Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.

Abstract: The present disclosure relates to a method for treating a cancer and/or cancer metastasis in a subject comprising administering to the subject irinotecan loaded in a mesoporous silica nanoparticle. The present disclosure also provides a conjugate comprising an agent loaded in a mesoporous silica nanoparticle (MSN) defining at least one pore and having at least one functional group on a sidewall of the at least one pore.

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

Abstract: One or more techniques or systems for mitigating pattern collapse are provided herein. For example, a semiconductor structure for mitigating pattern collapse is formed. In some embodiments, the semiconductor structure includes an extreme low-k (ELK) dielectric region associated with a via or a metal line. For example, a first metal line portion and a second metal line portion are associated with a first lateral location and a second lateral location, respectively. In some embodiments, the first portion is formed based on a first stage of patterning and the second portion is formed based on a second stage of patterning. In this manner, pattern collapse associated with the semiconductor structure is mitigated, for example.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A method of using NC-MRA to generate pelvic veins images and measure rate of blood flow includes subjecting a lay patient to undergo magnetic resonance scan in cooperation with an ECG monitor and a respiration monitor; scanning coronary sections and transverse sections of kidney veins, lower cavity veins, common iliac veins, and external iliac veins to generate two-dimensional images wherein the two-dimensional images use balanced turbo field echo wave sequence; scanning coronary sections of common cardinal veins of abdominal cavity to generate three-dimensional images wherein the three-dimensional images use fast spin-echo short tau inversion recovery wave sequence and sample signals when the ECG monitor monitors myocardial contractility; and using quantification phase-contrast analysis to measure blood flowing through the transverse sections of the veins in a two-dimensional scan.

Abstract: A positioning system and a positioning method are provided. The positioning system includes a first positioning device, a second positioning device, a first processing device, and an output device. The first positioning device is used to position a mobile device, and the mobile device contains identification information. The first positioning device generates first positioning information based on the identification information. The second positioning device is used to position an object under test, and the object under test has a feature. The second positioning device generates second positioning information based on the feature. The first processing device generates third positioning information based selectively on the first positioning information and the second positioning information. The output device is used to output the third positioning information.

Abstract: A positioning system and a positioning method based on WI-FI® fingerprints are provided.

Abstract: A positioning system and a method based on neural network models are provided. The positioning method includes collecting WI-FI® fingerprint data; configuring a computing device to receive the WI-FI® fingerprint data, and the computing device includes a processor and a database storing positioning map data and a group of neural network models including a global positioning model, a coarse positioning model and a fine positioning model; configuring the processor to input the WI-FI® fingerprint data and perform the following steps: estimating a global coordinate through the global positioning model; obtaining the corresponding coarse positioning model from a corresponding primary sub-region to estimate an estimated coarse coordinate of a current position; estimating a plurality of estimated fine coordinates of the current position from the corresponding fine positioning model; and performing a merging process on the estimated fine coordinates to generate a final coordinate.

Abstract: A system for establishing positioning map data and a method for the same are provided.

Abstract: A positioning system and a positioning method based on WI-FI® fingerprints are provided.

Abstract: A positioning system and a method based on neural network models are provided. The positioning method includes collecting WI-FI® fingerprint data; configuring a computing device to receive the WI-FI® fingerprint data, and the computing device includes a processor and a database storing positioning map data and a group of neural network models including a global positioning model, a coarse positioning model and a fine positioning model; configuring the processor to input the WI-FI® fingerprint data and perform the following steps: estimating a global coordinate through the global positioning model; obtaining the corresponding coarse positioning model from a corresponding primary sub-region to estimate an estimated coarse coordinate of a current position; estimating a plurality of estimated fine coordinates of the current position from the corresponding fine positioning model; and performing a merging process on the estimated fine coordinates to generate a final coordinate.

Abstract: A system for establishing positioning map data and a method for the same are provided.

Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.

Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.

Abstract: A touch module for an electronic device is provided. The touch module includes a touch-sensitive plate, a light guide plate, a light-shielding plate and a translucent covering plate. The touch-sensitive plate includes plural light-emitting units. The light guide plate is disposed on the touch-sensitive plate. The light-shielding plate is located over the light guide plate. The light-shielding plate includes a hollow portion. The translucent covering plate is located over the light-shielding plate. The hollow portion is covered by the translucent covering plate. According to a touch signal, the touch-sensitive plate controls the plural light-emitting units to emit light beams to the light guide plate. After the light beams are transmitted through the hollow portion, the light beams are transferred to the translucent covering plate.

Abstract: A light source module includes a LED die, a supporting base and an encapsulation layer. The LED die emits a light beam. The supporting base is electrically connected with the LED die, and supports the LED die. After a portion of the light beam is projected to and reflected by the supporting base, the portion of the light beam is projected to surroundings through the LED die. The encapsulation layer covers the LED die and a portion of the supporting base to protect the LED die. The encapsulation layer includes a light-adjusting element. A light pattern of the light beam is adjustable according to a shape of the encapsulation layer.

Abstract: A manufacturing method of a light source module includes the following steps. Firstly, a light emitting diode die is installed on a supporting base. Then, an electric connection between the light emitting diode die and the supporting base is established. Then, a protective glue is formed on the light emitting diode die and the supporting base. Afterwards, the supporting base is cut to produce the light source module. Since the supporting plate is not employed, the supporting plate removing process and the boning process of the conventional technology are omitted. Consequently, the manufacturing method of the present invention is effective to enhance the production quality of the light source module.

Abstract: A keyboard device includes plural key structures, an electronic paper display element and an illumination module. The electronic paper display element is disposed under the plural key structures. The plural key symbols corresponding to the plural key structures are displayed on the electronic paper display element. The illumination module is disposed over the electronic paper display element to provide a light beam to the electronic paper display element. Consequently, the plural key symbols are illuminated.