Patents by Inventor Chun-Hao Chen

Chun-Hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12657067
    Abstract: The present disclosure provides a private network and edge application provisioning management system and a method thereof, which provides a construction of enterprise private cloud platform and a process of management standardization, so that a dedicated cloud operating environment can be provided for enterprise customers, and special software application services can further be established and managed. A remote registration mechanism, an enterprise private network establishment mechanism, and an edge application activation mechanism be proposed in the present disclosure. In this way, edge computing capabilities in the enterprise private network environment can be provided, which can not only reduce application service latency time, but also network transmission does not need to go through the Internet, thus having the advantages of avoiding data leakage and improving security. The present disclosure also provides a computer-readable medium for executing the method of the present disclosure.
    Type: Grant
    Filed: June 28, 2023
    Date of Patent: June 16, 2026
    Assignee: CHUNGWA TELECOM CO., LTD.
    Inventors: Wen-Sheng Li, Hung-Yuan Wang, Wei-Chih Lu, Jia-An Tsai, Chun-Hao Chen
  • Patent number: 12545758
    Abstract: A polyhydroxyalkanoate block copolymer includes a first segment containing a first monomeric unit represented by formula (I); and a second segment containing the first monomeric unit represented by formula (I), a second monomeric unit represented by formula (II), and a third monomeric unit represented by formula (III), The first segment and the second segment are arranged in blocks. A method for preparing the polyhydroxyalkanoate block copolymer is also disclosed.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: February 10, 2026
    Assignee: NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Der-Shyan Sheu, Shun-Ze Siao, Chun-Hao Chen
  • Publication number: 20250257453
    Abstract: Processing methods and apparatus for increasing a reaction chamber batch size. Such a method of processing deposition substrates (e.g., wafers), involves conducting a deposition on a first portion of a batch of deposition wafers in a reaction chamber, conducting an interval conditioning reaction chamber purge to remove defects generated by the wafer processing from the reaction chamber; and following the interval conditioning mid-batch reaction chamber purge, conducting the deposition on another portion of the batch of wafers in the reaction chamber. The interval conditioning reaction chamber purge is conducted prior to exceeding a baseline for acceptable defect (e.g., particle) generation in the chamber and is performed while no wafers are positioned in the reaction chamber.
    Type: Application
    Filed: April 3, 2025
    Publication date: August 14, 2025
    Inventors: Chun-Hao Chen, Jeremy David Fields, Frank Loren Pasquale
  • Patent number: 12291777
    Abstract: Processing methods and apparatus for increasing a reaction chamber batch size. Such a method of processing deposition substrates (e.g., wafers), involves conducting a deposition on a first portion of a batch of deposition wafers in a reaction chamber, conducting an interval conditioning reaction chamber purge to remove defects generated by the wafer processing from the reaction chamber; and following the interval conditioning mid-batch reaction chamber purge, conducting the deposition on another portion of the batch of wafers in the reaction chamber. The interval conditioning reaction chamber purge is conducted prior to exceeding a baseline for acceptable defect (e.g., particle) generation in the chamber and is performed while no wafers are positioned in the reaction chamber.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 6, 2025
    Assignee: Lam Research Corporation
    Inventors: Chun-Hao Chen, Jeremy David Fields, Frank Loren Pasquale
  • Patent number: 12127403
    Abstract: A non-volatile memory device and its manufacturing method are provided. The non-volatile memory device includes a substrate and a plurality of first floating gates and a plurality of second floating gates formed on the substrate. The substrate includes a center region and two border regions located on opposite sides of the center region. The center region and two border regions are located in an array region. The first floating gates are located in the center region, and the second floating gates are located in one of the border regions. Each of the first floating gates has a first width, and each of the second floating gates has a second width less than the first width. There is a first spacing between the first floating gates, and there is a second spacing which is greater than the first spacing between the second floating gates.
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: October 22, 2024
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Chun-Hao Chen, Wei-Kuang Chung
  • Publication number: 20240311205
    Abstract: The present disclosure provides a private network and edge application provisioning management system and a method thereof, which provides a construction of enterprise private cloud platform and a process of management standardization, so that a dedicated cloud operating environment can be provided for enterprise customers, and special software application services can further be established and managed. A remote registration mechanism, an enterprise private network establishment mechanism, and an edge application activation mechanism be proposed in the present disclosure. In this way, edge computing capabilities in the enterprise private network environment can be provided, which can not only reduce application service latency time, but also network transmission does not need to go through the Internet, thus having the advantages of avoiding data leakage and improving security. The present disclosure also provides a computer-readable medium for executing the method of the present disclosure.
