Patents by Inventor Chung-Yuan TSAI

Chung-Yuan TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package and method of manufacturing the same
    Patent number: 11652014
    Abstract: An electronic package and method for manufacturing the same are provided. The electronic package includes a first conductive structure, a second conductive structure, an electronic component, an underfill and a dam structure. The second conductive structure is disposed on the first conductive structure, wherein the second conductive structure defines a cavity over the first conductive structure. The electronic component is disposed on the first conductive structure and at least partially disposed in the cavity. The underfill is disposed between the first conductive structure and the electronic component. The dam structure is disposed on the first conductive structure and configured to confine the underfill.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: May 16, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Chung-Yuan Tsai
  • ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220102233
    Abstract: An electronic package and method for manufacturing the same are provided. The electronic package includes a first conductive structure, a second conductive structure, an electronic component, an underfill and a dam structure. The second conductive structure is disposed on the first conductive structure, wherein the second conductive structure defines a cavity over the first conductive structure. The electronic component is disposed on the first conductive structure and at least partially disposed in the cavity. The underfill is disposed between the first conductive structure and the electronic component. The dam structure is disposed on the first conductive structure and configured to confine the underfill.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 31, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chung-Yuan TSAI