Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: The invention provides a multi-language communication method, comprising: providing to each of the persons access to a plurality of language options; receiving from each of one or more of the persons an indication of a respective choice of language chosen by the respective person from the language options; storing the language choices in a database; and making the language choices accessible by one or more applications so that the applications can when operated selectively provide output to each respective person in the respective language choice.