Abstract: A circuit board includes a conductive metal layer, at least one insulating layer, at least one thermally conductive insulating layer and a heat dissipation element. The conductive metal layer is mainly used to transmit electronic signals. The insulating layer is connected to the conductive metal layer. The thermally conductive insulating layer is sandwiched between the conductive metal layer and the insulating layer, and thermally contacts the conductive metal layer, and is used for thermally conducting the heat of the conductive metal layer. The heat dissipation element is in thermal contact with the thermally conductive insulating layer, and is used to conduct the heat of the thermally conductive insulating layer to the outside through a heat dissipation channel.

Abstract: A substrate is manufactured by drilling a chip containing groove in a composite inner layer circuit structure, having a component connecting end of a circuit layer protruding from a mounting side wall in the chip containing groove, mounting a chip component in the chip containing groove, and connecting the surface bonding pad to the component connecting end. The chip component in the present invention penetrates at least two circuit layers, and the surface bonding pad is bonded to the component connecting end of the circuit layer directly, reducing the occupied area of the chip component in each one of the circuit layers, and increasing the area for circuit disposing and the possible amount of chip components that may be mounted in the substrate.

Abstract: A circuit board includes a conductive metal layer, at least one insulating layer, at least one thermally conductive insulating layer and a heat dissipation element. The conductive metal layer is mainly used to transmit electronic signals. The insulating layer is connected to the conductive metal layer. The thermally conductive insulating layer is sandwiched between the conductive metal layer and the insulating layer, and thermally contacts the conductive metal layer, and is used for thermally conducting the heat of the conductive metal layer. The heat dissipation element is in thermal contact with the thermally conductive insulating layer, and is used to conduct the heat of the thermally conductive insulating layer to the outside through a heat dissipation channel.

Abstract: A packaging method includes steps of: forming first and second wiring layers electrically connected to each other on two opposite surfaces of a substrate; then configuring mother substrate interconnecting bumps on the first wiring layer and along perimeter of a daughter substrate unit, and then cutting along the perimeter of the daughter substrate unit to expose lateral faces of the mother substrate interconnecting bumps and configuring solder materials thereon; then configuring first and second chips on the first and the second wiring layers to form electrical interconnection between the two chips. A package structure enables interconnecting two chips through one single daughter substrate unit with its wiring layers directly connecting with lateral face contacts of the mother carrier substrate through the mother substrate interconnecting bumps.

Abstract: A packaging method includes steps of: forming first and second wiring layers electrically connected to each other on two opposite surfaces of a substrate; then configuring mother substrate interconnecting bumps on the first wiring layer and along perimeter of a daughter substrate unit, and then cutting along the perimeter of the daughter substrate unit to expose lateral faces of the mother substrate interconnecting bumps and configuring solder materials thereon; then configuring first and second chips on the first and the second wiring layers to form electrical interconnection between the two chips. A package structure enables interconnecting two chips through one single daughter substrate unit with its wiring layers directly connecting with lateral face contacts of the mother carrier substrate through the mother substrate interconnecting bumps.

Abstract: A substrate is manufactured by drilling a chip containing groove in a composite inner layer circuit structure, having a component connecting end of a circuit layer protruding from a mounting side wall in the chip containing groove, mounting a chip component in the chip containing groove, and connecting the surface bonding pad to the component connecting end. The chip component in the present invention penetrates at least two circuit layers, and the surface bonding pad is bonded to the component connecting end of the circuit layer directly, reducing the occupied area of the chip component in each one of the circuit layers, and increasing the area for circuit disposing and the possible amount of chip components that may be mounted in the substrate.

Abstract: A common mode inductor apparatus includes a magnetic core, a first coil winding and a second coil winding. The magnetic core has a first winding zone and a second winding zone. The first coil winding is wound in three winding areas within the first winding zone, wherein two neighboring winding areas within the first winding zone are separated by a gap. The second coil winding is wound in three winding areas within the second winding zone, wherein two neighboring winding areas within the second winding zone are separated by a gap.

Abstract: The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.

Abstract: The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.

Abstract: A method for treating a microbial infection in a subject includes administering to the subject a pharmaceutical composition which has a therapeutically effective amount of an antimicrobial peptide containing a derivative of P-113.

Abstract: A common mode inductor apparatus includes a magnetic core, a first coil winding and a second coil winding. The magnetic core has a first winding zone and a second winding zone. The first coil winding is wound in three winding areas within the first winding zone, wherein two neighboring winding areas within the first winding zone are separated by a gap. The second coil winding is wound in three winding areas within the second winding zone, wherein two neighboring winding areas within the second winding zone are separated by a gap.

Abstract: An antimicrobial peptide which is a derivative of the peptide P-113. The amino acid sequence of the antimicrobial peptide is SEQ ID NO: 4 or SEQ ID NO: 5, in which the C-terminus is or is not modified with a NH2.

Abstract: A method for treating a microbial infection in a subject includes administering to the subject a pharmaceutical composition which has a therapeutically effective amount of an antimicrobial peptide containing a derivative of P-113.

Abstract: The present invention provides an antimicrobial peptide, wherein the antimicrobial peptide comprises SEQ ID NO: 4.

Abstract: The present invention provides an anti-bacterial peptide which has anti-fungal and anti-bacterial effect. The anti-bacterial peptide is a novel peptide sequence, wherein the peptide sequence comprises a sequence of at least two SEQ ID NO: 1. The present invention also provides a method for treating a subject infected with a fungus and a bacterium, which comprises providing the subject with an anti-bacterial peptide, wherein the anti-bacterial peptide comprises a sequence of at least two SEQ ID NO: 1.