Patents by Inventor Chung-Yan Huang

Chung-Yan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240266302
    Abstract: A carrier substrate is provided and has a first circuit structure and a second circuit structure on opposing sides of the carrier substrate, where on one routing region, a difference between a routing ratio of a first circuit layer of the first circuit structure and a routing ratio of a second circuit layer of the second circuit structure is within 10%. Therefore, the difference between the routing ratios of the two opposing outermost circuit layers of the carrier substrate in specific target regions can be reduced, so as to avoid a warpage of the carrier substrate due to a great difference in metal distribution areas.
    Type: Application
    Filed: May 18, 2023
    Publication date: August 8, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yan HUANG, Ning-Hsu CHANG, Wei-Hsin SHIH, Jann-Tzung LIU, Yu-Tung YAO, Hsiu-Fang CHIEN
  • Patent number: 9978673
    Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: May 22, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang, Ying-Chou Tsai
  • Publication number: 20180061747
    Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.
    Type: Application
    Filed: January 4, 2017
    Publication date: March 1, 2018
    Inventors: Shao-Tzu Tang, Jia-Fong Yeh, Chien-Hui Wang, Chung-Yan Huang, Ying-Chou Tsai
  • Patent number: 8968130
    Abstract: A cogset, which is adapted to connect to a rotatable hub in a bicycle, includes a first cog, a second cog connected to the first cog, and a support element installed to the second cog. A limiting side of the support element is abutted against a side of the second cog. The support element is mounted by the first cog. Each of the first and second cogs is not directly connected to the rotatable hub.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: March 3, 2015
    Assignee: Tien Hsin Industries Co., Ltd.
    Inventors: Chia-Wei Liao, Chung-Yan Huang
  • Publication number: 20120244978
    Abstract: A cogset, which is adapted to connect to a rotatable hub in a bicycle, comprises a first cog, a second cog connected to the first cog, and a support element installed to the second cog. A limiting side of the support element is abutted against a side of the second cog. The support element is mounted by the first cog. Each of the first and second cogs is not directly connected to the rotatable hub.
    Type: Application
    Filed: March 23, 2011
    Publication date: September 27, 2012
    Inventors: Chia-Wei Liao, Chung-Yan Huang