    Type: Application
    Filed: June 28, 2023
    Publication date: September 19, 2024
    Inventors: Wen-Sheng LI, Hung-Yuan WANG, Wei-Chih LU, Jia-An TSAI, Chun-Hao CHEN
  • Patent number: 12028218
    Abstract: A system and a method for managing a virtual network function (VNF) and a multi-access edge computing (MEC) topology are provided. The method includes the following steps. A first VNF descriptor (VNFD) corresponding to a first VNF is received. According to the first VNFD, first provision data is generated. According to the first VNFD, first internal topology information of the first VNF is generated. According to the first provision data, the first VNF is instantiated to be provisioned. In response to provisioning the first VNF, a graphical user interface including the first internal topology information is output, and the first internal topology information includes a network component communicatively connected to the first VNF.
    Type: Grant
    Filed: October 24, 2021
    Date of Patent: July 2, 2024
    Assignee: Chunghwa Telecom Co., Ltd.
    Inventors: Wen-Sheng Li, Si-An Ciou, Chi-Te Chiu, Chun-Hao Chen, Jia-An Tsai
  • Publication number: 20240182620
    Abstract: A polyhydroxyalkanoate block copolymer includes a first segment containing a first monomeric unit represented by formula (I); and a second segment containing the first monomeric unit represented by formula (I), a second monomeric unit represented by formula (II), and a third monomeric unit represented by formula (III), The first segment and the second segment are arranged in blocks. A method for preparing the polyhydroxyalkanoate block copolymer is also disclosed.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 6, 2024
    Inventors: Der-Shyan SHEU, Shun-Ze SIAO, Chun-Hao CHEN
  • Publication number: 20240156440
    Abstract: A method of reconstructing transcranial images using a dual-mode ultrasonic phased array includes steps of: controlling channels to emit energy toward an intracranial target point of a patient; respectively generating backscattered radiofrequency (RF) data by using the channels to receive backscattered energy reflected from the intracranial target; and reconstructing an acoustic distribution image based on those backscattered RF data in real-time. Compared with Pre-Treatment Ray Tracing Method, the present invention can display intracranial pressure distribution in real-time; compared with MR Thermometry, the present invention can be applied to low-energy applications without temperature change; and compared with Passive Cavitation Imaging, the present invention can stably present acoustic distribution images without relying on microbubbles.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 16, 2024
    Inventors: HAO-LI LIU, HSIANG-CHING LIN, ZHEN-YUAN LIAO, HSIANG-YANG MA, CHIH-HUNG TSAI, CHUN-HAO CHEN
  • Publication number: 20230225119
    Abstract: A non-volatile memory device and its manufacturing method are provided. The non-volatile memory device includes a substrate and a plurality of first floating gates and a plurality of second floating gates formed on the substrate. The substrate includes a center region and two border regions located on opposite sides of the center region. The center region and two border regions are located in an array region. The first floating gates are located in the center region, and the second floating gates are located in one of the border regions. Each of the first floating gates has a first width, and each of the second floating gates has a second width less than the first width. There is a first spacing between the first floating gates, and there is a second spacing which is greater than the first spacing between the second floating gates.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 13, 2023
    Inventors: Chun-Hao CHEN, Wei-Kuang CHUNG
  • Patent number: 11637112
    Abstract: A non-volatile memory device and its manufacturing method are provided. The non-volatile memory device includes a substrate and a plurality of first gate structures and a plurality of second gate structures formed on the substrate. The substrate includes a center region and two border regions located on opposite sides of the center region. The center region and two border regions are located in an array region. The first gate structures are located in the center region, and the second gate structures are located in one of the border regions. Each of the first gate structures has a first width, and each of the second gate structures has a second width less than the first width. There is a first spacing between the first gate structures, and there is a second spacing which is greater than the first spacing between the second gate structures.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: April 25, 2023
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Chun-Hao Chen, Wei-Kuang Chung
  • Patent number: 11637060
    Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: April 25, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Chun-Hao Chen, Chia-Lung Lin, Chien-Hsiang Chou, Yi-Lin Chiang, Chien-Chen Lin
  • Publication number: 20230081959
    Abstract: A system and a method for managing a virtual network function (VNF) and a multi-access edge computing (MEC) topology are provided. The method includes the following steps. A first VNF descriptor (VNFD) corresponding to a first VNF is received. According to the first VNFD, first provision data is generated. According to the first VNFD, first internal topology information of the first VNF is generated. According to the first provision data, the first VNF is instantiated to be provisioned. In response to provisioning the first VNF, a graphical user interface including the first internal topology information is output, and the first internal topology information includes a network component communicatively connected to the first VNF.
