Abstract: An impeller includes a hub and a plurality of blades. The blades are arranged around the hub, and each blade includes a leading edge, a blade tip, a root portion, a trailing edge, a windward side and a leeward side. The windward side including a first turning point and a second turning point, a first vertical height difference is formed from the blade tip to the first turning point, and a second vertical height difference is formed from the first turning point to the second turning point, and the first vertical height difference is greater than the second vertical height difference. The impeller apparently reduces the noise.

Abstract: A method for fabricating magnetoresistive random-access memory cells (MRAM) on a substrate is provided. The substrate is formed with a magnetic tunneling junction (MTJ) layer thereon. When the MTJ layer is etched to form the MRAM cells, there may be metal components deposited on a surface of the MRAM cells and between the MRAM cells. The metal components are then removed by chemical reaction. However, the removal of the metal components may form extra substances on the substrate. A further etching process is then performed to remove the extra substances by physical etching.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A metal-oxide-semiconductor field-effect transistor (MOSFET) includes a substrate, a source and a drain in the substrate, a gate electrode disposed over the substrate between the source and drain. An inner spacer is disposed at least partially over the gate electrode. An outer spacer is disposed adjacent to a sidewall of the gate electrode.

Abstract: A fastening unit includes a base, a fixing seat, two shaft seats, a main body, an engaging member, and an abutting member. The fixing seat and the two shaft seats are disposed on the base. The main body is detachably disposed on the two shaft seats. The engaging member is connected to the side of the main body that is away from the two shaft seats. The abutting member protrudes from the bottom surface of the main body. When the fastening unit is in a closed state, the engaging member engages with the fixing seat. As a result, the bottom surface faces the base, and the abutting member is adjacent to the base. When the fastening unit is transferred from the closed state to an opened state, the engaging member disengages from the fixing seat, and the main body pivots relative to the two shaft seats.

Abstract: A fastening unit includes a base, a fixing seat, two shaft seats, a main body, an engaging member, and an abutting member. The fixing seat and the two shaft seats are disposed on the base. The main body is detachably disposed on the two shaft seats. The engaging member is connected to the side of the main body that is away from the two shaft seats. The abutting member protrudes from the bottom surface of the main body. When the fastening unit is in a closed state, the engaging member engages with the fixing seat. As a result, the bottom surface faces the base, and the abutting member is adjacent to the base. When the fastening unit is transferred from the closed state to an opened state, the engaging member disengages from the fixing seat, and the main body pivots relative to the two shaft seats.

Abstract: Methods and apparatuses for sharing test pads among function blocks under test within multiple layers of a die are disclosed. A semiconductor wafer comprises a first die and a second die separated by a scribe line. A first pad, a second pad, and a third pad are located in the scribe line. The test pads may be located within a die as well. The first pad and the second pad are used to test a first function block within a first layer, and the first pad and the third pad are used to test a second function block within a second layer of the first die. The shared first test pad are used to test multiple function blocks contained in different layers of the die. Therefore fewer test pads are needed which leads to reduced area for scribe lines in a wafer.

Abstract: Methods and apparatuses for sharing test pads among function blocks under test within multiple layers of a die are disclosed. A semiconductor wafer comprises a first die and a second die separated by a scribe line. A first pad, a second pad, and a third pad are located in the scribe line. The test pads may be located within a die as well. The first pad and the second pad are used to test a first function block within a first layer, and the first pad and the third pad are used to test a second function block within a second layer of the first die. The shared first test pad are used to test multiple function blocks contained in different layers of the die. Therefore fewer test pads are needed which leads to reduced area for scribe lines in a wafer.

Abstract: A liquid refrigeration system for providing cooling operations, including an evaporator with its refrigerant outlet connected to a vapor/liquid separator so that refrigerant in the refrigerant conduits in the evaporator may undergo heat exchange in the form of a mixture of vapor and liquid. The compressor of the system outputs high pressure refrigerant vapor which passes through a specially designed condenser before being conveyed to a thermostatic expansion valve at the front end of the inlet of the evaporator. Low-pressure oil-rich liquid refrigerant separated by the vapor/liquid separator first passes through the condenser to become superheated vapor and it is then sent to the suction line of the compressor together with the saturated refrigerant vapor from the vapor/liquid separator. The expansion valve meters the flow rate of system refrigerant and has a temperature sensor which detects the superheat of the low pressure refrigerant vapor leaving the condenser.