Abstract: An imaging lens assembly module includes a lens barrel, a catadioptric lens assembly, an imaging lens assembly, a first fixing element and a second fixing element. The lens barrel has a first relying surface and a second relying surface, which face towards an object side of the imaging lens assembly module. The catadioptric lens assembly relies on the first relying surface. The imaging lens assembly is disposed on an image side of the catadioptric lens assembly, and relies on the second relying surface. The first fixing element is for fixing the catadioptric lens assembly to the lens barrel. The second fixing element is for fixing the imaging lens assembly to the lens barrel. The catadioptric lens assembly is for processing at least twice internal reflections of an image light in the imaging lens assembly module, and for providing optical refractive power.

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive pad having a generally planar top surface that includes a cavity having a bottom surface and sidewalls extending from the bottom surface of the cavity to the top surface of the pad. An electronic device is attached to the top surface of the electrically conductive pad. A wire bond is attached from the electronic device to the bottom surface of the cavity. A molding compound encapsulates the electronic device.

Abstract: The application discloses a bonding method, a display backplane and a system for manufacturing the display backplane. The method includes: providing a substrate, and forming a plurality of first metal bumps on the substrate; providing a transfer device to transfer the plurality of the first metal bumps to a TFT substrate to form a plurality of pairs of metal pads on the TFT substrate, wherein each pair of the metal pads include two of the first metal bumps; and providing a plurality of LED flip chips, and transferring the plurality of LED flip chips to the TFT substrate by using the transfer device to bond electrodes of each of the LED flip chips to one pair of the metal pads respectively.

Abstract: The application discloses a die bonding method of an LED chip and a display device. The method may include: a welding material is fixed on a metal pad of the LED chip, the LED chip fixed with the welding material is transferred onto a transient substrate, the metal pad of the LED chip on the transient substrate is aligned with a bonding pad on a receiving substrate, the welding material fixed on the LED chip is heated, and then the LED chip is fixed on the receiving substrate.

Abstract: A fan-out wafer level light-emitting diode package method for packaging a plurality of light-emitting diode chips on a wafer protective film, the method comprising: forming a package surface layer on first electrodes of the light-emitting diode chips, and then forming a plurality of leading electrodes electrically connected to the first electrodes on the package surface layer, cutting the light-emitting diode chips, sorting and testing as well as regrouping the light-emitting diode chips, covering sides of the light-emitting diode chips with a package layer, drilling and filling a conductive material on the package layer to form a plurality of common electrodes, and then printing a plurality of common electrical circuits, electrically connecting each of the common electrical circuits to one of the common electrodes and the leading electrodes, and finally covering with a circuit protection layer to complete the process.

Abstract: An optical measuring apparatus and an operating method thereof are disclosed. The optical measuring apparatus includes a light source, a carrier chip, a light sensor, an analyzing chip and a display. Samples are uniformly distributed on the carrier chip. The light source emits sensing lights toward the carrier chip. The light sensor receives the sensing lights passing through the carrier chip at a plurality of times to obtain a plurality of images corresponding to the plurality of times respectively. The analyzing chip is coupled to the light sensor. The analyzing chip analyzes the object number and distribution variation with time in the sample according to the plurality of images corresponding to the plurality of times and estimates intrinsic characteristics of the object in the sample accordingly. The display is coupled to the analyzing chip. The display displays the intrinsic characteristics of the object in the sample.

Abstract: An optical measuring apparatus and an operating method thereof are disclosed. The optical measuring apparatus includes a light source, a carrier chip, a light sensor, an analyzing chip and a display. Samples are uniformly distributed on the carrier chip. The light source emits sensing lights toward the carrier chip. The light sensor receives the sensing lights passing through the carrier chip at a plurality of times to obtain a plurality of images corresponding to the plurality of times respectively. The analyzing chip is coupled to the light sensor. The analyzing chip analyzes the object number and distribution variation with time in the sample according to the plurality of images corresponding to the plurality of times and estimates intrinsic characteristics of the object in the sample accordingly. The display is coupled to the analyzing chip. The display displays the intrinsic characteristics of the object in the sample.

Abstract: A positioning system includes a first working platform, a second working platform spaced apart from the first working platform, and a carrier. The carrier is fixed on the first working platform or the second working platform. The carrier has at least one fixing member for fixing the substrate onto the carrier and fixing the mask onto the substrate. The substrate has at least one fixing hole formed thereon for receiving the fixing member, and the mask has at least one positioning hole formed thereon in alignment with the fixing hole. The fixing member is capable of inserting sequentially through the fixing hole of the substrate and the positioning hole of the mask.

Abstract: A positioning system includes a first working platform, a second working platform spaced apart from the first working platform, and a carrier. The carrier is fixed on the first working platform or the second working platform. The carrier has at least one fixing member for fixing the substrate onto the carrier and fixing the mask onto the substrate. The substrate has at least one fixing hole formed thereon for receiving the fixing member, and the mask has at least one positioning hole formed thereon in alignment with the fixing hole. The fixing member is capable of inserting sequentially through the fixing hole of the substrate and the positioning hole of the mask.