121104
    Abstract: A conductive interconnect structure includes a contact pad; a conductive body connected to the contact pad at a first end; and a conductive layer positioned on a second end of the conductive body. The conductive body has a longitudinal direction perpendicular to a surface of the contact pad. The conductive body has an average grain size (a) on a cross sectional plane (Plane A) whose normal is perpendicular to the longitudinal direction of the conductive body. The conductive layer has an average grain size (b) on Plane A. The conductive body and the conductive layer are composed of same material, and the average grain size (a) is greater than the average grain size (b).
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: September 14, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu
  • Publication number: 20210280572
    Abstract: An integrated circuit includes a first gate electrode structure extending in a first direction and having a first portion and a second portion separated from each other. The integrated circuit further includes a second gate electrode structure extending in the first direction and separated in a second direction from the first gate electrode structure. The integrated circuit further includes a conductive feature. The conductive feature includes a first section electrically connected to the second portion, wherein the first section extends in the second direction. The conductive feature further includes a second section electrically connected to the second gate electrode structure, wherein the second section extends in the second direction. The conductive feature further includes a third section electrically connecting the first section and the second section, wherein the third section extends in a third direction angled with respect to both the first direction and the second direction.
    Type: Application
    Filed: May 11, 2021
    Publication date: September 9, 2021
    Inventors: Tung-Heng HSIEH, Ting-Wei CHIANG, Chung-Te LIN, Hui-Zhong ZHUANG, Li-Chun TIEN, Sheng-Hsiung WANG
  • Publication number: 20210280524
    Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.
    Type: Application
    Filed: May 23, 2021
    Publication date: September 9, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu
  • Patent number: 11101209
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 24, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Patent number: 11101145
    Abstract: A semiconductor device is provided. The semiconductor device includes a base substrate, a die stacking unit, a number of dummy micro bumps, and an underfill material. The die stacking unit, which is mounted on the base substrate, includes a first die, a second die, and a number of first conductive joints. The first die and the second die are stacked on each other, and the first conductive joints are disposed between and connected to the first die and the second die. The dummy micro bumps, which are disposed between the first conductive joints, are connected to the first die but not to the second die. The underfill material is filled into a number of gaps between the base substrate, the first die, the second die, the first conductive joints, and the dummy micro bumps.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: August 24, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Fu Tsai, Chen-Hsuan Tsai, Chung-Chieh Ting, Shih-Ting Lin, Szu-Wei Lu
  • Patent number: 11101261
    Abstract: A package includes a package component, which further includes a top surface and a metal pad at the top surface of the package component. The package further includes a non-reflowable electrical connector over and bonded to the metal pad, and a molding material over the package component. The non-reflowable electrical connector is molded in the molding material and in contact with the molding material. The non-reflowable electrical connector has a top surface lower than a top surface of the molding compound.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: August 24, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 11074108
    Abstract: The disclosure includes implementations for a connected vehicle receiving cached electronic control unit (“ECU” if singular or “ECUs” if plural) mapping solutions via a network. Some implementations of a method for a vehicle may include identifying a presence of one or more functions associated with a vehicle control system. The method may include generating a query including a mapping problem describing one or more questions about which of one or more ECUs should execute the one or more functions. The method may include providing the query to a network. The method may include receiving a response from the network. The response may include a mapping solution that describes which of the one or more ECUs should execute the one or more functions. The method may include mapping the one or more functions to the one or more ECUs as described by the mapping solution.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: July 27, 2021
    Inventors: Chung-Wei Lin, BaekGyu Kim, Shinichi Shiraishi
  • Patent number: 11043122
    Abstract: The disclosure includes embodiments for managing a flow of traffic through an intersection. In some embodiments, a method for a roadside device proximate to the intersection of a roadway includes retrieving twin data describing one or more digital behavioral twins of a vehicle present in a vicinity of the intersection. The method includes retrieving sensor data describing a driving context of the vehicle. The method includes modifying an operation of an Advanced Driver Assistance System (ADAS) of the vehicle to achieve managing the flow of traffic including the vehicle through the intersection based on the driving context and the one or more digital behavioral twins of the vehicle to improve safety and traffic efficiency within an intersection range.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: June 22, 2021
    Inventors: Chung-Wei Lin, Zhihao Jiang
  • Publication number: 20210111633
    Abstract: A secondary controller applied to a secondary side of a power converter includes a control signal generation circuit. The control signal generation circuit is coupled to an output terminal of the secondary side of the power converter for detecting an output voltage of the secondary side and enabling a pulse signal to a signal source of the secondary side of the power converter, wherein the signal source enables a turning-on signal according to the pulse signal. The turning-on signal is coupled to a primary-side auxiliary winding of the power converter through a secondary-side auxiliary winding of the power converter to make the primary-side auxiliary winding generate a voltage, and a primary controller of a primary side of the power converter makes the primary side of the power converter be turned on according to the voltage.
    Type: Application
    Filed: January 2, 2020
    Publication date: April 15, 2021
    Inventors: Hung-Ching Lee, Chung-Wei Lin, Tsung-Chien Wu, Bo-Yi Wu
  • Publication number: 20210099093
    Abstract: A power supply has a transformer, a rectifier switch, a secondary-side controller and two diodes. The transformer includes a primary winding, a secondary winding, and a detection winding, inductively coupling to one another. The rectifier switch is connected in series with the secondary winding between two output power lines. The secondary-side controller is electrically coupled to two ends of the detection winding, for controlling the rectifier switch in response to two terminal signals at the two ends respectively. The two diodes are back-to-back electrically connected in series between the two ends, and a joint connecting the two diodes is electrically connected to one of the two output power lines.
