Abstract: An epitaxial structure of a semiconductor light-emitting element includes an n-type layer, a V-pit control layer, a light-emitting layer, and a p-type layer stacked from bottom to top. The light-emitting layer includes a plurality of well layers and a plurality of barrier layers stacked alternately. The V-pit control layer includes a first superlattice layer, and a distance between a bottom surface of the V-pit control layer and a bottom surface of the first superlattice layer is less than or equal to 0.15 ?m. The bottom surface of the first superlattice layer and a bottom surface of the light-emitting layer have a distance therebetween ranging from 0.05 ?m to 0.3 ?m, and each of the first superlattice layer and the light-emitting layer is an Indium (In)-containing layer. A semiconductor light-emitting element and a light-emitting device are also provided.

Abstract: A light-emitting diode (LED) includes a semiconductor structure, a transparent conducting layer, a first electrode, and a second electrode. The semiconductor structure has a lower surface and an upper surface, and includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked in a laminating direction from the lower surface to the upper surface. The transparent conducting layer is located on the second semiconductor layer. The first electrode is located on the first semiconductor layer. The second electrode is located on the transparent conducting layer. When viewing the semiconductor structure and the transparent conducting layer from above the LED. The semiconductor structure has a shortest side with a length of X ?m.

Abstract: A heat radiator having a thermo-electric cooler uses a plurality of heat radiation modules to induce forced thermal conduction at respective hot spots. The heat radiator comprises a first heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto a heat source. The thermo-electric cooler is attached to the heat source, whereby heat will be delivered from the heat absorption terminal to the heat release terminal thereof. The heat radiator further comprises a second heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto the thermo-electric cooler. Thereby, the heat generated in a heat source, such as a central processing unit (CPU) and an accelerated graphic chip, is dissipated through not only the first heat radiation module but also the thermo-electric cooler at the second heat radiation module.

Abstract: A heat radiator having a thermo-electric cooler uses a plurality of heat radiation modules to induce forced thermal conduction at respective hot spots. The heat radiator comprises a first heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto a heat source. The thermo-electric cooler is attached to the heat source, whereby heat will be delivered from the heat absorption terminal to the heat release terminal thereof. The heat radiator further comprises a second heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto the thermo-electric cooler. Thereby, the heat generated in a heat source, such as a central processing unit (CPU) and an accelerated graphic chip, is dissipated through not only the first heat radiation module but also the thermo-electric cooler at the second heat radiation module.

Abstract: A heat radiator has a thermo-electric cooler and multiple heat radiation modules and the method of the same is capable of applying forced heat conduction on a hot spot on a computer circuit through a plurality of conduction paths. The heat radiator comprises a first heat radiation module with a heat sink simultaneously attached to the hot spot and the thermo-electric cooler and a second radiation module with a heat sink attached on the thermo-electric cooler only, whereby the heat generated in a heat source, such as a central processing unit (CPU) and an accelerated graphic chip, and delivered from the heat absorption terminal to the heat release terminal of the cooler can be dissipated efficiently. The first heat radiation module and the second radiation module further respectively include a first and a second radiating fin sets.