Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.

Abstract: The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.

Abstract: The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.

Abstract: The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

Abstract: Provided is a chemical mechanical polishing conditioner capable of controlling a polishing depth. The CMP conditioner capable of controlling the polishing depth comprises a substrate; a binding layer disposed on the substrate; multiple abrasive units placed on the binding layer; and multiple abrasive terminal units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer, and the abrasive layer is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive tips of the abrasive units are relatively higher than surfaces of the abrasive terminal units to form a protrusion height. Accordingly, the CMP conditioner controls the polishing depth of an article to be conditioned.

Abstract: The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a chemical mechanical polishing conditioner made from a woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer; wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance. Therefore, the present invention can provide the bonding layer with a better flexibility by the woven preform, and solve the conventional problem of resin residue in a powder-form bonding layer, or thermal cracking or thermal deformation of a sheet-form bonding layer during the heating and curing process, and thus improve the polishing performance and service time of the chemical mechanical polishing conditioner.

Abstract: The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

Abstract: A fuser assembly for an electrophotographic device includes a tubular roller, a pressing member, a pressing roller, and a heater. The pressing member is disposed in the tubular roller, and includes a tubular part that has a flat surface. The pressing roller presses the tubular roller against the flat surface of the tubular part of the pressing member. The heater is disposed in the tubular part of the pressing member.

Abstract: A multi-function peripheral includes a casing, a scanning module and a printing module. The casing has a recording media path. The scanning module is located on the recording media path for selectively scanning recording media fed into the casing from the recording media path. The printing module also is located on the recording media path for selectively printing the recording media. The recording media are then discharged out of the casing through the recording media path. Thus the multi-function peripheral can reduce the number of elements, simplify replacement of the inkjet cartridge of the printing module, reduce the dimensions, lower the element cost and diminish the complexity of the mechanisms.

Abstract: A multi-function peripheral includes a casing, a scanning module and a printing module. The casing has a recording media path. The scanning module is located on the recording media path for selectively scanning recording media fed into the casing from the recording media path. The printing module also is located on the recording media path for selectively printing the recording media. The recording media are then discharged out of the casing through the recording media path. Thus the multi-function peripheral can reduce the number of elements, simplify replacement of the inkjet cartridge of the printing module, reduce the dimensions, lower the element cost and diminish the complexity of the mechanisms.

Abstract: A pigment-adhering apparatus for the printer device is provided. The pigment-adhering apparatus includes a pressing roller having two contacting components and a feeding component between the two contacting components. The feeding component transports an printed object to be printed and the pressing roller provides a pressure to a heat conducting film. The contacting components make the heat conducting film move with the pressing roller at the same speed.

Abstract: A fuser assembly for an electrophotographic device includes a tubular roller, a pressing member, a pressing roller, and a heater. The pressing member is disposed in the tubular roller, and includes a tubular part that has a flat surface. The pressing roller presses the tubular roller against the flat surface of the tubular part of the pressing member. The heater is disposed in the tubular part of the pressing member.

Abstract: A fuser assembly for an electrophotographic device includes a tubular roller, a pressing member that is disposed in the tubular roller and that has a flat surface, a pressing roller that presses the tubular roller against the flat surface of the pressing member, and a heater that is disposed in the tubular roller and that is separated from the pressing member.

Abstract: A double-side scanning mechanism for capturing images of a paper having two pages includes a second transparent element disposed corresponding to an outer side of a first transparent element and parallel to the first transparent element. A paper conveying device conveys a paper to pass between the first and the second transparent elements with a first page facing the first transparent element. The paper is flipped and passes over the outer side of the second transparent element with a second page facing the second transparent element. An image scanning module is disposed corresponding to an inner side of the first transparent element, for capturing the image of the first page when the paper passes between the first and the second transparent elements, and capturing the image of the second page when the paper passes over an outer side of the second transparent element.

Abstract: A medium category determination method for a multi-function peripheral, which uses an algorithm to enhance the differences in the luminance values of three primary color and the corresponding standard deviations. The luminance values color and the corresponding standard deviations become precise bases for category determination of unknown media. Caused by the coarseness and the colors on the surfaces of different media, these differences under visible light are easily collected by scanning modules. The method scans the unknown medium to obtain the luminance values of three primary colors, calculates the corresponding standard deviations of all luminance values of the unknown medium, enhances the differences among the luminance values and standard deviations among the unknown medium and multiple known media by an algorithm, and finally determines the category of the unknown medium as the category of one known medium.

Abstract: A paper tray mechanism that is applicable to machines with paper trays, such as printers, scanners, copiers, fax machines, all-in-one multifunction center and the like, comprises an input paper tray, an output paper tray, where both trays are movable and attached to the machine at sides, and an interconnecting mechanism therein between the two trays. When one paper tray is moved by the user, due to the interconnecting mechanism therein between, another paper tray will automatically move simultaneously. Therefore, this invention provides a paper mechanism that only needs one simple and easy step to have both paper trays unfolded/folded and unstashed/stashed so that some spaces are saved for other usage and machine is compact enough to be repacked into the original box.