Patents by Inventor Chung-Yi Wang
Chung-Yi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961892Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.Type: GrantFiled: June 10, 2022Date of Patent: April 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Carlos H. Diaz, Chung-Cheng Wu, Chia-Hao Chang, Chih-Hao Wang, Jean-Pierre Colinge, Chun-Hsiung Lin, Wai-Yi Lien, Ying-Keung Leung
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Patent number: 11961814Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.Type: GrantFiled: January 31, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu, Chen-Hua Yu
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Patent number: 11956583Abstract: Disclosed is a headphone including a headband and two ear cups connected to opposite ends of the headband. Each of the ear cups includes a shell, a front cover, and a light sensor. The shell has an open end. The front cover covers the open end of the shell. The front cover is in a basin form and has a peripheral sidewall and a bottom wall. The light sensor is located on the peripheral sidewall of the front cover. The light sensor includes a light-emitting unit and a light detection unit. When a user wears the headphone, light emitted by the light-emitting unit irradiates a flat portion of a back surface of an ear of the user.Type: GrantFiled: April 22, 2022Date of Patent: April 9, 2024Assignee: Merry Electronics Co., Ltd.Inventors: Hung-Uei Jou, Ko-Min Wang, Chung-Yi Huang
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Publication number: 20240088070Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Yi Hsu, Kai-Chiang Wu, Yen-Ping Wang
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Patent number: 11929417Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.Type: GrantFiled: June 30, 2022Date of Patent: March 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Carlos H. Diaz, Chung-Cheng Wu, Chia-Hao Chang, Chih-Hao Wang, Jean-Pierre Colinge, Chun-Hsiung Lin, Wai-Yi Lien, Ying-Keung Leung
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Patent number: 11916022Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.Type: GrantFiled: June 7, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yeong-Jyh Lin, Ching I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang, Ru-Liang Lee, Chung-Yi Yu
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Publication number: 20240013353Abstract: A display apparatus is provided. The display apparatus includes a graphic processing unit, a display driver, and a display panel. The graphic processing unit is configured to provide a first image. The display driver is configured to correct an optical aberration of the first image to generate a second image. The display panel is configured to display the second image.Type: ApplicationFiled: May 25, 2023Publication date: January 11, 2024Applicant: HTC CorporationInventors: Sheng-Yan Lin, Chung-Yi Wang, Li-Wei Lin
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Publication number: 20230221543Abstract: A driving circuit for an electrowetting on dielectric (EWOD) pixel. The driving circuit includes a latch circuit for transmitting a source data pulse to a storage capacitor in response to an activation gate signal applied to the gate of the switch transistor and generating a latch voltage and an inversion circuit for outputting a driving voltage at either a first power voltage or a second power voltage based on the latch voltage generated by the latch circuit.Type: ApplicationFiled: January 3, 2023Publication date: July 13, 2023Inventors: Tung-Yu WU, Chung-Yi WANG, Tang-Hung PO
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Publication number: 20230191406Abstract: There is provided a heating device to independently and/or effectively heat the micro objects manipulated by a micro apparatus/system, for example the droplets of fluids in an electrowetting on dielectric EWOD device of a microfluidic apparatus. The heating device may include a plurality of micro heaters arranged in an array of rows and columns, and the micro heaters of the heating device may be disposed in relative to the electrode elements of the EWOD device, respectively. Therefore, the micro heaters of the heating device may heat one of the electrode elements of the EWOD device, thereby preventing thermal effect of the micro object on the other electrode elements.Type: ApplicationFiled: December 2, 2022Publication date: June 22, 2023Inventors: Tung-Yu WU, Tang-Hung PO, CHUNG-YI WANG
