Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: An SOT MRAM structure includes a word line. A second source/drain doping region and a fourth source/drain doping region are disposed at the same side of the word line. A first conductive line contacts the second source/drain doping region. A second conductive line contacts the fourth source/drain doping region. The second conductive line includes a third metal pad. A memory element contacts an end of the first conductive line. A second SOT element covers and contacts a top surface of the memory element. The third metal pad covers and contacts part of the top surface of the second SOT element.

Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.

Abstract: A semiconductor structure includes a die and a first connector. The first connector is disposed on the die. The first connector includes a first connecting housing, a first connecting element and a first connecting portion. The first connecting element is electrically connected to the die and disposed at a first side of the first connecting housing. The first connecting portion is disposed at a second side different from the first side of the first connecting housing, wherein the first connecting portion is one of a hole and a protrusion with respect to a surface of the second side of the first connecting housing.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A power generating structure comprises a front magnetic disc, a rear magnetic disc, and a coil disc disposed between the front and the rear magnetic discs. The coil disc is provided with a plurality of coil units radially arranged. Each coil unit includes a plurality of coils each with different turns of insulated wire. The front and the rear magnetic discs are respectively provided with a plurality of magnetic elements radially arranged. The coil disc is fixed to a shaft at a center thereof. The shaft extends outwardly from the rear magnetic disc. A plurality of blades can be attached to a periphery of the front or the rear magnetic disc. Therefore, the blades can be driven to rotate the front and the rear magnetic discs to have the coils of coil units continuously induced different voltages by the magnetic elements to supply various equipment.

Abstract: A power generating structure comprises a front magnetic disc, a rear magnetic disc, and a coil disc disposed between the front and the rear magnetic discs. The coil disc is provided with a plurality of coil units radially arranged. Each coil unit includes a plurality of coils each with a specific turn. The front and the rear magnetic discs are respectively provided with a plurality of magnetic elements radially arranged. The coil disc is fixed to a shaft at a center thereof. The shaft extends outwardly from the rear magnetic disc. A plurality of blades can be attached to a periphery of the front or the rear magnetic disc. Therefore, the blades can be driven to rotate the front and the rear magnetic discs to have the coils of coil units continuously induced different voltages by the magnetic elements to supply wind power equipments, electrical cars and so on.

Abstract: The security device contains at least a main unit with a number of wired external sensors and detectors. The main unit itself has built-in image capturing and motion detection capabilities that can be operated independently or to provide additional confirmation to the events detected by the external sensors and detectors. The main unit contains a radio transceiver member capable of conducting two-way, real-time and message-based, mobile communications via a mobile communication network. As such, whenever some abnormality is detected, the main unit is able to dial a specific party to play pre-recorded voice message and/or send captured images or video clips in real time or in some messages.

Abstract: The security device contains at least a main unit with a number of wired external sensors and detectors. The main unit itself has built-in image capturing and motion detection capabilities that can be operated independently or to provide additional confirmation to the events detected by the external sensors and detectors. The main unit contains a radio transceiver member capable of conducting two-way, real-time and message-based, mobile communications via a mobile communication network. As such, whenever some abnormality is detected, the main unit is able to dial a specific party to play pre-recorded voice message and/or send captured images or video clips in real time or in some messages.

Abstract: The anti-theft device contains a control circuit housed in a casing. The control circuit contains a microprocessor, a memory, a detection unit, a radio unit, and a GPS unit, and is connected to a supersonic sensor, a microwave sensor, an air-pressure sensor, and one ore more image capturing elements. When the motor vehicle is broken in, the control circuit detects such an event by evaluating the multiple signals collected by the sensors, and by processing the images captured by the image capturing elements. The control circuit then dials a preset numbers and plays a pre-recorded voice message asking for help. In the mean time, the continuous images captured by the image capturing elements are delivered a predetermined mobile phone or a computer so that the owner of the motor vehicle or some other people could monitor what is happening at the scene.

Abstract: The fire alarming device contains a base member and a transparent dome member. A control circuit is housed inside the base member, and at least an infrared camera is housed inside the dome member. The camera can be manually adjusted so that it aims at a specific spot. The camera, as well as at least a smoke detector, is electrically and signally connected to the control circuit in the base member. The control circuit mainly contains a microprocessor, a memory for storing a control program executed by the microprocessor and other relevant data, and a radio transmitter and receiver unit. The radio transmitter and receiver unit is capable of making and receiving phone calls and sending and receiving messages (such as SMS or MMS or email) via a mobile communication network such as one of those supporting GSM and other appropriate protocols such as GPRS.

Abstract: A protective lock structure mainly including a main body, interior of which is disposed a control circuit assembled from a microprocessor, a memory, a high frequency transmitter circuit. The main body is connected to monitoring equipment, including an infrared camera, an infrared hot body sensing component, a sound pickup and speakers. Moreover, the main body is connected to an electric controlled lock, thereby enabling a cellular phone handset to dial out a telephone number and preset code, which the control circuit of the main body identifies and compares to ensure correctness before unlocking the electric controlled lock, thus providing a lock device with even greater safety and protective effectiveness.