Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.

Abstract: A sensitive locking control device for a vehicle has a server mounted in the vehicle and a portable proximity controller. The server continuously emits a detecting signal trying to detect whether the proximity controller is within an effective range of the server. When the proximity controller responds to the server by sending a confirmation signal, the server is unable to automatically lock or unlock a vehicle door or a trunk lid without using a key, or to enable or disable a vehicle security system.