Abstract: A polydentate organic ligand, a preparation method and an application method thereof, a metallo-supramolecular polymer and a preparation method thereof are provided. A structure of triphenylamine is combined with a structure of phenanthroline to serve as the polydentate organic ligand, which takes advantages of a large-volume distortion structure and excellent electroactivity of the triphenylamine. The polydentate organic ligands have good solubility, which provides lower-cost and diversified methods for preparing the metallo-supramolecular polymers. Meanwhile, the phenanthroline has a rigid structure and a conjugated large ? bond in its molecule, which facilitates chelating coordination with metal ions to form a stable compound. Therefore, the polydentate organic ligand enables the metallo-supramolecular polymer to have good transferability, stable electroactivity, and high conversion speed, i.e., fast response speed, excellent electrochromic cycling stability and long service lifetime.

Abstract: Methods and systems for inspecting a specimen are provided. One system includes an inspection subsystem configured for directing light to an area on the specimen and for generating output responsive to light from the area on the specimen. The system also includes a first gas flow subsystem configured for replacing a gas in a first local volume surrounding the area on the specimen with a first medium that scatters less of the light than the gas. In addition, the system includes a second gas flow subsystem configured for replacing the gas in a second local volume proximate the first local volume with a second medium different than the first medium. The system further includes a computer subsystem configured for detecting abnormalities on the specimen based on the output.

Abstract: A dark-field optical system may include a rotational objective lens assembly with a dark-field objective lens to collect light from a sample within a collection numerical aperture, where the dark-field objective lens includes an entrance aperture and an exit aperture at symmetrically-opposed azimuth angles with respect to an optical axis, a rotational bearing to allow rotation of at least a part of the dark-field objective lens including the entrance aperture and the exit aperture around the optical axis, and a rotational driver to control a rotational angle of the entrance aperture. The system may also include a multi-angle illumination sub-system to illuminate the sample with an illumination beam through the entrance aperture at two or more illumination azimuth angles, where an azimuth angle of the illumination beam on the sample is selectable by rotating the objective lens to any of the two or more illumination azimuth angles.

Abstract: A dark-field optical system may include a rotational objective lens assembly with a dark-field objective lens to collect light from a sample within a collection numerical aperture, where the dark-field objective lens includes an entrance aperture and an exit aperture at symmetrically-opposed azimuth angles with respect to an optical axis, a rotational bearing to allow rotation of at least a part of the dark-field objective lens including the entrance aperture and the exit aperture around the optical axis, and a rotational driver to control a rotational angle of the entrance aperture. The system may also include a multi-angle illumination sub-system to illuminate the sample with an illumination beam through the entrance aperture at two or more illumination azimuth angles, where an azimuth angle of the illumination beam on the sample is selectable by rotating the objective lens to any of the two or more illumination azimuth angles.

Abstract: Disclosed are a modular heat dissipation structure and an LED lighting device. The modular heat dissipation structure includes a power box configured to accommodate and dissipate a power supply; and a heat sink configured to dissipate a light source; where the heat sink includes a first overlap portion, the power box includes a second overlap portion, the first overlap portion is provided on a side of the heat sink opposite to the second overlap portion and is provided corresponding to the second overlap portion, and the first overlap portion is overlapped above the second overlap portion. The LED lighting device includes the above-mentioned modular heat dissipation structure.

Abstract: The device includes a lighting module with a light source, a light source driver, and a cooling element; an emergency module with a housing, an emergency control and a battery pack; and a connector having a cavity, a first one end is connected to the lighting module, and a second end connected to the emergency module. The cavity of the connector forms a closed space which thermally separates the emergency module from the lighting module.

Abstract: Disclosed are an automatic continuous operation robot for laying large-diameter pipelines and an operating method therefor. The operation robot comprises a platform, a main frame (1), an operation room, a navigation subsystem (1002), a pipe grabbing and conveying subsystem (3), a pipe end face pre-treatment subsystem (4), an on-line measurement subsystem, a pipe supporting subsystem, a welding and welding quality inspection subsystem (5), and a control system. The operating method comprises: first detecting and grabbing a pipe, then performing groove machining on the pipe, fitting the welding end faces of the current pipe and a previous pipe, then putting down the pipe, finely adjusting and fixedly connecting the two pipes, and finally, welding the two pipes. The automatic continuous operation robot for laying large-diameter pipelines has a high degree of automation and high working efficiency, and the laying period is short.

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.

Abstract: Disclosed are an automatic continuous operation robot for laying large-diameter pipelines and an operating method therefor. The operation robot comprises a platform, a main frame (1), an operation room, a navigation subsystem, a pipe grabbing and conveying subsystem (3), a pipe end face pre-treatment subsystem (4), an on-line measurement subsystem, a pipe supporting subsystem, a welding and welding quality inspection subsystem (5), and a control system. The operating method comprises: first detecting and grabbing a pipe, then performing groove machining on the pipe, fitting the welding end faces of the current pipe and a previous pipe, then putting down the pipe, finely adjusting and fixedly connecting the two pipes, and finally, welding the two pipes. The automatic continuous operation robot for laying large-diameter pipelines has a high degree of automation and high working efficiency, and the laying period is short.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.

Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a first distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the first distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.

Abstract: An interferometer system is disclosed. The interferometer system includes two spaced apart reference flats having corresponding reference surfaces forming a cavity therebetween for placement of a polished opaque plate. The surfaces of the plate are approximately 2.5 millimeters or less from the corresponding reference surfaces when the plate is placed in the cavity. The interferometer system also includes two interferometer devices located on diametrically opposite sides of the cavity to map the surfaces of the plate. A light source is optically coupled to the interferometer devices. The light source includes an illuminator configured for producing light of multiple wavelengths and an optical amplitude modulator configured for stabilizing power of the light produced by the illuminator. The interferometer system further includes two interferogram detectors, and at least one computer coupled to receive the outputs of the interferogram detectors for determining thickness variations of the plate.

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract: A scanning probe microscope in which the probe is oscillated at a frequency lower than its resonant frequency, a force sensor that is sensitive to the bending of the cantilever and minimally sensitive to the oscillation is used to measure tip-sample interaction force. The sensor signal is then converted to a force gradient signal by electronics. The gradient signal is kept constant by a feedback mechanism as the tip is scanned across the surface of a sample, and force and topographical information are mapped.

Abstract: A scanning probe microscope in which the probe is oscillated at a frequency lower than its resonant frequency, a force sensor that is sensitive to the bending of the cantilever and minimally sensitive to the oscillation is used to measure tip-sample interaction force. The sensor signal is then converted to a force gradient signal by electronics. The gradient signal is kept constant by a feedback mechanism as the tip is scanned across the surface of a sample, and force and topographical information are mapped.

Abstract: An apparatus and method of measuring a parameter associated with a sample is provided. The method includes providing a probe adapted to heat the sample and applying a measuring current having a frequency ?1 to the probe. In operation, the method measures the amplitude of the voltage across the probe at a frequency ?1. This amplitude is indicative of a temperature of the probe. The preferred embodiment also provides a method of separating contamination of the thermal data caused by the probe from thermal data associated with the sample under test.