Patents by Inventor Chung Yi Huang
Chung Yi Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12205860Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.Type: GrantFiled: July 12, 2023Date of Patent: January 21, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng, Chi-Hui Lai, Chiahung Liu, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
-
Patent number: 12146599Abstract: A vacuum breaker valve includes a valve body and a vacuum breaking device mounted in the valve body. The valve body has a periphery provided with multiple air vent holes corresponding to the vacuum breaking device. The vacuum breaking device includes a mounting barrel, an elastic member, a braking member, a mounting plate, a water stop gasket, and a water inlet disk. The vacuum breaking device is assembled previously and then directly fitted into the valve body to construct the vacuum breaker valve. Thus, the vacuum breaking device and the valve body are combined together for a whole sale or the vacuum breaking device and the valve body are sold individually.Type: GrantFiled: April 18, 2023Date of Patent: November 19, 2024Inventor: Chung-Yi Huang
-
Publication number: 20240353045Abstract: A vacuum breaker valve includes a valve body and a vacuum breaking device mounted in the valve body. The valve body has a periphery provided with multiple air vent holes corresponding to the vacuum breaking device. The vacuum breaking device includes a mounting barrel, an elastic member, a braking member, a mounting plate, a water stop gasket, and a water inlet disk. The vacuum breaking device is assembled previously and then directly fitted into the valve body to construct the vacuum breaker valve. Thus, the vacuum breaking device and the valve body are combined together for a whole sale or the vacuum breaking device and the valve body are sold individually.Type: ApplicationFiled: April 18, 2023Publication date: October 24, 2024Inventor: Chung-Yi Huang
-
Publication number: 20240192733Abstract: An assembly of an electronic device and a stand includes an electronic device, a stand and two springs. The electronic device includes two first clutches located on both sides of the electronic device. The stand includes two pivot ends which are symmetrically pivoted to the both sides of the electronic device. Each pivot end includes a second clutch formed to an inside thereof and engaged with the first clutch of the electronic device to form a locking position and an unlocking position. The springs are respectively located between the electronic device and the stand. When no external force applied, each pivot end engaged with the first clutch corresponding thereto to form a locking position. When each pivot end is pulled in a direction away from the first clutch, the second clutch is disengaged from the first clutch to form an unlocking position, and the stand is pivotable relative to the electronic device.Type: ApplicationFiled: December 11, 2023Publication date: June 13, 2024Inventor: CHUNG-YI HUANG
-
Patent number: 11956583Abstract: Disclosed is a headphone including a headband and two ear cups connected to opposite ends of the headband. Each of the ear cups includes a shell, a front cover, and a light sensor. The shell has an open end. The front cover covers the open end of the shell. The front cover is in a basin form and has a peripheral sidewall and a bottom wall. The light sensor is located on the peripheral sidewall of the front cover. The light sensor includes a light-emitting unit and a light detection unit. When a user wears the headphone, light emitted by the light-emitting unit irradiates a flat portion of a back surface of an ear of the user.Type: GrantFiled: April 22, 2022Date of Patent: April 9, 2024Assignee: Merry Electronics Co., Ltd.Inventors: Hung-Uei Jou, Ko-Min Wang, Chung-Yi Huang
-
Publication number: 20230345161Abstract: Disclosed is a headphone including a headband and two ear cups connected to opposite ends of the headband. Each of the ear cups includes a shell, a front cover, and a light sensor. The shell has an open end. The front cover covers the open end of the shell. The front cover is in a basin form and has a peripheral sidewall and a bottom wall. The light sensor is located on the peripheral sidewall of the front cover. The light sensor includes a light-emitting unit and a light detection unit. When a user wears the headphone, light emitted by the light-emitting unit irradiates a flat portion of a back surface of an ear of the user.Type: ApplicationFiled: April 22, 2022Publication date: October 26, 2023Applicant: Merry Electronics Co., Ltd.Inventors: Hung-Uei Jou, Ko-Min Wang, Chung-Yi Huang
-
Publication number: 20230276159Abstract: Disclosed is an open ear headphone, including a housing, a speaker arranged in an accommodating space inside the housing to define the accommodating space into a front cavity and a rear cavity, a connecting member including opposite first and second ends, and a supporting member connected to the second end and including a supporting portion and a sound outlet channel. A sound outlet is provided on a surface of the housing and is in acoustic communication with the front cavity. The first end is connected to the surface of the housing. When a user wears the open ear headphone, the housing is located in a concha cavity of the user's ear, the supporting portion at least leans against a lower edge of the concha cavity, and the sound outlet channel is in acoustic communication with the user's ear canal and is not in contact with the user's ear.Type: ApplicationFiled: April 7, 2022Publication date: August 31, 2023Applicant: Merry Electronics Co., Ltd.Inventors: Chih-Hung Liu, Ko-Min Wang, Chung-Yi Huang
-
Patent number: 11736850Abstract: Disclosed is an open ear headphone, including a housing, a speaker arranged in an accommodating space inside the housing to define the accommodating space into a front cavity and a rear cavity, a connecting member including opposite first and second ends, and a supporting member connected to the second end and including a supporting portion and a sound outlet channel. A sound outlet is provided on a surface of the housing and is in acoustic communication with the front cavity. The first end is connected to the surface of the housing. When a user wears the open ear headphone, the housing is located in a concha cavity of the user's ear, the supporting portion at least leans against a lower edge of the concha cavity, and the sound outlet channel is in acoustic communication with the user's ear canal and is not in contact with the user's ear.Type: GrantFiled: April 7, 2022Date of Patent: August 22, 2023Assignee: Merry Electronics Co., Ltd.Inventors: Chih-Hung Liu, Ko-Min Wang, Chung-Yi Huang