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Publication number: 20230123651Abstract: “An image sensing device is provided in the present invention. A control circuit determines a voltage change rate of a sensing signal according to a voltage value of the sensing signal generated by a light sensing unit during an estimation period, and controls an input adjustment circuit during an exposure period according to the voltage change rate to provide an input adjustment signal to a negative input end of an operational amplifier, such that a signal value of an amplified signal falls within a pre-set range during the exposure period.Type: ApplicationFiled: January 8, 2021Publication date: April 20, 2023Applicant: Egis Technology Inc.Inventors: Yu-Hsuan Lin, Tzu-Yang Peng, Chung-Yi Wang, Tzu-Li Hung
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Publication number: 20230115951Abstract: Provided is an electronic device comprising a touch display panel and an integrated chip. The touch display panel comprises a pixel array. The integrated chip is electrically connected to the pixel array. The integrated chip comprises a fingerprint sensing circuit and a display driving circuit. The fingerprint sensing circuit and the display driving circuit are electrically connected to multiple display data lines and sensing data lines through of the same pin. The multiple display data lines are respectively electrically connected to multiple color sub-pixels of the pixel array. The sensing data lines are electrically connected to multiple fingerprint sensing pixels of the pixel array. The multiple color sub-pixels are multiple liquid crystal display pixels.Type: ApplicationFiled: October 23, 2020Publication date: April 13, 2023Applicant: Egis Technology Inc.Inventors: Yu-Hsuan Lin, Yao-Li Huang, Chung-Yi Wang, Sheng Ruei Hsu
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Patent number: 11586321Abstract: An electronic device with fingerprint sensing function including a fingerprint sensing array, multiple fingerprint sensing signal readout lines, multiple touch driving lines, a touch driving circuit, and a read circuit is provided. The fingerprint sensing array includes multiple fingerprint sensing units arranged in array. The fingerprint sensing signal readout lines are respectively coupled to a column of fingerprint sensing units of the fingerprint sensing array. The touch driving lines are respectively interleaved with the fingerprint sensing signal readout lines. The touch driving circuit is coupled to the touch driving lines, and provides multiple touch driving signals to the touch driving lines. The read circuit is coupled to the fingerprint sensing signal readout lines. In response to the touch driving lines outputting the touch driving signals, the read circuit determines a touch position of a touch object based on multiple read signals output by the fingerprint sensing signal readout lines.Type: GrantFiled: March 11, 2020Date of Patent: February 21, 2023Assignee: Egis Technology Inc.Inventors: Chung-Yi Wang, Yu-Hsuan Lin
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Publication number: 20230043448Abstract: A detection circuit includes a first detection terminal, a second detection terminal, a first switch, a second switch, a first capacitor, a second capacitor and an amplifier. The first switch is coupled to the first detection terminal. The second switch is coupled to the second detection terminal. The first capacitor is coupled between the first switch and the second switch. The amplifier includes a first input terminal coupled to the second switch, a second input terminal used to receive an operation signal, and an output terminal used to output an output signal. The second capacitor is coupled between the first input terminal and the output terminal of the amplifier. The first switch and the second switch are turned on alternatively.Type: ApplicationFiled: August 19, 2020Publication date: February 9, 2023Applicant: Egis Technology Inc.Inventors: Chung-Yi Wang, Yu-Hsuan Lin, Tzu-Li Hung
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Publication number: 20230041756Abstract: A signal processing circuit includes a buffer, a first capacitor, a second capacitor, a first switch and a second switch. The buffer includes an input terminal for receiving an external signal and an output terminal for outputting an output signal. The first switch is coupled between the output terminal of the buffer and the first capacitor. The second switch is coupled between the output terminal of the buffer and the second capacitor. The first switch and the second switch are turned on alternately.Type: ApplicationFiled: August 12, 2020Publication date: February 9, 2023Applicant: Egis Technology Inc.Inventors: Chung-Yi Wang, Yu-Hsuan Lin, Tzu-Li Hung
