Abstract: An arc discharge lamp (10) has an envelope (12) including a base (14) containing lead-ins (16, 18). An arc tube (20) is positioned within the envelope (12) and has electrodes (22, 24) sealed therein. The electrodes have connection ends (26, 28) extending outside of the arc tube (20). A flexible primary electrical connector (30) is fixed between one of the lead-ins (16) and one of the connection ends (26) of one of the electrodes (22), the flexible primary electrical connector (30) having an area “A” subject to intergranular corrosion in the presence of oxygen and arc tube operating temperatures. A rigid secondary, intergranular-corrosion-resistant electrical connector (32) is electrically connected between the lead-in (16) and the one of the connection ends (26) of the one of the electrodes (22), the rigid secondary electrical connector (32) by-passing the area “A” that is subject to intergranular corrosion.

Abstract: A lamp (100) comprises an outer envelope (120) having first and second electrical lead-ins (140, 160) sealed into a base (180) of the envelope (120). A ceramic arc tube (200) is operatively mounted within the envelope (120), the arc tube (200) having at least one electrode (220) therein. A tubular, niobium feed-through (240) is connected to the at least one electrode (220) and sealed to the ceramic body (120) at a joint (260) that can comprise a glass frit (260a). A stainless steel rod (280) is electrically connected between the electrical lead-in (140) and the tubular niobium feed-through (240), the stainless steel rod (280) being the only electrical connection between the lead-in (140) and the niobium feed-through (240).

Abstract: A lamp (100) comprises an outer envelope (120) having first and second electrical lead-ins (140, 160) sealed into a base (180) of the envelope (120). A ceramic arc tube (200) is operatively mounted within the envelope (120), the arc tube (200) having at least one electrode (220) therein. A tubular, niobium feed-through (240) is connected to the at least one electrode (220) and sealed to the ceramic body (120) at a joint (260) that can comprise a glass frit (260a). A stainless steel rod (280) is electrically connected between the electrical lead-in (140) and the tubular niobium feed-through (240), the stainless steel rod (280) being the only electrical connection between the lead-in (140) and the niobium feed-through (240).

Abstract: An arc discharge lamp (10) has an envelope (12) including a base (14) containing lead-ins (16, 18). An arc tube (20) is positioned within the envelope (12) and has electrodes (22, 24) sealed therein. The electrodes have connection ends (26, 28) extending outside of the arc tube (20). A flexible primary electrical connector (30) is fixed between one of the lead-ins (16) and one of the connection ends (26) of one of the electrodes (22), the flexible primary electrical connector (30) having an area “A” subject to intergranular corrosion in the presence of oxygen and arc tube operating temperatures. A rigid secondary, intergrannular-corrosion-resistant electrical connector (32) is electrically connected between the lead-in (16) and the one of the connection ends (26) of the one of the electrodes (22), the rigid secondary electrical connector (32) by-passing the area “A” that is subject to intergranular corrosion.

Abstract: An arc tube for a high intensity discharge lamp. The arc tube has a hermetically sealed body formed from a vitreous material subject to devitrification, at least two oppositely disposed electrodes are sealed in the body. An are generating and sustaining medium is provided in the body and operates to produce visible light when an electric current is applied to the electrodes. The are tube has a given color rendering index, and at least a portion of the medium comprises a color correcting component of lithium iodide which contributes no only to the given color rendering index but which also acts as a devitrification agent. The improvement comprises an anti-devitrification component in the medium, the anti-devitrification component having a minimal detrimental effect on the given color rendering index while increasing the life of the are tube.

Abstract: The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials. A chromium-zinc coating is electrolytically applied to copper or copper based alloy surface using a caustic electrolyte solution. The coated material is then rinsed in an aqueous solution containing a phosphate salt of alkali metals or alkaline earth metals, or a borate salt of alkali metals or alkaline earth metals. The pH of the rinse solution is maintained from about 5 to about 12 and preferably from about 7 to about 10.

Abstract: The formation of whiskers during tin or tin-lead solder electroplating of a copper base alloy substrate in a methane sulfonate solder plating bath is inhibited by passivating the surface of the substrate prior to electroplating. Preferred passivating solutions include an aqueous solution of sodium dichromate and phosphoric acid, and an aqueous solution of chromic acid and phosphoric acid. Passivation is preferably followed by treatment with a basic solution having a pH of at least 8.

Abstract: A technique for improving the tarnish and oxidation resistance of copper and copper based ally material is disclosed. The material is electrolytically coated by immersion in an aqueous electrolyte containing sodium hydroxide, zinc ions and chromium (VI) ions. The deposited coating is a codeposited layer of zinc and chromium with a zinc to chromium ratio of from about 5:1 to about 12:1. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. and is removable by immersion in sulfuric acid.

Abstract: A process for imparting tarnish resistance to copper and copper alloy materials, particularly copper foil. The material is first treated with an acidic chromium-containing solution to deposit chromium ions on said foil. Thereafter the material is treated with a basic zinc ion containing solution to deposit zinc ions thereon. Finally, the material is rinsed in distilled water to remove any residual basic solution.

Abstract: A technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials is disclosed. Copper or a copper alloy is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. While the compositional ranges may vary, the concentration of either zinc ions or chromium (VI) ions, or both, is less than 1.0 gm/1. A chromium-zinc coating is electrolytically applied. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. The coating is removable by immerison in sulfuric acid. Improved results are obtained by rinsing deionized water containing a small amount of an alkaline or alkaline earth hydroxide.

Abstract: A technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials is disclosed. Copper or a copper alloy is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. While the compositional ranges may vary, the concentration of either zinc ions or chromium (VI) ions, or both, is less than 1.0 gm/l. A chromium-zinc coating is electrolytically applied. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. The coating is removable by immersion in sulfuric acid. Improved results are obtained by rinsing deionized water containing a small amount of an alkaline or alkaline earth hydroxide.

Abstract: A method of imparting tarnish and corrosion resistance to a copper or copper alloy foil, particularly wrought foil having one surface roughened by the application of nodules or dendrites. The foil is treated with an aqueous solution of chromic acid and sulfuric acid. The foil may then be rinsed in a basic solution having a pH greater than 8 and then dried.

Abstract: The present invention relates to an iron-nickel alloy containing from about 30% to about 60% nickel, from 0.001% to about 0.15% nitrogen, at least one element selected from the group consisting of from about 1% to about 10% molybdenum and from about 0.001% to about 2% aluminum and the balance essentially iron. The alloys demonstrate improved resistance to intermediate compound formation, improved glass to metal sealing properties, and improved wirebonding performance. The alloys of the present invention have particular utility as a lead frame material for semiconductor packages.

Abstract: The present invention relates to an iron-nickel alloy containing from about 30% to about 60% nickel, from about 0.001% to about 0.15% nitrogen, at least one element selected from the group consisting of from about 1% to about 10% molybdenum and from about 0.001% to about 2% aluminum and the balance essentially iron. The alloys demonstrate improved resistance to intermetallic compound formation, improved glass to metal sealing properties, and improved wirebonding performance. The alloys of the present invention have particular utility as a lead frame material for semiconductor packages.

Abstract: A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.

Abstract: A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.