Abstract: A electronic device including a host connector and memory device is provided. The host connector includes a connector pin, and the memory connector includes a connection terminal electrically connected to the connector pin of the host connector. The connector pin includes a first conductor part including a conductor, a second conductor part including the conductor, the second conductor part being bent from the first conductor part in a direction towards the connection terminal, and a stub including an insulator, the stub being bent from the second conductor part in a direction away from the connection terminal. The connection terminal includes a first region including an insulator, and a second region including a conductor. The second conductor part is electrically connected to the second region, so that the host connector is electrically connected to the memory connector.

Abstract: Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.

Abstract: A electronic device including a host connector and memory device is provided. The host connector includes a connector pin, and the memory connector includes a connection terminal electrically connected to the connector pin of the host connector. The connector pin includes a first conductor part including a conductor, a second conductor part including the conductor, the second conductor part being bent from the first conductor part in a direction towards the connection terminal, and a stub including an insulator, the stub being bent from the second conductor part in a direction away from the connection terminal. The connection terminal includes a first region including an insulator, and a second region including a conductor. The second conductor part is electrically connected to the second region, so that the host connector is electrically connected to the memory connector.

Abstract: The invention relates to a door closer having high usability and capable of saving installation cost. The door closer according to an example embodiment of the inventive concept includes a first closer part combined with a doorframe and a door to provide a rotational force in a direction in which the door is closed, and a second closer part to reduce a rotational speed of the door by a damping force of a viscous fluid contained thereinside when the door is closed by the first closer part.

Abstract: Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.

Abstract: A solid state drive (SSD) device includes nonvolatile memory devices, a controller, a main power supply circuit and an auxiliary reprogram device. The controller controls the nonvolatile memory devices. The main power supply circuit provides an operation voltage to the nonvolatile memory devices and the controller using a supply voltage provided through a power line. The auxiliary reprogram device provides an auxiliary supply voltage to the nonvolatile memory devices and the controller and generates a reprogram command. The controller is configured to, if the SSD is not powered, perform periodically at a first period a reprogram operation on the nonvolatile memory devices.

Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

Abstract: Methods of operating a power supply switching circuit including selecting a first power supply signal for provisioning through the power supply switching circuit to a electronic storage device. A current draw can be detected via the first power supply signal that exceeds a predetermined current limit and a second power supply signal can be coupled to the first power supply signal for provisioning through the power supply switching circuit to the electronic storage device responsive to the current draw exceeding the predetermined current limit.

Abstract: A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.

Abstract: Provided are an auxiliary power supply test method and an electronic apparatus to which the same is applied. The auxiliary power supply test method includes: applying a charging disable signal, which interrupts a charging operation by an auxiliary power supply unit for a predetermined period of time, to the auxiliary power supply unit; monitoring a charging voltage of the auxiliary power supply unit in a time interval in which the charging disable signal is applied to the auxiliary power supply unit; determining whether the auxiliary power supply unit is defective, based on whether the monitored charging voltage is less than a predetermined threshold voltage, wherein the auxiliary power supply unit supplies auxiliary power, obtained based on the charging voltage, to a system power supply line in a case of a sudden power-off.

Abstract: A power supply circuit may include a first power converter that may be configured to generate a first inner supply voltage having a first voltage level based on a first external supply voltage and to output the first inner supply voltage to a first node that is coupled to the first node, a second power converter that may be configured to generate a second inner supply voltage having the first voltage level based on a second external supply voltage and to output the second inner supply voltage to a second node that is coupled to the second node, a first diode that may include an anode coupled to the first node and a cathode coupled to the second node, and a second diode that may include an anode coupled to the second node and a cathode coupled to the first node.

Abstract: Embodiments include a method of managing power and performance of an electronic device, the method comprising: providing a plurality of capacitors configured to be electrically connected to a power rail of the electronic device to supply auxiliary power to the electronic device when interrupt occurs in input power supplied to the electronic device; monitoring states of the capacitors; and controlling operations of the electronic device based on the results of the monitoring.

Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.

Abstract: A solid state drive (SSD) device includes nonvolatile memory devices, a controller, a main power supply circuit and an auxiliary reprogram device. The controller controls the nonvolatile memory devices. The main power supply circuit provides an operation voltage to the nonvolatile memory devices and the controller using a supply voltage provided through a power line. The auxiliary reprogram device provides an auxiliary supply voltage to the nonvolatile memory devices and the controller and generates a reprogram command. The controller is configured to, if the SSD is not powered, perform periodically at a first period a reprogram operation on the nonvolatile memory devices.

Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.

Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.

Abstract: A power supply circuit may include a first power converter that may be configured to generate a first inner supply voltage having a first voltage level based on a first external supply voltage and to output the first inner supply voltage to a first node that is coupled to the first node, a second power converter that may be configured to generate a second inner supply voltage having the first voltage level based on a second external supply voltage and to output the second inner supply voltage to a second node that is coupled to the second node, a first diode that may include an anode coupled to the first node and a cathode coupled to the second node, and a second diode that may include an anode coupled to the second node and a cathode coupled to the first node.

Abstract: Provided are an auxiliary power supply test method and an electronic apparatus to which the same is applied. The auxiliary power supply test method includes: applying a charging disable signal, which interrupts a charging operation by an auxiliary power supply unit for a predetermined period of time, to the auxiliary power supply unit; monitoring a charging voltage of the auxiliary power supply unit in a time interval in which the charging disable signal is applied to the auxiliary power supply unit; determining whether the auxiliary power supply unit is defective, based on whether the monitored charging voltage is less than a predetermined threshold voltage, wherein the auxiliary power supply unit supplies auxiliary power, obtained based on the charging voltage, to a system power supply line in a case of a sudden power-off.

Abstract: Methods of operating a power supply switching circuit including selecting a first power supply signal for provisioning through the power supply switching circuit to a electronic storage device. A current draw can be detected via the first power supply signal that exceeds a predetermined current limit and a second power supply signal can be coupled to the first power supply signal for provisioning through the power supply switching circuit to the electronic storage device responsive to the current draw exceeding the predetermined current limit.

Abstract: A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.