Patents by Inventor Chunlei GENG

Chunlei GENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic package for quantum computing and method for preparation
    Patent number: 12128652
    Abstract: The present disclosure provides a ceramic package for quantum computing and a method for preparation. The ceramic package for quantum computing may include a first ceramic plate, a vacuum tube, and a second ceramic plate connected sequentially from bottom to top, wherein the first ceramic plate is installed with a first light window, the second ceramic plate is installed with a second light window, the first light window and the second light window cover a signal inlet and a signal outlet of the vacuum tube, respectively; the first ceramic plate is provided with a lead wire on a side depart from the vacuum tube and configured to lead a signal into a system.
    Type: Grant
    Filed: March 11, 2024
    Date of Patent: October 29, 2024
    Assignee: HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.
    Inventors: Dong Feng, Lili Jia, Lei Yang, Chunlei Geng, Yujun Zhang
  • CERAMIC PACKAGE FOR QUANTUM COMPUTING AND METHOD FOR PREPARATION
    Publication number: 20240300219
    Abstract: The present disclosure provides a ceramic package for quantum computing and a method for preparation. The ceramic package for quantum computing may include a first ceramic plate, a vacuum tube, and a second ceramic plate connected sequentially from bottom to top, wherein the first ceramic plate is installed with a first light window, the second ceramic plate is installed with a second light window, the first light window and the second light window cover a signal inlet and a signal outlet of the vacuum tube, respectively; the first ceramic plate is provided with a lead wire on a side depart from the vacuum tube and configured to lead a signal into a system.
    Type: Application
    Filed: March 11, 2024
    Publication date: September 12, 2024
    Applicant: HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.
    Inventors: Dong FENG, Lili JIA, Lei YANG, Chunlei GENG, Yujun ZHANG