    Type: Application
    Filed: September 4, 2020
    Publication date: April 1, 2021
    Inventors: Chung-Wei LIN, Hung Ching LEE, Tsung Chien WU, Bo-Yi WU
  • Publication number: 20210046992
    Abstract: A bicycle capable of measuring power is disclosed. The bicycle comprises a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.
    Type: Application
    Filed: May 13, 2020
    Publication date: February 18, 2021
    Applicant: Giant Manufacturing Co. Ltd.
    Inventors: Chih-Kai CHANG, Ching-Yao LIN, Chung-Wei LIN
  • Patent number: 10904891
    Abstract: In an example embodiment, a method receives a first request of a first vehicle for a content item; receives travel data of the first vehicle including a first vehicle route of the first vehicle; determines first edge server(s) located on the first vehicle route of the first vehicle; segments the content item into content segment(s) based on the travel data of the first vehicle and edge information of each first edge server; and dispatches each content segment to the corresponding first edge server for transmission to the first vehicle.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: January 26, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Qianao Ju, BaekGyu Kim, Chung-Wei Lin, Shinichi Shiraishi
  • Patent number: 10843703
    Abstract: An accuracy level for an ego vehicle is determined based on data provided by a first remote vehicle. The ego vehicle receives data describing information about the first remote vehicle that includes a sensor measurement. The ego vehicle determines that the data is inconsistent with local sensor data. The ego vehicle requests remote accuracy data from a set of remote vehicles, wherein the remote accuracy data describes an accuracy of the sensor measurement. The ego vehicle determines ego accuracy data for the first remote vehicle based on the remote accuracy data that is received from the set of remote vehicles, wherein the ego accuracy data describes an accuracy level for the first remote vehicle. The ego vehicle determines whether to input the data to the ADAS system based on the accuracy level.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: November 24, 2020
    Inventors: Chung-Wei Lin, Shinichi Shiraishi
  • Patent number: 10788990
    Abstract: The disclosure includes embodiments for improving a performance of a set of Advanced Driver Assistance Systems (“ADAS systems”) included in a vehicle by decreasing a latency for processing a set of input/output (“I/O”) requests generated by one or more active ADAS systems from the set of ADAS systems. A method includes determining situation data describing a driving situation for the vehicle. The method includes identifying the one or more active ADAS systems from the set of ADAS systems for the driving situation. The method includes determining whether an input/output (“I/O”) communication conflict exists for the one or more active ADAS systems. The method includes applying at least one of a direct I/O strategy and a virtual I/O strategy to the set of I/O requests based on whether the I/O communication conflict exists.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: September 29, 2020
    Inventors: BaekGyu Kim, Chung-Wei Lin, Shinichi Shiraishi
  • Patent number: 10756639
    Abstract: A secondary controller applied to a secondary side of a power converter includes a control signal generation circuit, a voltage detection signal generation circuit, and a gate control signal generation circuit. The control signal generation circuit generates a short-circuited control signal to a short winding switch after a gate control signal to make the short winding switch be turned on. When an output voltage of the power converter is less than a predetermined voltage, the voltage detection signal generation circuit generates a first detection signal to the control signal generation circuit. The control signal generation circuit further generates a gate pulse control signal according to the first detection signal. The gate control signal generation circuit generates a gate pulse signal according to the gate pulse control signal, wherein the gate pulse signal is used for making a primary side of the power converter be turned on.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: August 25, 2020
    Assignee: Leadtrend Technology Corp.
    Inventors: Chung-Wei Lin, Hung-Ching Lee
  • Publication number: 20200244219
    Abstract: An oscillation circuit that is robust and more accurate is provided. The oscillation circuit includes a reference voltage generator, a voltage-to-current converter, a capacitor, a pull-low circuit, and a single-ended input comparator. The reference voltage generator is used for generating a voltage signal. The voltage-to-current converter receives the voltage signal for generating a reference current. The capacitor is coupled to the voltage-to-current converter for generating a ramp signal. The single-ended input comparator receives the ramp signal for generating a clock signal. The pull-low circuit receives the clock signal for pulling the ramp signal low.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Inventors: Guang-Nan Tzeng, Chung-Wei Lin
  • Publication number: 20200136519
    Abstract: A secondary controller applied to a secondary side of a power converter includes a control signal generation circuit, a voltage detection signal generation circuit, and a gate control signal generation circuit. The control signal generation circuit generates a short-circuited control signal to a short winding switch after a gate control signal to make the short winding switch be turned on. When an output voltage of the power converter is less than a predetermined voltage, the voltage detection signal generation circuit generates a first detection signal to the control signal generation circuit. The control signal generation circuit further generates a gate pulse control signal according to the first detection signal. The gate control signal generation circuit generates a gate pulse signal according to the gate pulse control signal, wherein the gate pulse signal is used for making a primary side of the power converter be turned on.
    Type: Application
    Filed: July 9, 2019
    Publication date: April 30, 2020
    Inventors: Chung-Wei Lin, Hung-Ching Lee