Abstract: Disclosed is a headphone including a headband and two ear cups connected to opposite ends of the headband. Each of the ear cups includes a shell, a front cover, and a light sensor. The shell has an open end. The front cover covers the open end of the shell. The front cover is in a basin form and has a peripheral sidewall and a bottom wall. The light sensor is located on the peripheral sidewall of the front cover. The light sensor includes a light-emitting unit and a light detection unit. When a user wears the headphone, light emitted by the light-emitting unit irradiates a flat portion of a back surface of an ear of the user.

Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: Various embodiments of the present disclosure are directed towards a three-dimensional (3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first substrate overlies a second substrate so a front side of the first substrate faces a front side of the second substrate. A first trench capacitor and a second trench capacitor extend respectively into the front sides of the first and second substrates. A plurality of wires and a plurality of vias are stacked between and electrically coupled to the first and second trench capacitors. A first through substrate via (TSV) extends through the first substrate from a back side of the first substrate, and the wires and the vias electrically couple the first TSV to the first and second trench capacitors. The first and second trench capacitors and the electrical coupling therebetween collectively define the 3D trench capacitor.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: A memory access speed adjustment method, control device and memory module are provided. The method is for use in controlling a controller of a memory and includes steps of: obtaining a current temperature value of the memory; determining an access speed threshold of the memory according to a continuous variation relation with respect to a difference between the current temperature value and a target temperature value; and adjusting, by the controller, an access speed of the memory according to the access speed threshold.

Abstract: Disclosed is a headphone including a headband and two ear cups connected to opposite ends of the headband. Each of the ear cups includes a shell, a front cover, and a light sensor. The shell has an open end. The front cover covers the open end of the shell. The front cover is in a basin form and has a peripheral sidewall and a bottom wall. The light sensor is located on the peripheral sidewall of the front cover. The light sensor includes a light-emitting unit and a light detection unit. When a user wears the headphone, light emitted by the light-emitting unit irradiates a flat portion of a back surface of an ear of the user.

Abstract: Disclosed is an open ear headphone, including a housing, a speaker arranged in an accommodating space inside the housing to define the accommodating space into a front cavity and a rear cavity, a connecting member including opposite first and second ends, and a supporting member connected to the second end and including a supporting portion and a sound outlet channel. A sound outlet is provided on a surface of the housing and is in acoustic communication with the front cavity. The first end is connected to the surface of the housing. When a user wears the open ear headphone, the housing is located in a concha cavity of the user's ear, the supporting portion at least leans against a lower edge of the concha cavity, and the sound outlet channel is in acoustic communication with the user's ear canal and is not in contact with the user's ear.

Abstract: Disclosed is an open ear headphone, including a housing, a speaker arranged in an accommodating space inside the housing to define the accommodating space into a front cavity and a rear cavity, a connecting member including opposite first and second ends, and a supporting member connected to the second end and including a supporting portion and a sound outlet channel. A sound outlet is provided on a surface of the housing and is in acoustic communication with the front cavity. The first end is connected to the surface of the housing. When a user wears the open ear headphone, the housing is located in a concha cavity of the user's ear, the supporting portion at least leans against a lower edge of the concha cavity, and the sound outlet channel is in acoustic communication with the user's ear canal and is not in contact with the user's ear.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing member and a transmission member. The sensing member protrudes from a front end of the shell and has a conductor. The sensing member is electrically connected to the sensing chip by the transmission member. A material of the sensing member is different from a material of the shell.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: An earbud including a main body, a sound guiding structure, a battery, and a sensor is provided. A geometric shape of the main body has a long axis and a short axis orthogonal to each other. When the earbud is worn, the main body is housed in a concha cavity of a user, and a tragus of the user and the long axis are located on a same level. The sound guiding structure extends away from the main body from the long axis of the main body. The battery and the sensor are disposed in the main body, and the sensor is adjacent to a periphery of the battery.

Abstract: An adjustable stand for mobile devices includes a board-like body, and a first holding unit and a second holding unit. The first holding unit is movable between the upper end and the bottom end of the body. The second holding unit is movable between the left side and the right side of the body. Two lateral members are respectively connected to the left side and the right side of the body. A support includes a bar with two arms extending from two ends of the bar. Each arm has a connector and two connectors are pivotably connected to the left and right sides of the body. The bar can be put on a desk top. The mobile device is positioned by the first and second holding units.

Abstract: A wireless earphone includes an earphone body with a concha contact surface. A sound outlet tube protrudes out from the concha contact surface. A convex positioning portion protrudes out from the concha contact surface. A laid slot is located on the concha contact surface and adjacent to the convex positioning portion. When the earphone body is mounted on a human ear, the concha contact surface is configured to face a concha of the human ear, the sound outlet tube is configured to insert into an auditory canal of the human ear, the convex positioning portion is configured to fit within a cavum of the human ear, and the laid slot is configured to fit within a crux helix of the human ear.

Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing member and a transmission member. The sensing member protrudes from a front end of the shell and has a conductor. The sensing member is electrically connected to the sensing chip by the transmission member. A material of the sensing member is different from a material of the shell.

Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing sound tube and a transmission member. The sensing sound tube protrudes from a front end of the shell and has a conductor. The sensing sound tube is electrically connected to the sensing chip by the transmission member. A material of the sensing sound tube is different from a material of the shell.

Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing sound tube and a transmission member. The sensing sound tube protrudes from a front end of the shell and has a conductor. The sensing sound tube is electrically connected to the sensing chip by the transmission member. A material of the sensing sound tube is different from a material of the shell.

Abstract: A wireless earphone includes an earphone body with a concha contact surface. A sound outlet tube protrudes out from the concha contact surface. A convex positioning portion protrudes out from the concha contact surface. A laid slot is located on the concha contact surface and adjacent to the convex positioning portion. When the earphone body is mounted on a human ear, the concha contact surface is configured to face a concha of the human ear, the sound outlet tube is configured to insert into an auditory canal of the human ear, the convex positioning portion is configured to fit within a cavum of the human ear, and the laid slot is configured to fit within a crux helix of the human ear.