Patents by Inventor Chung-Yang Lin

Chung-Yang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6209585
    Abstract: A cover assembly that is equipped with a pivotable handle for sealing a vacuum conduit opening is provided. The cover assembly is constructed generally by a cover body and a pivotable handle resting in a recess in a top surface of the cover body. The cover body is constructed by an upper annular portion and a lower annular portion integrally formed or joined together. The upper annular portion has an outside diameter that is larger than an outside diameter of the conduit opening, while the lower annular portion has an outside diameter that is smaller than an inside diameter of the conduit opening for sealing the conduit opening when the lower annular portion of the cover body is inserted into the conduit opening, a bottom surface of the upper annular portion sealingly engages the end surface of the conduit opening. The upper annular portion may further include a recess in a top surface for concealing the pivotable handle therein.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: April 3, 2001
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chung-Yang Lin