Abstract: Provides a flexible copper clad laminate, which includes a polyimide substrate; a nickel-copper alloy layer; and a copper layer. The nickel-copper alloy layer is formed on at least one side of the polyimide substrate by electroless plating and comprises at least nickel, copper and phosphorus. A content of the copper is more than 30 wt % of the nickel-copper alloy layer, a content of the phosphorus is less than 5 wt % of the nickel-copper alloy layer, and a corrosion potential of the nickel-copper alloy layer in a 0.02 vol % sulfuric acid solution is greater than ?20 mV. The copper layer is formed on a side of the nickel-copper alloy layer away from the polyimide substrate and combined with the nickel-copper alloy layer to form a metal conductive layer. In addition, the aforementioned flexible copper clad laminate has electrochemical corrosion resistance and sufficient peel strength, facilitating the production of flexible printed circuit boards.

Abstract: A method for recording a video conference and a video conferencing system are provided. The method includes: providing a user interface to a display device, in which the user interface includes a first area, a second area, and a timeline; in response to obtaining an image corresponding to each of multiple participants from a video signal through a person recognition algorithm, displaying the image of each participant in the first area; in response to converting an audio segment of one of the participants obtained from an audio signal into text content through a voice processing algorithm, associating the text content with the corresponding one of the participants, and based on an order of speaking, displaying the text content in the second area; and adjusting a time length of the timeline according to a recording time of the video conference.

Abstract: A method for switching audio reception in a video conference and a video conferencing system are provided. In a case of starting the video conference, relative positions of participants in a conference space and behavioral events of participants are obtained by identifying a video signal. Based on the behavioral event of each participant, whether each participant is in a non-speaking behavior is determined. When a participant is determined to be a non-speaker in the non-speaking behavior, an audio reception range of an audio reception device is adjusted to filter a voice of the non-speaker based on the relative position of the non-speaker in the conference space. When a participant is determined to be a speaker not in the non-speaking behavior, the audio reception range of the audio reception device is adjusted to receive a voice of the speaker based on the relative position of the speaker in the conference space.

Abstract: Disclosed are a headphone and an operating method thereof. The headphone includes a headband frame, a speaker module, a detector and a controller. The speaker module is disposed on the headband frame. The detector is disposed in the headband frame and detect stress changes on the headband frame to output a frequency response voltage value. The controller is electrically connected to the speaker module and the detector, and receives the frequency response voltage value. The controller determines whether the frequency response voltage value is the same as a target frequency response voltage value to read a target frequency response parameter corresponding to the target frequency response voltage value. The controller drives the speaker module according to the target frequency response parameter.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A computer power supply assembly (PSA) is provided. The PSA comprises an AC/DC power supply unit (PSU) and a DC/DC converter module. The DC/DC converter module is attached to the AC/DC power supply unit via conductor which may be a conductive bridge that holds the AC/DC PSU in fixed relation to the DC/DC converter module, or may be a conductive cable with, for example, a twist connector. The DC/DC converter module is replaceable and interchangeable. Different types of DC/DC converter modules having different numbers and combinations of connectors for attachment to the electronics system devices and different wattage and efficiency can be electrically connected to the PSU via the one conductor.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through substrate via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through substrate via.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: Disclosed herein are novel single-stranded anti-sense oligonucleotides (ASOs) capable of reducing the transcription of thioredoxin domain containing protein 5 (TXNDC5) mRNA. Also disclosed is use of the single-stranded ASOs as disclosed herein for manufacturing medicaments suitable for treating a disease associated with upregulation of TXNDC5. Accordingly, a pharmaceutical composition comprising the disclosed ASO molecules is provided; as well as a method of treating a subject suffering from TXNDC5-mediated disease via administering to the subject the disclosed single-stranded ASO molecules.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: A vacuum breaker valve includes a valve body and a vacuum breaking device mounted in the valve body. The valve body has a periphery provided with multiple air vent holes corresponding to the vacuum breaking device. The vacuum breaking device includes a mounting barrel, an elastic member, a braking member, a mounting plate, a water stop gasket, and a water inlet disk. The vacuum breaking device is assembled previously and then directly fitted into the valve body to construct the vacuum breaker valve. Thus, the vacuum breaking device and the valve body are combined together for a whole sale or the vacuum breaking device and the valve body are sold individually.

