Abstract: A method for increasing touch sampling rate and a touch display device using the same are provided, wherein the touch display device comprises a timing controller and a display panel. A timing control signal is provided by the timing controller. Each cycle of the timing control signal comprises a blanking period and a frame period, every N frame periods correspond to one image frame of a video signal, and every N blanking periods and every N frame periods correspond to one cycle of the video signal, where N is a positive integer larger than 1. Through the timing control signal, the touch display device arranges the timing for driving the display panel to display frame images and to sense touch, whereby increasing the touch sampling rate thereof.

Abstract: A method for fabricating a thermally enhanced semiconductor package including the steps of providing a substrate having a first surface and a second surface; providing a die on the first surface of the substrate and electrically connecting the die with the substrate; placing the die, the substrate, and a heat slug in a mold cavity defined by a mold cast, the mold cast having a protruding portion that touches the periphery on the surface of the heat slug, wherein the contact area is defined as a periphery region and the non-contact area enclosed by the periphery region is defined as a central region; and encapsulating the die and the heat slug by molding materials, wherein the periphery region and the central region of the heat slug are exposed to the ambient air.

Abstract: A system for detecting the processing speed of an integrated circuit (IC) includes a flip-flop, a delay module, and a judge unit. The flip-flop receives a clock signal as a trigger signal and generates an inverted output signal. The delay module receives the inverted output signal, adjusts the delay time of the inverted output signal according to a selection signal, and outputs a delay signal to the flip-flop to have the flip-flop generate the output signal. The judge unit receives the output signal and generates a judge signal, which is enabled when the clock period of the output signal is longer than that of the clock signal.

Abstract: A packaging structure and an assembly method are disclosed. A packaging structure includes a substrate, a die, conductive wires, and conductively filled material. The substrate includes a conductive structure, and the conductive wires are insulator-coated. The die is mounted on the substrate, and the conductive wires are connected between the die and the conductive structure. The conductively filled material is formed among the conductive wires. In the assembly method, the die is firstly mounted on the substrate, followed by connecting the conductive wires between the die and the conductive structure, and finally forming the conductively filled material among the conductive wires.