Patents by Inventor Chung-Yung Sun

Chung-Yung Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6452800
    Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: September 17, 2002
    Assignee: Hon Hai Precision Ind., Co., Ltd.
    Inventors: Chao-Yang Lee, Chao Kun Tseng, Chung-Yung Sun, Wei-Ta Lo
  • Patent number: 6412546
    Abstract: A heat dissipation device includes a heat sink (80) and an assembling device for securing the heat sink to a, chip (90) mounted on a printed circuit board (100). The heat sink has a pair of ears (82) each defining an aperture (84) therein. The assembling device includes a clip (70), a pair of sleeves (50) each defining a cavity (62) therethrough, and a pair of springs (60). Each sleeve extends through the aperture of a corresponding ear of the heat sink, and the springs are disposed respectively between the ears and an end of the sleeves. The clip has a pair of posts (66) for extending through the printed circuit board to engage with the corresponding cavities.
    Type: Grant
    Filed: July 17, 2000
    Date of Patent: July 2, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yeu-Lih Lin, Chao-Yang Lee, Chung-Yung Sun, Chao Kun Tseng
  • Patent number: 6341644
    Abstract: A heat sink assembly includes a fan, a heat sink, and a fixing device which attaches the fan to the heat sink. The heat sink has a plurality of fins. Four catches are respectively formed on four outermost fins, two on each of two longitudinal sides of the base. The fixing device has a base and four legs depending from respective corners of the base. A pair of protrusions depends from the base near respective lateral sides of the base. Four poles extend upwardly from the base near respective corners of the base. Each leg defines an aperture for engaging with the corresponding catch of the heat sink. The fan defines four through holes for respectively receiving the poles of the fixing device.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Wei-Ta Lo, Chung-Yung Sun
  • Patent number: 6333850
    Abstract: A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element comprises a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure near the opening. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: December 25, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsien-Shen Pei, Chung-Yung Sun, Chao-Yang Lee
  • Patent number: 6320746
    Abstract: A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element includes a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: November 20, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsien-Shen Pei, Chung-Yung Sun, Chao-Yang Lee
  • Patent number: 6311765
    Abstract: A heat sink assembly includes a heat sink, a clip and a fastener. The heat sink includes a base and a plurality of fins extending upwardly from the base. A slot is defined between the fins. Grooves are defined on opposite sides of a particular row of the fins. The clip defines a spring portion received in the slot of the heat sink. The curved fastener forms a pair of projections with a gap defined therebetween extending inwardly from both ends of the fastener for engaging the corresponding grooves of the heat sink. A tab is defined on one side of the fastener for engagement with an edge of one of the fins.
    Type: Grant
    Filed: August 3, 2000
    Date of Patent: November 6, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Wei-Ta Lo, Chung-Yung Sun, Chao-Yang Lee
  • Publication number: 20010030853
    Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.
    Type: Application
    Filed: June 18, 2001
    Publication date: October 18, 2001
    Inventors: Chao-Yang Lee, Chao Kun Tseng, Chung-Yung Sun, Wei-Ta Lo
  • Publication number: 20010005310
    Abstract: A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element includes a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.
    Type: Application
    Filed: January 25, 2001
    Publication date: June 28, 2001
    Inventors: Hsien-Shen Pei, Chung-Yung Sun, Chao-Yang Lee