Abstract: A vacuum breaker valve includes a valve body and a vacuum breaking device mounted in the valve body. The valve body has a periphery provided with multiple air vent holes corresponding to the vacuum breaking device. The vacuum breaking device includes a mounting barrel, an elastic member, a braking member, a mounting plate, a water stop gasket, and a water inlet disk. The vacuum breaking device is assembled previously and then directly fitted into the valve body to construct the vacuum breaker valve. Thus, the vacuum breaking device and the valve body are combined together for a whole sale or the vacuum breaking device and the valve body are sold individually.

Abstract: An assembly of an electronic device and a stand includes an electronic device, a stand and two springs. The electronic device includes two first clutches located on both sides of the electronic device. The stand includes two pivot ends which are symmetrically pivoted to the both sides of the electronic device. Each pivot end includes a second clutch formed to an inside thereof and engaged with the first clutch of the electronic device to form a locking position and an unlocking position. The springs are respectively located between the electronic device and the stand. When no external force applied, each pivot end engaged with the first clutch corresponding thereto to form a locking position. When each pivot end is pulled in a direction away from the first clutch, the second clutch is disengaged from the first clutch to form an unlocking position, and the stand is pivotable relative to the electronic device.

Abstract: Disclosed is a headphone including a headband and two ear cups connected to opposite ends of the headband. Each of the ear cups includes a shell, a front cover, and a light sensor. The shell has an open end. The front cover covers the open end of the shell. The front cover is in a basin form and has a peripheral sidewall and a bottom wall. The light sensor is located on the peripheral sidewall of the front cover. The light sensor includes a light-emitting unit and a light detection unit. When a user wears the headphone, light emitted by the light-emitting unit irradiates a flat portion of a back surface of an ear of the user.

Abstract: Disclosed is a headphone including a headband and two ear cups connected to opposite ends of the headband. Each of the ear cups includes a shell, a front cover, and a light sensor. The shell has an open end. The front cover covers the open end of the shell. The front cover is in a basin form and has a peripheral sidewall and a bottom wall. The light sensor is located on the peripheral sidewall of the front cover. The light sensor includes a light-emitting unit and a light detection unit. When a user wears the headphone, light emitted by the light-emitting unit irradiates a flat portion of a back surface of an ear of the user.

Abstract: Disclosed is an open ear headphone, including a housing, a speaker arranged in an accommodating space inside the housing to define the accommodating space into a front cavity and a rear cavity, a connecting member including opposite first and second ends, and a supporting member connected to the second end and including a supporting portion and a sound outlet channel. A sound outlet is provided on a surface of the housing and is in acoustic communication with the front cavity. The first end is connected to the surface of the housing. When a user wears the open ear headphone, the housing is located in a concha cavity of the user's ear, the supporting portion at least leans against a lower edge of the concha cavity, and the sound outlet channel is in acoustic communication with the user's ear canal and is not in contact with the user's ear.

Abstract: Disclosed is an open ear headphone, including a housing, a speaker arranged in an accommodating space inside the housing to define the accommodating space into a front cavity and a rear cavity, a connecting member including opposite first and second ends, and a supporting member connected to the second end and including a supporting portion and a sound outlet channel. A sound outlet is provided on a surface of the housing and is in acoustic communication with the front cavity. The first end is connected to the surface of the housing. When a user wears the open ear headphone, the housing is located in a concha cavity of the user's ear, the supporting portion at least leans against a lower edge of the concha cavity, and the sound outlet channel is in acoustic communication with the user's ear canal and is not in contact with the user's ear.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing member and a transmission member. The sensing member protrudes from a front end of the shell and has a conductor. The sensing member is electrically connected to the sensing chip by the transmission member. A material of the sensing member is different from a material of the shell.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.