Abstract: A light emitting display panel includes a cover plate and a substrate disposed opposite to each other; a plurality of light emitting devices located between the cover plate and the substrate; and a packaging structure surrounding the plurality of light emitting devices. The packaging structure includes at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, each of the protruded frames having four sides which are looped and the at least three rows of protruded frames being adjacent to and embedded into each other in an outward direction. The packaging structure further includes a third packaging material which is located between the cover plate and the substrate, and located outside the outermost one of the at least three rows of protruded frames and inside the innermost one of the at least three rows of protruded frames.

Abstract: The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.

Abstract: Embodiments of the present disclosure relates to a display panel and a method of manufacturing the same, and a display device. The display panel comprises: a first substrate and a second substrate, at least one of which is provided with a first sealant, a second sealant and a third sealant; the first sealant is arranged at an outer side of the package region away from the display region, the second sealant is arranged inside the first sealant and at least within a peripheral region at a corner of the display region, and the third sealant is arranged inside the first sealant and fills the package region and the display region except parts thereof where the first sealant and the second sealant are arranged.

Abstract: The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.

Abstract: A light emitting display panel includes a cover plate and a substrate disposed opposite to each other; a plurality of light emitting devices located between the cover plate and the substrate; and a packaging structure surrounding the plurality of light emitting devices. The packaging structure includes at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, each of the protruded frames having four sides which are looped and the at least three rows of protruded frames being adjacent to and embedded into each other in an outward direction. The packaging structure further includes a third packaging material which is located between the cover plate and the substrate, and located outside the outermost one of the at least three rows of protruded frames and inside the innermost one of the at least three rows of protruded frames.

Abstract: Embodiments of the invention disclose a light emitting display panel. The light emitting display panel comprises a cover plate, a substrate disposed opposite to each other, a plurality of light emitting devices located between the cover plate and the substrate, and a packaging structure surrounding the light emitting devices. The packaging structure comprises at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, wherein four sides of each of the protruded frames are looped and the at least three rows of protruded frames are adjacent to and embedded in each other in an outward direction. Adjacent ones of the at least three rows of protruded frames are alternately disposed on the cover plate and the substrate and protrude in opposite directions, and non-adjacent ones of the at least three rows of protruded frames are disposed on the same one of the cover plate and the substrate and protrude in the same direction.

Abstract: The present disclosure relates to a display panel and a method of manufacturing the same, and a display device. The display panel comprises: a first substrate and a second substrate, at least one of which is provided with a first sealant, a second sealant and a third sealant; the first sealant is arranged at an outer side of the package region away from the display region, the second sealant is arranged inside the first sealant and at least within a peripheral region at a corner of the display region, and the third sealant is arranged inside the first sealant and fills the package region and the display region except parts thereof where the first sealant and the second sealant are arranged.

Abstract: Embodiments of the invention disclose a light emitting display panel. The light emitting display panel comprises a cover plate, a substrate disposed opposite to each other, a plurality of light emitting devices located between the cover plate and the substrate, and a packaging structure surrounding the light emitting devices. The packaging structure comprises at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, wherein four sides of each of the protruded frames are looped and the at least three rows of protruded frames are adjacent to and embedded in each other in an inward and outward direction. Adjacent ones of the at least three rows of protruded frames are alternately disposed on the cover plate and the substrate and protrude in opposite directions, and non-adjacent ones of the at least three rows of protruded frames are disposed on the same one of the cover plate and the substrate and protrude in the same direction.

Abstract: An organic electroluminescent apparatus including a substrate, an organic light-emitting device layer, a patterned structure layer and an encapsulation film is provided. The substrate has a light-emitting region and a non-light-emitting region. The organic light-emitting device layer is disposed on the substrate in the light-emitting region. The patterned structure layer is disposed on the substrate in the non-light-emitting region. The encapsulation film is disposed on the substrate and covers the organic light-emitting device layer and the patterned structure layer. A surface of the encapsulation film on the patterned structure layer is a concave-convex surface, and a surface of the encapsulation film on the organic light-emitting device layer is an even surface.

Abstract: An electroluminescent (EL) display panel includes a substrate, an EL display array, at least one first thin film encapsulation (TFE) layer and a first patterned stress releasing layer. The EL display array is disposed on the substrate. The first TFE layer covers the EL display array. The first patterned stress releasing layer covers the first TFE layer.

Abstract: A method of fabricating flexible display device includes providing a flexible display panel having an uneven surface, and forming at least one filling layer on the uneven surface of the flexible display panel. The filling layer includes an organic filling layer polymerized by a precursor layer, or an inorganic filling layer including nanometer-scale carbon structure.

Abstract: An electroluminescent (EL) display panel includes a substrate, an EL display array, at least one first thin film encapsulation (TFE) layer and a first patterned stress releasing layer. The EL display array is disposed on the substrate. The first TFE layer covers the EL display array. The first patterned stress releasing layer covers the first TFE layer.

Abstract: A flexible organic light emitting device includes a flexible substrate, an organic light emitting unit and a covering substrate. The organic light emitting unit includes a first electrode layer, a second electrode layer opposing the first electrode, and a light emitting layer, which is disposed between the first and second electrode layers. The covering substrate includes a base film, an insulation layer and an adhesion layer. An inner surface of the base film is facing an inner surface of the flexible substrate, and space is formed there-between. The insulation layer is disposed on the inner surface of the base film, and an adhesive force between the insulation layer and the organic light emitting unit is less than 0.1 N/cm. The adhesion layer is disposed between the insulation layer and the inner surface of the base film, covers the insulation layer and the organic light emitting unit, and fills the space.

Abstract: A method of fabricating flexible display device includes providing a flexible display panel having an uneven surface, and forming at least one filling layer on the uneven surface of the flexible display panel. The filling layer includes an organic filling layer polymerized by a precursor layer, or an inorganic filling layer including nanometer-scale carbon structure.

Abstract: A flexible organic light emitting device includes a flexible substrate, an organic light emitting unit and a covering substrate. The organic light emitting unit includes a first electrode layer, a second electrode layer opposing the first electrode, and a light emitting layer, which is disposed between the first and second electrode layers. The covering substrate includes a base film, an insulation layer and an adhesion layer. An inner surface of the base film is facing an inner surface of the flexible substrate, and space is formed there-between. The insulation layer is disposed on the inner surface of the base film, and an adhesive force between the insulation layer and the organic light emitting unit is less than 0.1 N/cm. The adhesion layer is disposed between the insulation layer and the inner surface of the base film, covers the insulation layer and the organic light emitting unit, and fills the space.