Abstract: A radioactivity measuring apparatus with a rotating stage for waste drums is provided, which includes a case, a plurality of radioactive counters, a rotation unit, and a control unit. The case has an opening and an accommodating space in communication with the opening. A shielding gate is connected to one side of the opening. The plurality of radioactive counters is disposed in the accommodating space, and used for detecting a radioactive counting associated with a sample. The rotation unit is disposed at a wall on a side of the shielding gate corresponding to the opening, and used for supporting the sample. The control unit is electrically connected to the rotation unit and the plurality of radioactive counters, and used for controlling the rotation unit to rotate by a control signal, so as to enable the sample to rotate within the accommodating space.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: The invention is to provide a method for planishing a sealed end of a pipe body for making a heat pipe. According to a preferred embodiment of the method of the invention, the sealed end of the pipe body is fixed within a female mold. Then, a male mold is inserted into the pipe body. By use of the male mold, the sealed end of the pipe body with respect to the female mold is stamped to form a planished surface at the sealed end of the pipe body. Whereby after the heat pipe is finished, an electronic device is capable of being mounted on the planished surface at the sealed end of the heat pipe.

Abstract: A radioactivity measuring apparatus with a rotating stage for waste drums is provided, which includes a case, a plurality of radioactive counters, a rotation unit, and a control unit. The case has an opening and an accommodating space in communication with the opening. A shielding gate is connected to one side of the opening. The plurality of radioactive counters is disposed in the accommodating space, and used for detecting a radioactive counting associated with a sample. The rotation unit is disposed at a wall on a side of the shielding gate corresponding to the opening, and used for supporting the sample. The control unit is electrically connected to the rotation unit and the plurality of radioactive counters, and used for controlling the rotation unit to rotate by a control signal, so as to enable the sample to rotate within the accommodating space.

Abstract: The invention provides a solar cell apparatus with high heat-dissipating efficiency. The solar cell apparatus includes a heat-conducting device, a heat-dissipating device, and an energy-converting device. The heat-conducting device includes a flat portion and a contact portion. The heat-dissipating device contacts the contact portion and includes a plurality of fins. The energy-converting device is disposed on the flat portion and includes a semiconductor structure for converting light into electricity. In the operation of converting energy, heat absorbed by the semiconductor structure could be conducted through the flat portion to the heat-conducting device and the heat-dissipating device and then be dissipated from the fins. Thereby, it is avoided for the semiconductor structure to be over heated to influence the energy conversion efficiency.

Abstract: The invention discloses an energy transducing apparatus and an energy transducing equipment grouping a plurality of the energy transducing apparatuses. The energy transducing apparatus includes a heat pipe, a first heat-dissipating member, a second heat-dissipating member, and an energy transducing member. The heat pipe includes a contact portion and a flat portion. The first heat-dissipating member includes a plurality of fins. The second heat-dissipating member is connected to the first heat-dissipating member to form an accommodating space. The contact portion is accommodated in the accommodating space and contacts both the first heat-dissipating member and the second heat-dissipating member. The energy transducing member contacts the flat portion. Thereby, heat generated in operation by the energy transducing member is conducted through the flat portion to the heat pipe and then is dissipated through the first heat-dissipating member, the second heat-dissipating member, and the fins.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type UP lighting devices.

Abstract: The invention is to provide a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe. The heat pipe includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: The invention is to provide a method for planishing a sealed end of a pipe body for making a heat pipe. According to a preferred embodiment of the method of the invention, the sealed end of the pipe body is fixed within a female mold. Then, a male mold is inserted into the pipe body. By use of the male mold, the sealed end of the pipe body with respect to the female mold is stamped to form a planished surface at the sealed end of the pipe body. Whereby after the heat pipe is finished, an electronic device is capable of being mounted on the planished surface at the sealed end of the heat pipe.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: A micro heat spreader having an inside vacuum chamber, a bottom recess in the bottom wall thereof, a filling hole formed in the bottom recess in fluid communication with the inside vacuum chamber, a fluid filled into the inside vacuum chamber, and a bronze stopper fastened to the bottom recess to seal the filling hole and maintained in flush with the bottom wall.

Abstract: The present invention provides an encapsulated device with heat isolating structure and a reflow soldering method thereof. The encapsulated device has a micro heat spreader with vapor chamber formed on the surface, and a cover covers the encapsulated device and wraps the micro heat spreader. A hermetical space is formed to isolate the high temperature when forming the solder balls and performing the SMT process, and prevent the micro heat spreader from being damaged. The present invention can provide an encapsulated device with heat isolating structure and a reflow soldering method thereof to protect the product in the reflow soldering process and improve the yield, and the cover can be reused to lower the cost.