Patents by Inventor Chun-I Kao

Chun-I Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect structures including a fin structure and a metal cap
    Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Contact sensor and method for making the same
    Patent number: 7238897
    Abstract: A contact sensor includes a base, a wall device securely attached to the top face of the base and having a hole defined in the wall device to correspond to the top contacts so as to allow the top contacts of the base to be exposed and a chip receiving space defined to communicate with the hole, a sensing chip received in the chip receiving space and having a sensing area formed on top of the sensing chip and contacts formed thereon to electrically connect to the top contacts of the base and a cover received in the hole to enclose the contacts of the sensing chip and the top contacts of the base yet still allowing the sensing area exposed for application.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: July 3, 2007
    Assignee: Taiwan IC Packaging Corporation
    Inventors: Ching-Chung Tseng, Chung-Chi Yang, Hsiu-Chung Lin, Chun-I Kao, Hsiang-Hsin Kuo
  • CONTACT SENSOR AND METHOD FOR MAKING THE SAME
    Publication number: 20070125632
    Abstract: A contact sensor includes a base, a wall device securely attached to the top face of the base and having a hole defined in the wall device to correspond to the top contacts so as to allow the top contacts of the base to be exposed and a chip receiving space defined to communicate with the hole, a sensing chip received in the chip receiving space and having a sensing area formed on top of the sensing chip and contacts formed thereon to electrically connect to the top contacts of the base and a cover received in the hole to enclose the contacts of the sensing chip and the top contacts of the base yet still allowing the sensing area exposed for application.
    Type: Application
    Filed: December 7, 2005
    Publication date: June 7, 2007
    Inventors: Ching-Chung Tseng, Chung-Chi Yang, Hsiu-Chung Lin, Chun-I Kao, Hsiang-Hsin Kuo