Abstract: A compound semiconductor device includes a substrate, a channel layer on the substrate, a barrier layer on the channel layer, a passivation layer on the barrier layer, and a contact area recessed into the passivation layer and the barrier layer. The channel layer is partially exposed at a bottom of the contact area. Abi-layer silicide film is disposed on the contact area.

Abstract: A manufacturing method of a semiconductor structure includes at least the following steps. A memory device is formed in an interconnect structure over a substrate. Forming the memory device includes forming an alternating stack of dielectric material layers and conductive material layers, wherein the alternating stack includes a memory array region and a staircase region adjacent to the memory array region; forming a trench on the memory array region of the alternating stack; forming a data storage layer, channel layers, bit line pillars, and source line pillars in the trench; and performing patterning processes to from a staircase structure on the staircase region. The staircase structure steps downward from a first direction and makes a 180-degree turn to step downward in a second direction opposite to the first direction.

Abstract: A calibration method for machine tools comprises: providing a workpiece on a machine tool; rotating the workpiece around a first rotation axis parallel to a main shaft of the machine tool and processing the workpiece by a first machining mode; measuring a first dimensional error of a shape of the workpiece along directions of first and second linear axes perpendicular to the first rotation axis; calculating a positional error of the first rotation axis according to the first dimensional error; rotating the workpiece around a second rotation axis perpendicular to the main shaft and processing the workpiece by a different second machining mode; measuring a second dimensional error of the shape of the workpiece along a direction of a third linear axis perpendicular to the second rotation axis; calculating a positional error of the second rotation axis according to the second dimensional error.

Abstract: A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.

Abstract: An interposer includes a substrate having an inductor forming region thereon, a plurality of trenches within the inductor forming region in the substrate, a buffer layer lining interior surfaces of the plurality of trenches and forming air gaps within the plurality of trenches, and an inductor coil pattern embedded in the buffer layer within the inductor forming region.

Abstract: A metal-insulator-metal capacitor includes a bottom electrode, a dielectric layer, a superlattice layer, a silicon dioxide layer and a top electrode stacked from bottom to top. The superlattice layer contacts the dielectric layer. A silicon dioxide layer has a negative voltage coefficient of capacitance.

Abstract: A structure of an MIM capacitor and a heat sink include a dielectric layer. The dielectric layer includes a capacitor region and a heat dispensing region. A bottom electrode is embedded in the dielectric layer. A first heat conductive layer covers the dielectric layer. A capacitor dielectric layer is disposed on the first heat conductive layer within the capacitor region. A second heat conductive layer covers and contacts the capacitor dielectric layer and the first heat conductive layer. A top electrode is disposed within the capacitor region and the heat dispensing region and covers the second heat conductive layer. A first heat sink is disposed within the heat dispensing region and contacts the top electrode. A second heat sink is disposed within the heat dispensing region and contacts the first heat conductive layer and the second heat conductive layer.

Abstract: A video device, a wireless audio device and a method for performing audio and video (AV) synchronization between the video device and the wireless audio device are provided. The method includes: utilizing a controller of the video device to determine a video delay of the video device; utilizing the controller to determine an audio delay of the video device; utilizing the controller to receive information of a communications quality of the wireless audio device from the wireless audio device, to determine a wireless communications delay between the video device and the wireless audio device according to the communications quality; utilizing the controller to generate a time map information according to the video delay, the audio delay and the wireless communications delay; and transmitting the time map information from the video device to the wireless audio device for AV synchronization between the video device and the wireless audio device.

Abstract: An amplifying circuit allows its loading circuit to contribute a transconductance to increase the bandwidth of the amplifying circuit, and thereby achieves common-mode stabilization. The amplifying circuit includes a first and a second amplifying circuit. The first amplifying circuit is coupled between a high-voltage terminal and a low-voltage terminal, and outputs a first amplified signal according to an input signal.

Abstract: The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.

Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.

Abstract: The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.

Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.

Abstract: A video device, a wireless audio device and a method for performing audio and video (AV) synchronization between the video device and the wireless audio device are provided. The method includes: utilizing a controller of the video device to determine a video delay of the video device; utilizing the controller to determine an audio delay of the video device; utilizing the controller to receive information of a communications quality of the wireless audio device from the wireless audio device, to determine a wireless communications delay between the video device and the wireless audio device according to the communications quality; utilizing the controller to generate a time map information according to the video delay, the audio delay and the wireless communications delay; and transmitting the time map information from the video device to the wireless audio device for AV synchronization between the video device and the wireless audio device.

Abstract: A portable electric fan is provided and includes a shell, a fan module, and a plurality of combined seat groups. The shell has a first surface, a second surface opposite to the first surface, and a surrounding side surface that is connected to the first surface and the second surface. The shell has a hollow portion. The fan module is mounted in the hollow portion. The combined seat groups are mounted on the surrounding side surface, and each of the combined seat groups includes two bases and a bracket detachably mounted to the two bases. Each of the two bases has a first through hole and a second through hole, and an extending length direction of the first through hole and an extending direction of the second through hole are staggered relative to the surrounding side surface.

Abstract: A ceiling fan and a surrounding device thereof are provided. The ceiling fan includes a main body, a bracket set connected to the main body, and a surrounding device connected to the bracket set. The main body includes a main shaft, a motor, and a plurality of ceiling fan blades. The bracket set includes a plurality of brackets, and each of the brackets has one end connected to the main shaft. The surrounding device is connected to another end of each of the brackets that is relatively far away from the main shaft, and the surrounding device is roundly arranged around and spaced apart from an end of each of the ceiling fan blades that is relatively far away from the motor. The surrounding device includes at least one functional component that is configured to disinfect or sterilize air or to provide lighting.

Abstract: A ceiling fan and a surrounding device thereof are provided. The ceiling fan includes a main body, a bracket set connected to the main body, and a surrounding device connected to the bracket set. The main body includes a main shaft, a motor, and a plurality of ceiling fan blades. The bracket set includes a plurality of brackets, and each of the brackets has one end connected to the main shaft. The surrounding device is connected to another end of each of the brackets that is relatively far away from the main shaft, and the surrounding device is roundly arranged around and spaced apart from an end of each of the ceiling fan blades that is relatively far away from the motor. The surrounding device includes at least one functional component that is configured to disinfect or sterilize air or to provide lighting.

Abstract: The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.

Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.