Abstract: A manufacturing method of a display device includes forming light emitting components on a first substrate, the light emitting components include a first side and a second side, and the second side is away from the first substrate; forming a circuit layer on the first substrate and on the second side of the light emitting components; forming a first protective layer on the circuit layer and forming an insulating layer on the first protective layer; removing the first substrate after forming a second substrate on the insulating layer; forming a black matrix layer on the first side of the light emitting components, and the black matrix layer includes openings; forming light conversion layers in the openings of the black matrix layer; forming a second protective layer on the black matrix layer and the light conversion layers; and forming a third substrate on the second protective layer.

Abstract: A color conversion panel and a display device are provided. The color conversion panel includes an opaque substrate and a sapphire substrate. The opaque substrate includes a plurality of first pixel openings, a plurality of second pixel openings and a plurality of third pixel openings. The first pixel openings are filled with red quantum dot material, and the second pixel openings are filled with green quantum dot material. The sapphire substrate is on the opaque substrate. A first surface of the sapphire substrate that faces the opaque substrate has a plurality of first arc surfaces corresponding to the first pixel openings, a plurality of second arc surfaces corresponding to the second pixel openings, and a plurality of third arc surfaces corresponding to the third pixel openings.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).

Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.

Abstract: A semiconductor device includes at least one fin, a first dielectric layer and a second dielectric layer. The first dielectric layer is disposed on the at least one fin. The second dielectric layer between the at least one fin and the first dielectric layer. A thickness of the first dielectric layer on a sidewall of the at least one fin is less than a thickness of the second dielectric layer on the sidewall of the at least one fin.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: An organic light emitting diode display panel, a manufacturing method thereof, and a display device are disclosed. The organic light emitting diode display panel includes: a base substrate; a light emitting layer on the base substrate, a spectral width at 10%-15% of a maximum spectral intensity of an emission spectrum of the light emitting layer is not less than 200 nm, and a yellow-green wave band of the emission spectrum includes at least one peak located between 550 nm-562 nm.

Abstract: A communication device includes a ground metal element and an antenna element. The antenna element includes a first metal element, a second metal element, a third metal element, a first capacitive element, a second capacitive element, an inductive element, and a signal feeding source. A first connection point of the first metal element is coupled through the first capacitive element to the third metal element. A second connection point of the first metal element is coupled through the second capacitive element to the ground metal element. A third connection point of the second metal element is coupled through the inductive element to the third metal element. A shorting end of the third metal element is coupled to the ground metal element. The signal feeding source is coupled between the first metal element and the third metal element or the ground metal element.

Abstract: An organic light emitting diode display panel, a manufacturing method thereof, and a display device are disclosed. The organic light emitting diode display panel includes: a base substrate; a light emitting layer on the base substrate, a spectral width at 10%-15% of a maximum spectral intensity of an emission spectrum of the light emitting layer is not less than 200 nm, and a yellow-green wave band of the emission spectrum includes at least one peak located between 550 nm-562 nm.

Abstract: A communication device includes a ground metal element and an antenna element. The antenna element includes a first metal element, a second metal element, a third metal element, a first capacitive element, a second capacitive element, an inductive element, and a signal feeding source. A first connection point of the first metal element is coupled through the first capacitive element to the third metal element. A second connection point of the first metal element is coupled through the second capacitive element to the ground metal element. A third connection point of the second metal element is coupled through the inductive element to the third metal element. A shorting end of the third metal element is coupled to the ground metal element. The signal feeding source is coupled between the first metal element and the third metal element or the ground metal element.

Abstract: A touch display panel, a manufacturing method thereof and a touch display device are provided. The touch display panel includes: a black matrix; and a plurality of pixel units arranged in an array; the black matrix is a conductor, and includes a plurality of light-shielding conductive patterns which are insulated from each other.

Abstract: A communication device includes a ground element, a dielectric substrate, and an antenna element. The dielectric substrate is disposed adjacent to an edge of the ground element. The antenna element is disposed on the dielectric substrate. The antenna element includes a feeding metal element, a shorting metal element, a first radiation metal element, a second radiation metal element, and an inductive element. The feeding metal element has a feeding point. The shorting metal element is coupled to the ground element. The first radiation metal element is coupled to the shorting metal element, and is disposed adjacent to the feeding metal element. The second radiation metal element is coupled through the inductive element to the feeding metal element. The second radiation metal element is further coupled to the ground element.

Abstract: A communication device includes a ground element, a dielectric substrate, and an antenna element. The dielectric substrate is disposed adjacent to an edge of the ground element. The antenna element is disposed on the dielectric substrate. The antenna element includes a feeding metal element, a shorting metal element, a first radiation metal element, a second radiation metal element, and an inductive element. The feeding metal element has a feeding point. The shorting metal element is coupled to the ground element. The first radiation metal element is coupled to the shorting metal element, and is disposed adjacent to the feeding metal element. The second radiation metal element is coupled through the inductive element to the feeding metal element. The second radiation metal element is further coupled to the ground element.

Abstract: A communications device includes a system ground plane, a signal source, a device frame, a magnetic conductive material and an antenna. The signal source is electrically coupled to the system ground plane. The device frame is perpendicular to the system ground plane. The antenna is electrically coupled to the signal source and is disposed on the device frame. The magnetic conductive material is disposed adjacent to the antenna but spaced apart by a first predetermined distance from the antenna. The magnetic line of force induced by the antenna is directed in a predetermined direction by the magnetic conductive material.

Abstract: A touch display panel, a manufacturing method thereof and a touch display device are provided. The touch display panel includes: a black matrix; and a plurality of pixel units arranged in an array; the black matrix is a conductor, and includes a plurality of light-shielding conductive patterns which are insulated from each other.

Abstract: A communications device includes a ground plane, a signal source, a filling material and an antenna. The signal source is electrically connected to the ground plane. The antenna has a predetermined metal pattern and is coupled to the signal source. The filling material is a non-conductive material and the filling material and the predetermined metal pattern are bonded heterogeneously via a surface-mount technology.

Abstract: A dual-band antenna structure includes a ground plane, a signal source, a coupling gap, a first feeding arm, a second feeding arm, a first radiation arm, and a second radiation arm. The first and second feeding arms are electrically coupled to the signal source. The first radiation arm has a first open end and a first grounding point. The second radiation arm has a second open end and a second grounding point. The first and second open ends are opposite each other. The first and second grounding points are electrically connected to the ground plane.

Abstract: A communications device includes a system ground plane, a signal source, a device frame, a magnetic conductive material and an antenna. The signal source is electrically coupled to the system ground plane. The device frame is perpendicular to the system ground plane. The antenna is electrically coupled to the signal source and is disposed on the device frame. The magnetic conductive material is disposed adjacent to the antenna but spaced apart by a first predetermined distance from the antenna. The magnetic line of force induced by the antenna is directed in a predetermined direction by the magnetic conductive material.

Abstract: A communications device includes a ground plane, a signal source, a filling material and an antenna. The signal source is electrically connected to the ground plane. The antenna has a predetermined metal pattern and is coupled to the signal source. The filling material is a non-conductive material and the filling material and the predetermined metal pattern are bonded heterogeneously via a surface-mount technology.