Patents by Inventor Chung-Yeol Lee
Chung-Yeol Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128797Abstract: Disclosed are a primary coil unit having four coils independently controllable and a pickup coil unit having four coils also independently controllable. The proposed power transfer system and the proposed power pickup system can satisfy standard compatibility and improve the efficiency of wireless power transmission. The power transfer device is compatible with various types of conventional power pickup systems and capable of expanding compatibility with a new power pickup system to be developed in future by changing the power transfer magnetic flux pattern. The power pickup device is compatible with various types of conventional power transfer systems and capable of expanding compatibility with a power transfer system to be developed in future. The system including both the power transfer device and the power pickup device is more robust against a deviation.Type: ApplicationFiled: December 20, 2023Publication date: April 18, 2024Inventors: Dong Ho CHO, Bo Yune SONG, Gu Ho JUNG, Chung Hee LEE, Ja Hyeon LEE, Uoo Yeol YOON
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Publication number: 20230260709Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes, and an external electrode including an electrode layer disposed on the body to be connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer. The electrode layer includes an island region.Type: ApplicationFiled: December 22, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong Lee, Hyung Jong Choi, Chung Yeol Lee, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20230260708Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.Type: ApplicationFiled: December 20, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Yoo Jeong LEE, Hyung Jong CHOI, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230238182Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.Type: ApplicationFiled: September 13, 2022Publication date: July 27, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230230770Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.Type: ApplicationFiled: September 1, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230223195Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.Type: ApplicationFiled: October 25, 2022Publication date: July 13, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230215643Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.Type: ApplicationFiled: October 25, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chung Yeol Lee, Yoo Jeong Lee, Hyung Jong Choi, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Kang Ha Lee, Myung Jun Park, Jong Ho Lee, Jun Hyeong Kim
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Publication number: 20230215647Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.Type: ApplicationFiled: September 27, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong Lee, Chung Yeol Lee, Hyung Jong Choi, Kwang Yeun Won, So Jung An, Kang Ha Lee, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20230215646Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.Type: ApplicationFiled: September 20, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Yeun WON, Jong Ho LEE, Yoo Jeong LEE, Hyung Jong CHOI, Chung Yeol LEE, So Jung AN, Woo Kyung SUNG, Myung Jun PARK
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Publication number: 20230070629Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer, a protective layer disposed on the body, and an external electrode disposed on at least a portion of the protective layer. The protective layer includes oxide ceramic and a metal the same as a metal of the internal electrode layer.Type: ApplicationFiled: April 12, 2022Publication date: March 9, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyo Ju Lee, Chung Yeol Lee, Eun Hye Cho
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Patent number: 10832884Abstract: A cylindrical X-ray tube having an outer insulating layer, a cathode electrode and an anode electrode disposed at both ends of the outer insulating layer, a gate electrode disposed between the cathode and anode electrodes, an emitter, and a target, comprises an inner insulating layer which is disposed between the cathode electrode and the outer insulating layer, is formed to extend downward in a coaxial direction with the outer insulating layer, and is pre-adjusted in order to secure an insulating distance between the cathode electrode and the gate electrode. Thus, by providing a separate internal insulating layer extending coaxially with the external insulating layer between the cathode electrode and the external insulating layer, the insulating distance between the cathode electrode and the gate electrode, the insulating distance between the cathode electrode and the anode electrode may be easily adjusted, so that a desired insulating capability can be secured.Type: GrantFiled: August 16, 2017Date of Patent: November 10, 2020Assignee: VALUE SERVICE INNOVATION CO., LTD.Inventors: Dae Jun Kim, Kwan Soo Park, Ji Eun Kim, Dong il Kim, Chung Yeol Lee, Do Yun Kim
