Patents by Inventor Chunhui DOU

Chunhui DOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220074065
    Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
    Type: Application
    Filed: November 18, 2021
    Publication date: March 10, 2022
    Inventors: Junitsu Yamakawa, Chunhui Dou, Risa Kimura, Toshio Yokoyama
  • Publication number: 20220074064
    Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
    Type: Application
    Filed: November 18, 2021
    Publication date: March 10, 2022
    Inventors: Junitsu Yamakawa, Chunhui Dou, Risa Kimura, Toshio Yokoyama
  • Patent number: 11230780
    Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: January 25, 2022
    Assignee: EBARA CORPORATION
    Inventors: Junitsu Yamakawa, Chunhui Dou, Risa Kimura, Toshio Yokoyama
  • Publication number: 20210180202
    Abstract: The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
    Type: Application
    Filed: July 30, 2019
    Publication date: June 17, 2021
    Inventors: Junitsu Yamakawa, Chunhui Dou, Risa Kimura, Toshio Yokoyama
  • Publication number: 20170226656
    Abstract: An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 10, 2017
    Inventors: Chunhui DOU, Yoshitaka MUKAIYAMA, Yuji ARAKI, Masashi SHIMOYAMA, Jumpei FUJIKATA