Patents by Inventor Chungseo Lee

Chungseo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide resin, resin composition using same, and laminated film
    Patent number: 10026637
    Abstract: A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: July 17, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Masao Tomikawa, Takuo Watanabe, Chungseo Lee
  • POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM
    Publication number: 20160372357
    Abstract: A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.
    Type: Application
    Filed: February 24, 2015
    Publication date: December 22, 2016
    Inventors: Masao Tomikawa, Takuo Watanabe, Chungseo Lee