-
Patent number: 11337317Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.Type: GrantFiled: September 14, 2020Date of Patent: May 17, 2022Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Chih-Kai Yang, Ming-Hung Lin, Chung-Yi Huang, Yu-Wei Liu
-
Patent number: 11317186Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing member and a transmission member. The sensing member protrudes from a front end of the shell and has a conductor. The sensing member is electrically connected to the sensing chip by the transmission member. A material of the sensing member is different from a material of the shell.Type: GrantFiled: January 10, 2021Date of Patent: April 26, 2022Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Hung-Uei Jou, Chung-Yi Huang
-
Publication number: 20220071028Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.Type: ApplicationFiled: September 14, 2020Publication date: March 3, 2022Inventors: Chih-Kai YANG, Ming-Hung LIN, Chung-Yi Huang, Yu-Wei Liu
-
Publication number: 20210352395Abstract: An earbud including a main body, a sound guiding structure, a battery, and a sensor is provided. A geometric shape of the main body has a long axis and a short axis orthogonal to each other. When the earbud is worn, the main body is housed in a concha cavity of a user, and a tragus of the user and the long axis are located on a same level. The sound guiding structure extends away from the main body from the long axis of the main body. The battery and the sensor are disposed in the main body, and the sensor is adjacent to a periphery of the battery.Type: ApplicationFiled: December 15, 2020Publication date: November 11, 2021Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Ko Min Wang, Chung-Yi Huang
-
Patent number: 11060655Abstract: An adjustable stand for mobile devices includes a board-like body, and a first holding unit and a second holding unit. The first holding unit is movable between the upper end and the bottom end of the body. The second holding unit is movable between the left side and the right side of the body. Two lateral members are respectively connected to the left side and the right side of the body. A support includes a bar with two arms extending from two ends of the bar. Each arm has a connector and two connectors are pivotably connected to the left and right sides of the body. The bar can be put on a desk top. The mobile device is positioned by the first and second holding units.Type: GrantFiled: October 8, 2019Date of Patent: July 13, 2021Assignee: Autoland Scientech Co., Ltd.Inventor: Chung-Yi Huang
-
Patent number: 11026023Abstract: A wireless earphone includes an earphone body with a concha contact surface. A sound outlet tube protrudes out from the concha contact surface. A convex positioning portion protrudes out from the concha contact surface. A laid slot is located on the concha contact surface and adjacent to the convex positioning portion. When the earphone body is mounted on a human ear, the concha contact surface is configured to face a concha of the human ear, the sound outlet tube is configured to insert into an auditory canal of the human ear, the convex positioning portion is configured to fit within a cavum of the human ear, and the laid slot is configured to fit within a crux helix of the human ear.Type: GrantFiled: September 26, 2019Date of Patent: June 1, 2021Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.Inventors: Ko-Ming Wang, Chung-Yi Huang
-
Publication number: 20210136478Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing member and a transmission member. The sensing member protrudes from a front end of the shell and has a conductor. The sensing member is electrically connected to the sensing chip by the transmission member. A material of the sensing member is different from a material of the shell.Type: ApplicationFiled: January 10, 2021Publication date: May 6, 2021Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Hung-Uei Jou, Chung-Yi Huang
-
Patent number: 10924839Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing sound tube and a transmission member. The sensing sound tube protrudes from a front end of the shell and has a conductor. The sensing sound tube is electrically connected to the sensing chip by the transmission member. A material of the sensing sound tube is different from a material of the shell.Type: GrantFiled: October 7, 2019Date of Patent: February 16, 2021Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Hung-Uei Jou, Chung-Yi Huang
-
Publication number: 20210006884Abstract: An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing sound tube and a transmission member. The sensing sound tube protrudes from a front end of the shell and has a conductor. The sensing sound tube is electrically connected to the sensing chip by the transmission member. A material of the sensing sound tube is different from a material of the shell.Type: ApplicationFiled: October 7, 2019Publication date: January 7, 2021Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Hung-Uei Jou, Chung-Yi Huang
-
Publication number: 20200374632Abstract: A wireless earphone includes an earphone body with a concha contact surface. A sound outlet tube protrudes out from the concha contact surface. A convex positioning portion protrudes out from the concha contact surface. A laid slot is located on the concha contact surface and adjacent to the convex positioning portion. When the earphone body is mounted on a human ear, the concha contact surface is configured to face a concha of the human ear, the sound outlet tube is configured to insert into an auditory canal of the human ear, the convex positioning portion is configured to fit within a cavum of the human ear, and the laid slot is configured to fit within a crux helix of the human ear.Type: ApplicationFiled: September 26, 2019Publication date: November 26, 2020Inventors: Ko-Ming WANG, Chung-Yi HUANG
-
Patent number: D884599Type: GrantFiled: January 3, 2018Date of Patent: May 19, 2020Assignee: Merry Electronics (Shenzhen) Co., Ltd.Inventors: Yu-Ting Hung, Chung-Yi Huang
-
Patent number: D886047Type: GrantFiled: January 3, 2018Date of Patent: June 2, 2020Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Yu-Ting Hung, Chung-Yi Huang