Patents by Inventor Chung-Yi Hsu
Chung-Yi Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11953740Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.Type: GrantFiled: May 14, 2021Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Patent number: 11947173Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.Type: GrantFiled: May 5, 2023Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
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Publication number: 20240084447Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
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Publication number: 20240088070Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Yi Hsu, Kai-Chiang Wu, Yen-Ping Wang
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Patent number: 11929730Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.Type: GrantFiled: February 10, 2021Date of Patent: March 12, 2024Assignee: EPISTAR CORPORATIONInventors: Ta-Cheng Hsu, Wei-Shou Chen, Chun-Yi Lin, Chung-Jen Chung, Wei-Tsuen Ye, Wei-Ching Guo
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Patent number: 11920238Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.Type: GrantFiled: July 22, 2022Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
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Publication number: 20240069277Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Yi Kuo, Chen-Hua Yu, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu
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Patent number: 11855011Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.Type: GrantFiled: March 30, 2021Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Yi Hsu, Kai-Chiang Wu, Yen-Ping Wang
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Patent number: 11569562Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.Type: GrantFiled: August 20, 2020Date of Patent: January 31, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu
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Publication number: 20220359977Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.Type: ApplicationFiled: July 27, 2022Publication date: November 10, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu
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Publication number: 20220320020Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Yi Hsu, Kai-Chiang Wu, Yen-Ping Wang
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Patent number: 11243198Abstract: A gas sensing device is adapted to detect a concentration of a target gas. The gas sensing device comprises a dielectric layer, a reference sensing portion, a target sensing portion, and a controller. The dielectric layer is disposed on a surface. The reference sensing portion and the target sensing portion are respectively disposed on a supporting side of the dielectric layer, with said supporting side facing away from the surface. The reference sensing portion includes a first conductive layer and a first sensing layer with low sensitivity to the target gas. The target sensing portion includes a second conductive layer and a second sensing layer with high sensitivity to the target gas. The controller obtains the immittance values of the first conductive layer and the second conductive layer, and calculates a concentration value of the target gas according to the immittance values and a correlation function.Type: GrantFiled: May 20, 2020Date of Patent: February 8, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Ying Lin, Ying-Che Lo, Chung-Yi Hsu, Po-Jen Su
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Publication number: 20210190744Abstract: A gas sensing device is adapted to detect a concentration of a target gas. The gas sensing device comprises a dielectric layer, a reference sensing portion, a target sensing portion, and a controller. The dielectric layer is disposed on a surface. The reference sensing portion and the target sensing portion are respectively disposed on a supporting side of the dielectric layer, with said supporting side facing away from the surface. The reference sensing portion includes a first conductive layer and a first sensing layer with low sensitivity to the target gas. The target sensing portion includes a second conductive layer and a second sensing layer with high sensitivity to the target gas. The controller obtains the immittance values of the first conductive layer and the second conductive layer, and calculates a concentration value of the target gas according to the immittance values and a correlation function.Type: ApplicationFiled: May 20, 2020Publication date: June 24, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Ying LIN, Ying-Che LO, Chung-Yi HSU, Po-Jen SU
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Publication number: 20210184335Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.Type: ApplicationFiled: August 20, 2020Publication date: June 17, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu
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Patent number: 10816656Abstract: In a vital sign sensor of the present invention, an antenna assembly radiates an oscillation signal generated by a SIL oscillator to an object in a form of a wireless signal and receives a reflected signal from the object, and the reflected signal can have the SIL oscillator injection-locked. The wireless signal radiated from the antenna assembly is transmitted to a demodulator for demodulation such that the vital signs of the object can be obtained. Additionally, an isolator of the antenna assembly is provided to prevent the SIL oscillator from receiving a clutter reflected from the demodulator and an environment where the demodulator is placed. As a result, the clutter can't influence the vital sign detection of the object.Type: GrantFiled: August 21, 2018Date of Patent: October 27, 2020Assignee: NATIONAL SUN YAT-SEN UNIVERSITYInventors: Fu-Kang Wang, Tzyy-Sheng Horng, Lih-Tyng Hwang, Chung-Yi Hsu
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Patent number: 10601132Abstract: An active phase switchable array includes a plurality of antenna elements and a bias circuit. Each of the radar elements includes an antenna, a power coupling network and an injection-locked oscillator (ILO), and each of the antenna elements is coupled with each other through the power coupling networks for operating the ILO of each of the antenna elements in self- and mutual-injection-locked states. The antenna elements in self-injection-locked state are utilized to detect the vital signs of subjects, and the antenna elements in mutual-injection-locked state are utilized to produce phase difference between the radiating signals of the antenna elements for forming a beam. As a result, the active phase switchable array can simultaneously detect the vital signs of multiple subjects.Type: GrantFiled: September 5, 2017Date of Patent: March 24, 2020Assignee: NATIONAL SUN YAT-SEN UNIVERSITYInventors: Fu-Kang Wang, Tzyy-Sheng Horng, Lih-Tynh Hwang, Chung-Yi Hsu, Cho-Ying Chuang
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Publication number: 20190377080Abstract: In a vital sign sensor of the present invention, an antenna assembly radiates an oscillation signal generated by a SIL oscillator to an object in a form of a wireless signal and receives a reflected signal from the object, and the reflected signal can have the SIL oscillator injection-locked. The wireless signal radiated from the antenna assembly is transmitted to a demodulator for demodulation such that the vital signs of the object can be obtained. Additionally, an isolator of the antenna assembly is provided to prevent the SIL oscillator from receiving a clutter reflected from the demodulator and an environment where the demodulator is placed. As a result, the clutter can't influence the vital sign detection of the object.Type: ApplicationFiled: August 21, 2018Publication date: December 12, 2019Inventors: Fu-Kang Wang, Tzyy-Sheng Horng, Lih-Tyng Hwang, Chung-Yi Hsu
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Publication number: 20180083358Abstract: An active phase switchable array includes a plurality of antenna elements and a bias circuit. Each of the radar elements includes an antenna, a power coupling network and an injection-locked oscillator (ILO), and each of the antenna elements is coupled with each other through the power coupling networks for operating the ILO of each of the antenna elements in self- and mutual-injection-locked states. The antenna elements in self-injection-locked state are utilized to detect the vital signs of subjects, and the antenna elements in mutual-injection-locked state are utilized to produce phase difference between the radiating signals of the antenna elements for forming a beam. As a result, the active phase switchable array can simultaneously detect the vital signs of multiple subjects.Type: ApplicationFiled: September 5, 2017Publication date: March 22, 2018Inventors: Fu-Kang Wang, Tzyy-Sheng Horng, Lih-Tynh Hwang, Chung-Yi Hsu, Cho-Ying Chuang
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Publication number: 20080054290Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.Type: ApplicationFiled: September 5, 2007Publication date: March 6, 2008Applicant: EPISTAR CORPORATIONInventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Chung-Yi Hsu, Chung-Kuei Huang
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Publication number: 20040205667Abstract: A method and system for processing text string editing is used to process an original text string. The split device is used to split the original text string into N character units that are to be processed, according to the principle of the selected split mode. After that, a processing module is used to respectively perform a different process function on each of the units to be processed, so as to obtain a result unit, which has been separately processed. At the last, the merging unit is used to merge all of the result units that have been processed into one and makes it to be displayed in a display device. The present invention can also repeatedly perform the forgoing processing steps and the merging steps, so as to produce a plurality of picture displaying picture frames and sequentially output to the display device for generating the motion picture effect. It increases the variability on editing the words in sequence order and the diversity of the displaying effects.Type: ApplicationFiled: March 29, 2002Publication date: October 14, 2004Inventor: Chung-Yi Hsu