Abstract: Disclosed herein are laminated structures comprising a metal sheet including a first face and a second face, a first glass sheet, and a first interlayer attaching the first glass sheet to the first face of the metal sheet. Also disclosed herein are methods of manufacturing a laminated structure comprising the steps of laminating a metal sheet and a glass sheet together with an interlayer.

Abstract: Example methods of manufacturing a glass mirror apparatus includes the step of providing a chemically strengthened glass sheet with a thickness of less than or equal to about 2 mm. The method further includes the step of applying a reflective layer to the second major surface of the glass sheet to provide a first glass mirror. In further examples, a glass mirror apparatus comprises a chemically strengthened glass sheet with a thickness of less than or equal to about 2 mm. A reflective layer applied to the second major surface of the glass sheet to provide a first glass mirror.

Abstract: A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.

Abstract: Laminated structures comprise a metal sheet including a first face and a second face with a thickness of from about 0.5 mm to about 2 mm extending between the first face and the second face. The laminated structure further includes a first chemically strengthened glass sheet including a thickness of less than or equal to about 1.1 mm and a first interlayer attaching the first chemically strengthened glass sheet to the first face of the metal sheet. In further examples, methods of manufacturing a laminated structure comprise the steps of laminating with a metal sheet and a first chemically strengthened glass sheet together with an interlayer.

Abstract: A glass laminate includes at least one chemically-strengthened glass sheets with a thickness not exceeding 2.0 mm and a polymer interlayer between the glass sheets. Flaws are created in the surface of one of the glass sheets in order to weaken the glass laminate upon an impact event on a first side of the laminate, while retaining the strength of the laminate upon impact on the opposing second side of the laminate. The opposing side of the glass sheet with the flaws or a surface of the other glass sheet may be strengthened with an acid etch treatment in order to further strengthen the laminate upon impact on the opposing second side of the laminate.

Abstract: Methods of manufacturing a glass pane comprise the steps of providing a glass sheet with a thickness of less than about 1.6 mm between a first major surface and a second major surface of the glass sheet. The methods include scoring the first major surface of the glass sheet to provide a boundary score line and a relief score line. In some examples, the method provides a relief score depth that is greater than a boundary score depth. In another example, the method includes the step of placing the glass sheet on a conveyor belt including a Shore A hardness of greater than or equal to 70. In further examples, methods of breaking a glass sheet with an oversized template are provided.

Abstract: Disclosed herein are laminated structures comprising a metal sheet including a first face and a second face with a thickness of from about 0.5 mm to about 2 mm extending between the first face and the second face. The laminated structure further includes a first chemically strengthened or non-chemically strengthened glass sheet including a thickness of less than or equal to about 2 mm and a first interlayer attaching the first glass sheet to the first face of the metal sheet. Also disclosed herein are methods of manufacturing a laminated structure comprising the steps of laminating a metal sheet and a first glass sheet together with an interlayer.

Abstract: Laminated structures include a thin glass sheet with a thickness of less than 600 ?m being attached to a metal sheet with an adhesive layer including a thickness of about 100 ?m or less. These laminated structures can include planar or curved shapes. Methods of manufacturing a laminated structure are also provided including the step of attaching a glass sheet with a thickness of less than 600 ?m to a metal sheet with an adhesive layer including a thickness of about 300 ?m or less.

Abstract: Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to dice the material sheet when suspended.

Abstract: Methods and apparatus for processing edge portions of a donor semiconductor wafer include controlling chemical mechanical polishing parameters to achieve chamfering of the edges of the donor semiconductor wafer; and alternatively or additionally flexing the donor semiconductor wafer to present a concave configuration, where edge portions thereof are pronounced as compared to a central surface area thereof, such that the pronounced edge portions of the donor semiconductor wafer are preferentially polished against a polishing surface in order to achieve the chamfering.

Abstract: Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to cut the material sheet when suspended.

Abstract: Methods and apparatus for processing edge portions of a donor semiconductor wafer include controlling chemical mechanical polishing parameters to achieve chamfering of the edges of the donor semiconductor wafer; and alternatively or additionally flexing the donor semiconductor wafer to present a concave configuration, where edge portions thereof are pronounced as compared to a central surface area thereof, such that the pronounced edge portions of the donor semiconductor wafer are preferentially polished against a polishing surface in order to achieve the chamfering.

Abstract: Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to dice the material sheet when suspended.