Abstract: An example housing of an electronic device may include a body including a first portion having a first curvature, and a second portion having a second curvature; an outer plating layer comprising a conductive material and disposed on an outer surface of the body unit to be spaced by a predetermined interval from a boundary between the first portion and the second portion; and a coating layer which is disposed on the outer surface of the body to cover the plating layer.

Abstract: A method for producing an injection-molded article, according to various embodiments, comprises: molding an injection-molded article; irradiating, in a primary irradiation operation, a laser on primary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; irradiating, in a secondary irradiation operation, a laser on secondary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; and, on the surface of the injection-molded article, forming a plating layer on the primary irradiation regions and the secondary irradiation regions, wherein each of the secondary irradiation regions may at least partially overlap with at least one of the primary irradiation regions.

Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure.

Abstract: The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.

Abstract: An electronic device according to various embodiments may include: a circuit board; an electrical element disposed on an upper surface of the circuit board; a shield can surrounding at least a portion of the electrical element and having a first opening provided through a portion of the shield can facing the electrical element; a shielding sheet including a shielding layer disposed on at least a portion of the shield can and a support layer disposed on an upper surface of the shielding layer and including a second opening corresponding to the first opening; and a first heat transfer member comprising a heat dissipating material having at least a portion disposed inside the second opening and at least one surface in contact with the shielding layer.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.

Abstract: According to various embodiments, an electronic device comprises a temperature sensor, a display, and a processor configured to operate by using a clock speed selected from among a plurality of clock speeds, wherein the processor may be configured to: execute a designated application by using one selected from among the plurality of clock speeds; check an external temperature by using the temperature sensor for at least some time during the execution of the designated application; when the external temperature falls to within a range of a first designated temperature, execute the designated application by using one selected from among the plurality of clock speeds according to a designated clock governor; and when the external temperature falls to within a range of a second designated temperature that is lower than the first designated temperature, execute the designated application by using one selected from among the plurality of clock speeds, except for some higher clock speeds, according to the designated

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: According to various embodiments, an electronic device comprises a temperature sensor, a display, and a processor configured to operate by using a clock speed selected from among a plurality of clock speeds, wherein the processor may be configured to: execute a designated application by using one selected from among the plurality of clock speeds; check an external temperature by using the temperature sensor for at least some time during the execution of the designated application; when the external temperature falls to within a range of a first designated temperature, execute the designated application by using one selected from among the plurality of clock speeds according to a designated clock governor; and when the external temperature falls to within a range of a second designated temperature that is lower than the first designated temperature, execute the designated application by using one selected from among the plurality of clock speeds, except for some higher clock speeds, according to the designated

Abstract: An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.

Abstract: An electronic device according to various embodiments may include: a circuit board; an electrical element disposed on an upper surface of the circuit board; a shield can surrounding at least a portion of the electrical element and having a first opening provided through a portion of the shield can facing the electrical element; a shielding sheet including a shielding layer disposed on at least a portion of the shield can and a support layer disposed on an upper surface of the shielding layer and including a second opening corresponding to the first opening; and a first heat transfer member comprising a heat dissipating material having at least a portion disposed inside the second opening and at least one surface in contact with the shielding layer.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Abstract: A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.