Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A camera module of an electronic device includes a lens unit with a first coil, a vibration unit with a second coil, and a magnetic unit. The vibration unit is positioned outside the lens unit and spaces a first certain distance with the lens unit. The magnetic unit is positioned outside the vibration unit and spaces a second distance with the vibration unit. When the first coil receives electrical signal, the first coil is actuated to move with the lens unit. When the second coil receives electrical signal, the second coil is actuated to move with the vibration unit with the vibration unit. Therefore, the magnetic blocks are cooperated with the lens assembly and the vibration block, to make an automatic focusing function and a vibration function being combined in the camera module.

Abstract: A camera module of an electronic device includes a lens unit with a first coil, a vibration unit with a second coil, and a magnetic unit. The vibration unit is positioned outside the lens unit and spaces a first certain distance with the lens unit. The magnetic unit is positioned outside the vibration unit and spaces a second distance with the vibration unit. When the first coil receives electrical signal, the first coil is actuated to move with the lens unit. When the second coil receives electrical signal, the second coil is actuated to move with the vibration unit with the vibration unit. Therefore, the magnetic blocks are cooperated with the lens assembly and the vibration block, to make an automatic focusing function and a vibration function being combined in the camera module.