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Patent number: 10790087Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.Type: GrantFiled: January 15, 2019Date of Patent: September 29, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byoung Jin Chun, Hye Jin Jeong, Chung Yeol Lee, Sang Moon Lee, Hye Young Choi, Myung Jun Park, Young Sook Lee
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Publication number: 20200144016Abstract: A cylindrical X-ray tube having an outer insulating layer, a cathode electrode and an anode electrode disposed at both ends of the outer insulating layer, a gate electrode disposed between the cathode and anode electrodes, an emitter, and a target, comprises an inner insulating layer which is disposed between the cathode electrode and the outer insulating layer, is formed to extend downward in a coaxial direction with the outer insulating layer, and is pre-adjusted in order to secure an insulating distance between the cathode electrode and the gate electrode. Thus, by providing a separate internal insulating layer extending coaxially with the external insulating layer between the cathode electrode and the external insulating layer, the insulating distance between the cathode electrode and the gate electrode, the insulating distance between the cathode electrode and the anode electrode may be easily adjusted, so that a desired insulating capability can be secured.Type: ApplicationFiled: August 16, 2017Publication date: May 7, 2020Applicant: VALUE SERVICE INNOVATION CO., LTD.Inventors: Dae Jun KIM, Kwan Soo PARK, Ji Eun KIM, Dong il KIM, Chung Yeol LEE, Do Yun KIM
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Patent number: 10312022Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.Type: GrantFiled: October 20, 2016Date of Patent: June 4, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Moon Lee, Myung Jun Park, Hye Jin Jeong, Chung Yeol Lee, Young Sook Lee, Jae Yeol Choi, Hye Young Choi, Byoung Jin Chun
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Publication number: 20190148076Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.Type: ApplicationFiled: January 15, 2019Publication date: May 16, 2019Inventors: Byoung Jin CHUN, Hye Jin JEONG, Chung Yeol LEE, Sang Moon LEE, Hye Young CHOI, Myung Jun PARK, Young Sook LEE
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Patent number: 9743514Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, base electrode layers disposed on the ceramic body and including main portions connected to the internal electrodes and extension portions extending from the main portions, and resin electrode layers disposed on the base electrode layers while leaving end portions of the extension portions exposed. A width of the extension portion is narrower than a width of the outer surface of the ceramic body on which the extension portion is disposed, measured in a direction parallel to a width direction of the extension portion.Type: GrantFiled: July 8, 2015Date of Patent: August 22, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Hee Gu, Myung Jun Park, Hye Jin Jeong, Byoung Jin Chun, Young Sook Lee, Hye Young Choi, Chung Yeol Lee
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Publication number: 20170178811Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.Type: ApplicationFiled: July 22, 2016Publication date: June 22, 2017Inventors: Byoung Jin CHUN, Hye Jin JEONG, Chung Yeol LEE, Sang Moon LEE, Hye Young CHOI, Myung Jun PARK, Young Sook LEE
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Publication number: 20170154729Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.Type: ApplicationFiled: October 20, 2016Publication date: June 1, 2017Inventors: Sang Moon LEE, Myung Jun PARK, Hye Jin JEONG, Chung Yeol LEE, Young Sook LEE, Jae Yeol CHOI, Hye Young CHOI, Byoung Jin CHUN
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Publication number: 20160268044Abstract: A multilayer ceramic component is provided. The multilayer ceramic component includes a ceramic body including a plurality of ceramic laminates, each including a plurality of dielectric layers and a plurality of internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and a plurality of external electrodes including base electrode layers disposed on outer surfaces of the ceramic body and respectively connected to the internal electrodes of the ceramic laminates, and resin electrode layers disposed on the base electrode layers to expose at least portions of end portions of the base electrode layers, respectively.Type: ApplicationFiled: September 22, 2015Publication date: September 15, 2016Inventors: Hyun Hee GU, Myung Jun PARK, Byoung Jin CHUN, Young Sook LEE, Hye Jin JEONG, Hye Young CHOI, Chung Yeol LEE
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Patent number: D1016803Type: GrantFiled: October 7, 2022Date of Patent: March 5, 2024Assignee: Samsung Display Co., Ltd.Inventors: Young Seok Kim, Han-Na Ma, Dong-Yeol Yeom, Chung Hui Lee