    Type: Application
    Filed: October 24, 2021
    Publication date: March 16, 2023
    Applicant: Chunghwa Telecom Co., Ltd.
    Inventors: Wen-Sheng Li, Si-An Ciou, Chi-Te Chiu, Chun-Hao Chen, Jia-An Tsai
  • Publication number: 20220375721
    Abstract: Radio frequency power conveyed to individual process stations of a multi-station integrated circuit fabrication chamber may be adjusted so as to bring the rates at which fabrication processes occur, and/or fabrication process results, into alignment with one another. Such adjustment in radio frequency power, which may be accomplished via adjusting one or more reactive elements of a RF distribution network, may give rise to an imbalance in power delivered to each individual process station.
    Type: Application
    Filed: October 23, 2020
    Publication date: November 24, 2022
    Inventors: Jeremy David Fields, Awnish Gupta, Chun-Hao Chen, Yaswanth Rangineni, Frank Loren Pasquale
  • Publication number: 20220199513
    Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 23, 2022
    Inventors: Chun-Hao CHEN, Chia-Lung LIN, Chien-Hsiang CHOU, Yi-Lin CHIANG, Chien-Chen LIN
  • Publication number: 20210395885
    Abstract: Processing methods and apparatus for increasing a reaction chamber batch size. Such a method of processing deposition substrates (e.g., wafers), involves conducting a deposition on a first portion of a batch of deposition wafers in a reaction chamber, conducting an interval conditioning reaction chamber purge to remove defects generated by the wafer processing from the reaction chamber; and following the interval conditioning mid-batch reaction chamber purge, conducting the deposition on another portion of the batch of wafers in the reaction chamber. The interval conditioning reaction chamber purge is conducted prior to exceeding a baseline for acceptable defect (e.g., particle) generation in the chamber and is performed while no wafers are positioned in the reaction chamber.
    Type: Application
    Filed: November 27, 2019
    Publication date: December 23, 2021
    Applicant: Lam Research Corporation
    Inventors: Chun-Hao Chen, Jeremy David Fields, Frank Loren Pasquale
  • Publication number: 20210280589
    Abstract: A non-volatile memory device and its manufacturing method are provided. The non-volatile memory device includes a substrate and a plurality of first gate structures and a plurality of second gate structures formed on the substrate. The substrate includes a center region and two border regions located on opposite sides of the center region. The center region and two border regions are located in an array region. The first gate structures are located in the center region, and the second gate structures are located in one of the border regions. Each of the first gate structures has a first width, and each of the second gate structures has a second width less than the first width. There is a first spacing between the first gate structures, and there is a second spacing which is greater than the first spacing between the second gate structures.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 9, 2021
    Inventors: Chun-Hao CHEN, Wei-Kuang CHUNG
  • Patent number: 10825599
    Abstract: A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: November 3, 2020
    Assignee: Unimicron Technology Corp.
    Inventors: Chang-Fu Chen, Chun-Hao Chen, Kuan-Hsi Wu, Pi-Te Pan
  • Publication number: 20200313920
    Abstract: A method for recording a multimedia call with common consent via an instant communication software program is proposed. Via execution of the software program, when an electronic device makes a multimedia call to another electronic device, a recording notification is provided to said another electronic device for notifying a user of said another electronic device that the multimedia call would be recorded. After the multimedia call has ended, one of the two electronic devices generates a recording file for the multimedia call, and transmits the recording file to a virtual chat room created for the two electronic devices.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 1, 2020
    Inventors: Chan-Guan KOH, Chun-Hao CHEN, Tzu-Ying WANG, Sheng-Yen FANG, Chien-Cheng LU, I-Yun CHAO
  • Publication number: 20200314043
    Abstract: A method for scheduled transmission of a message is to be implemented by an instant messaging (IM) device, and includes: executing IM software and providing a graphical user interface (GUI) which includes a chat interface for a chat session, the chat interface being established in advance by the IM software; when it is determined that a message is inputted in an input field of the chat interface and that a prearrangement icon of the chat interface is selected, presenting a date-and-time picker in the GUI for setting a scheduled time; generating a scheduled task when it is determined that the scheduled time has been set; and sending the message corresponding to the scheduled task to the chat session when it is determined that the scheduled time corresponding to the scheduled task has arrived.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 1, 2020
    Inventors: Chan-Guan KOH, Chun-Hao CHEN, Tzu-Ying WANG, Sheng-Yen FANG, Chien-Cheng LU, I-Yun CHAO