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Patent number: 11557144Abstract: A capacitive fingerprint sensing device is provided. A sensing pixel unit includes a capacitor, a reset circuit, and a sensing capacitor. The reset circuit provides a reset voltage during a reset period to reset a voltage on the capacitor and provides an adjustment current during a sensing period to adjust a sense voltage generated on a common junction of the capacitor and the reset circuit.Type: GrantFiled: September 7, 2021Date of Patent: January 17, 2023Assignee: Egis Technology Inc.Inventors: Yu-Hsuan Lin, Chung-Yi Wang, Zhe-Wei Kuo
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Patent number: 11545098Abstract: A driving apparatus for a display panel is provided. The driving apparatus for the display panel is configured on a film by means of a Chip-on-Film (COF) package. A selection circuit receives multiple driving voltages. A control circuit is coupled to the selection circuit and controls the selection circuit to output one of the multiple driving voltages, so as to drive the display panel.Type: GrantFiled: March 6, 2020Date of Patent: January 3, 2023Assignee: Egis Technology Inc.Inventors: Chung-Yi Wang, Yu-Hsuan Lin
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Patent number: 11538275Abstract: A fingerprint sensing device and an operation method thereof are provided. The fingerprint sensing device includes a driver integrated chip and a fingerprint sensor. The driver integrated chip is coupled to a host processor. The fingerprint sensor is coupled to the driver integrated chip and the host processor. The fingerprint sensor obtains a fingerprint image during a period when the host processor is in the sleep mode. The driver integrated chip performs a fingerprint verification on the fingerprint image, and the driver integrated chip determines to wake up the host processor according to whether the fingerprint image passes the fingerprint verification.Type: GrantFiled: May 3, 2021Date of Patent: December 27, 2022Assignee: Egis Technology Inc.Inventors: Yao-Li Huang, Yu-Hsuan Lin, Chung-Yi Wang
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Publication number: 20220197471Abstract: An electronic device with fingerprint sensing function including a fingerprint sensing array, multiple fingerprint sensing signal readout lines, multiple touch driving lines, a touch driving circuit, and a read circuit is provided. The fingerprint sensing array includes multiple fingerprint sensing units arranged in array. The fingerprint sensing signal readout lines are respectively coupled to a column of fingerprint sensing units of the fingerprint sensing array. The touch driving lines are respectively interleaved with the fingerprint sensing signal readout lines. The touch driving circuit is coupled to the touch driving lines, and provides multiple touch driving signals to the touch driving lines. The read circuit is coupled to the fingerprint sensing signal readout lines. In response to the touch driving lines outputting the touch driving signals, the read circuit determines a touch position of a touch object based on multiple read signals output by the fingerprint sensing signal readout lines.Type: ApplicationFiled: March 11, 2020Publication date: June 23, 2022Applicant: Egis Technology Inc.Inventors: Chung-Yi Wang, Yu-Hsuan Lin
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Publication number: 20220165226Abstract: A driving apparatus for a display panel is provided. The driving apparatus for the display panel is configured on a film by means of a Chip-on-Film (COF) package. A selection circuit receives multiple driving voltages. A control circuit is coupled to the selection circuit and controls the selection circuit to output one of the multiple driving voltages, so as to drive the display panel.Type: ApplicationFiled: March 6, 2020Publication date: May 26, 2022Applicant: Egis Technology Inc.Inventors: Chung-Yi Wang, Yu-Hsuan Lin
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Publication number: 20220165079Abstract: An electronic apparatus having a fingerprint sensing function, including a touch panel, a driving circuit, a fingerprint sensing array, and a fingerprint sensing circuit, is provided. The driving circuit provides a driving signal to the touch panel. The fingerprint sensing array includes multiple sensing units arranged in an array. The fingerprint sensing circuit is coupled to the sensing units on the fingerprint sensing array via multiple sensing data lines, and applies multiple control signals to the sensing units via the sensing data lines. A working frequency of the driving signal is the same as a working frequency of the control signals, and the driving signal is synchronized with the control signals.Type: ApplicationFiled: February 24, 2020Publication date: May 26, 2022Applicant: Egis Technology Inc.Inventors: Chung-Yi Wang, Yu-Hsuan Lin, Chih-Hsiang Chuang